FOD Prevention in Electronics Assembly
The reliability and functionality of electronic devices can be severely affected by foreign objects and debris (FOD). To help industry eliminate FOD issues, IPC — Association Connecting Electronics Industries® has released a training video, DVD-172C, “FOD Prevention in Electronics Assembly.” The training video provides information and techniques to help eliminate FOD during electronics assembly, including hand soldering, surface mount technology and plated-through hole assembly processes and box build/wire assembly. In addition, DVD-172C explains the six steps of proper housekeeping, and covers tool control, hardware control, material handling as well as electrostatic discharge prevention.
“It’s a manufacturer’s responsibility to ensure that all assemblies are built free from FOD — not only for the economic health and reputation of a company, but also for the safety and reliability of the final products delivered to customers,” said Mark Pritchard, IPC director of media training. “Eliminating FOD requires awareness of the problem and control of its sources and this training video drives home the importance of this often overlooked and vexing problem in electronics assembly.”
Available on standard definition DVD in wide-screen format or Blu-ray in hi-definition, DVD-172C, “FOD Prevention in Electronics Assembly” can be purchased from Electronics.ca Online Store at http://www.electronics.ca/store/fod-prevention-in-electronics-assembly.html. Online video training is also available.
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