We are a privately-held company, founded in 2000, specializing in the design of 3D integrated circuits. Since 2001, working with DARPA-sponsored research programs, we have developed a unique set of EDA tools for 3D integrated circuit design and analysis.

Phone: 781.276.7800

Category: Component Manufacturers / Semiconductor Manufacturing

Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Plan Optik wafers provide high-precision surfaces in the angstrom range which are achieved through the use of the company's own specially developed MDF polishing process. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations.

Phone: +49 (0)2664 5068-

Category: Component Manufacturers / Semiconductor Manufacturing

OptoPAC Inc. designs and develops WLP (Wafer Level Package) for CMOS and CCD Image Sensor. OptoPAC has grown as a venture company since October 2003. OptoPAC Inc. is based on specific patent technologies and know-how in Image Sensor Package fields.

Phone: +82-43-218-7866

Category: Component Manufacturers / Semiconductor Manufacturing

For more than 30 years, Micron’s teams of dreamers, visionaries, and scientists have redefined innovation—designing and building some of the world’s most advanced memory and semiconductor technologies. We develop the technologies that transform what's possible. In fact, you likely use our memory every day—in products from computing, networking, and server applications, to mobile, embedded, consumer, automotive, and industrial designs. As one of the most prolific patent holders in the world we continually rethink, recast, and advance new ideas to bring innovation to broader markets and find ways our technology can inspire new applications or make fundamental improvements to existing designs.

Phone: 208-368-4000

Category: Component Manufacturers / Semiconductor Manufacturing

NEPES P te. Ltd. is aiming to be a global leading company in Flip Chip bumping Packaging business, established in 2005 and dedicated to provide the service to link wafer foundries and backend packaging companies in Singapore. As a major shareholder , NEPES Corp. who is established in 1990 and sole flip chip packaging foundry in Korea has transferred whole technology and know-how related to flip chip since it started semi-conductor business in 2000.

Phone: +65 6412 8181

Category: Component Manufacturers / Semiconductor Manufacturing

NEXX Systems, Inc. is a semiconductor equipment company. In contrast to other semiconductor equipment companies, NEXX products are designed expressly for wafer level packaging processing and address the demanding economic and process flexibility requirements of the semiconductor packaging industry. The Company has two product lines: Stratus, an electrodeposition system offering breakthrough technology that combines the process advantages of vertical wafer orientation with the economic advantages of parallel processing; and Apollo and Nimbus, sputter deposition systems designed to provide high throughput and productivity, with low consumables cost.

Phone: 1 978.932.2000

Category: Component Manufacturers / Semiconductor Manufacturing

MicroChem Corp. (MCC) develops, manufactures, sells, and supports specialty niche chemicals for semiconductor/IC, thin film head, and other electronic manufacturing applications. The primary focus is photosensitive materials, such as photoresists, and other ancillary products. MCC technology consists of proprietary and non-proprietary products requiring state-of-the-art technical expertise, high reproducibility, high product cleanliness, and specialty microfiltration.

Phone: 617-965-5511

Category: Component Manufacturers / Semiconductor Manufacturing

Our products are largely used in MEMS technology, in the semiconductor industry, in optoelectronics, patterned media fabrication, and in nanotechnology. Besides, mrt has distribution contracts for European countries with DOW Electronic Materials (USA), MicroChem Corp. (USA), and DuPont (USA). mrt's customer services range from lithographic patterning of customers’ substrates to the on-site introduction of its products into production.

Phone: +49 30 65 76 21 92

Category: Component Manufacturers / Semiconductor Manufacturing

JCAP Corp. (Jiangyin Changdian Advanced Packaging Co., Ltd) was founded in August 2003 which located in Jiangyin City, Jiangsu Province, China, about 2.5 hours from Shanghai Pudong Airport by driving. What we focused on is Wafer Level Chip Scale Package (WLCSP), which is widely used in mobile phone, note book, computer, camera, mp3, mp4, PSP, watch, etc., as the function of audio amplifier, analog switch, EMA, EMI, driver, DC/DC, etc. We JCAP has very experienced & innovated sales, PE, QA teams which provide you consultation and services, what's more, as the unique WLCSP company in mainland China currently, we can support turnkey servers which includes bumping, probing and assembly.

Phone: 86-510-86851713

Category: Component Manufacturers / Semiconductor Manufacturing

Building on the foundation of accumulated technology that we have cultivated over the years, we go a step further, establishing brand new technology unique to IBIDEN, further progressing our high value add. At IBIDEN, this philosophy is called "IBI-TECHNO". IBIDEN boasts a history of more than 90 years, and throughout this time the company has continued to amalgamate and fuse our unique technologies, expanding into the fields of electrochemistry, residential housing materials, ceramics and electronics. As a technical developer, we have continued to grow whilst always providing the market place with advanced technologies. The history of IBIDEN is also a history of challenging the boundaries of technological development.

Category: Component Manufacturers / Semiconductor Manufacturing