BE Semiconductor Industries N.V. is a leading manufacturer of die attach, packaging and plating equipment to the semiconductor industry. We design and manufacture technologically advanced, high-performance equipment and integrated systems for the semicond
Listing in this category: Semiconductor Machinery Manufacturing
INFICON is a leading developer, manufacturer and supplier of innovative instrumentation, critical sensor technologies, and advanced process control software for the semiconductor and vacuum-coating industries and other industrial applications. These analysis, measurement and control products are vital to original equipment manufacturers (OEMs) and end-users in the complex manufacturing of semiconductors, flat panel displays, magnetic and optical storage media and precision optics. INFICON also provides essential instrumentation for gas leak detection to the air conditioning/refrigeration industries and toxic chemical analysis for emergency response and security markets.
Kulicke & Soffa (Nasdaq: KLIC) is the world's leading supplier of wire bonding equipment in the semiconductor assembly market. K&S is the only equipment supplier that also develops and manufactures the products that touch a semiconductor chip's wire bondi
The company focuses on the supply of communications and weather systems. It is represented by a network of qualified dealers throughout the world. Morcom International is headquartered in Chantilly Virginia.
DCA Instruments is a company specialising in the design and manufacture of Molecular Beam Epitaxy (MBE) and UHV thin film deposition systems and components. DCA is a Finnish company located in Turku, in the southwest corner of Finland. Since the company was founded in 1989, DCA has installed more than 100 UHV systems around the world.
Microwave Bonding Instruments, Incorporated (MBI) is a microchip assembly and packaging technology designer and equipment manufacturer. MBI offers integrated circuit (IC) manufacturers and micro-electro-mechanical systems (MEMS) designers a patented technology to hermetically stack microelectronic and optical components and increase the number of electrical interconnects. This will significantly increase device functionality, while reducing the size of the chips. MBI currently has three ongoing government R&D contracts for applications in next generation packaging. Present and previous commercial customer applications include inkjet packaging, optical component integration, and fuel cell prototype packaging.