Electronic Manufacturing

Cloud computing figures prominently in this latest edition of the roadmap, and has the potential to create the most significant paradigm shifts, bringing about major changes to business models in the next four to five years. Similarly, the increased use of MEMS and sensors in a growing number of applications (cell phones, medical electronics, automotive) has repercussions across multiple product sectors. Concerns about sustainability are still at the forefront while companies continue to grapple with the lack of industry-wide assessment methodologies to evaluate alternative materials and the need for data to assess and quantify environmental impact of products in a consistent way. Faster rates of change in miniaturization, driven by the explosion of smart phones, tablets and other mobile devices, are resulting in increased use of complex, 3D assemblies and solutions, such as system-in-package (SiP). These solutions, however, come with their own sets of challenges. Lack of test access, pick and place of 3D thin chips or bare 3D stacked chips with irregular shapes, rework processes and heat sink attachment all become more difficult.

The iNEMI Roadmap is recognized within the electronics manufacturing industry as an important tool for defining the "state of the art" in the electronics industry and for identifying emerging and disruptive technologies. The roadmap also pinpoints critical technology gaps and areas where R&D efforts should be focused. Companies, government agencies and universities often use the roadmap to help prioritize their investments in R&D and technology deployment.

Electronic medical device manufacturers are under constant pressure to deliver innovative products on time and within budget, while contending with rapidly changing technologies, increasing product complexity and strict compliance and safety standards across a global marketplace. To help address these challenges, IPC — Association Connecting Electronics Industries® will host a one-and-a-half day conference, “Innovations in Electronics in Manufacturing for Medical Devices,” June 12–13 in Minneapolis, Minn.

The global market for flexible devices manufactured by roll-to-roll (R2R) technologies increased from $8.5 billion in 2010 to nearly $10 billion in 2011, and was valued at nearly $10.8 billion in 2012, growing at a compound annual growth rate (CAGR) of 12.3% during the two-year period. Circuit devices currently account for a nearly 96.9% share of all revenues in 2012. Sales within this segment are primarily associated with flexible printed circuits. Displays and other optoelectronic devices account for a 2.5% share of the R2R flexible devices market, with total 2012 revenues of $264 million, while solar cells, sensors, and other emerging applications currently represent a combined share of only 0.7% of the total. The diffusion of R2R technologies is expected to have a marked effect in lowering the unit prices of these devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately. As a result, the total market for R2R flexible devices is forecast to grow at a CAGR of 16.1% from 2012 to 2017, reaching global revenues of nearly $22.7 billion by 2017.

According to a new study,  the global market for thermal interface materials (TIMs) was worth nearly $426 million in 2011 and $458 million in 2012. The market is expected to grow to $762 million in 2017 at a compound annual growth rate (CAGR) of 10.7% between 2012 and 2017. Computers made up the largest end-use segment for thermal interface materials in 2011, with global sales of $145.4 million. Medical and office equipment composed the second-largest segment, followed by industrial and military equipment ,and telecommunications. Computers and especially medical and office equipment should gain market share over the next five years, whereas telecoms and industrial and military equipment are expected to see decreases in their shares. The Asia-Pacific region (excluding Japan) is the largest and fastest-growing TIM market, earning more than $251 million in 2011 and establishing a CAGR of 12.3% between 2012 and 2017. The 2011 U.S., EU, and Japanese markets were roughly similar in size, and have comparable projected annual growth rates (in the 7.5%-8.3% range) over the next five years.

Latin America presents a number of market opportunities, but it also poses many challenges. An IPC report provides plenty of data for those considering this emerging market. Sluggish global economies have prompted many companies to explore the tradeoffs associated with expanding into emerging nations. Over the last few years, that search has led many companies throughout the electronics industry supply chain to explore the risks and rewards of entering Latin America.
Finding the data that helps executives understand a region's benefits and problem areas is an important step, but it's also a time-consuming task. A new IPC report on Latin America provides a wealth of data for those who view Latin America as a potential market opportunity.

While North American manufacturing begins another slow recovery and leading indicators point to modest business expansion in the coming months, the PCB industry has not yet felt the effects of this turnaround, according to the latest edition of IPC North American PCB Market Report. The report, published this week, shows what market segments underlie the disappointing 10 percent contraction in February PCB sales versus February of last year. The flexible circuit segment was particularly hard hit in February after a strong start to the year in January.  Monthly data can be very volatile, especially in the flexible circuit segment of the PCB industry.

Quantum dots will cascade into the marketplace. They offer lower cost, longer life, and brighter lighting.  The commercialization of quantum dots using kilogram quantity mass production is a game-changer. High quality, high quantity and lowest price quantum dots increase product quality in every industry. The rate of change means speeded products cycles are evolving. Once manufacturers learn to integrate higher efficiency luminescent quantum dots into their products, each vendor will need to follow or dramatically lose market share. This level of change brought by quantum dot and quantum dot displays (QLED) represents a new paradigm that will create new industries, products and jobs in science and industry. The list of possible quantum dot applications is ever expanding. New applications are waiting for the availability of more evolved quantum dots. Quantum Dot LED (QLED) commercial focus has remained on key optical applications: Optical component lasers are emerging as a significant market. LED backlighting for LCD displays, LED general lighting, and solar power quantum dots are beginning to reach the market. Vendors continue to evaluate other applications.

Industry roadmaps predict the future in many ways, beginning with an in-depth analysis of the technologies used in their industry. They can also herald shifts in the way that an industry is meeting its challenges. The 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that's occurring throughout the electronics industry: there's more cooperation and information sharing. As technologies get more complex, it's critical to have information on all aspects that impact a technology, from initial design to manufacturing processes and products. IPC is meeting this challenge by working closely with iNEMI, among others, helping in some research projects and gleaning data from areas that are at the core of iNEMI's roadmapping efforts. The IPC roadmap also utilizes information from the International Technology Roadmap for Semiconductors, as well as from the Japan Printed Circuit Association (JPCA).

Total North American PCB shipments were down 1.1 percent in January 2013 from January 2012, and bookings decreased 4.0 percent year over year. Month-to-month growth rates are not available in January due to the change in IPC's survey sample as of the first of the year. The book-to-bill ratio for the North American PCB industry crossed into positive territory in January and stands at 1.01. The information in IPC's monthly PCB industry statistics is based on data provided by a representative sample of both rigid and flexible PCB manufacturers in the USA and Canada.