Microelectronics

According to a new technical market research report, MICROELECTROMECHANICAL SYSTEMS (MEMS) TECHNOLOGY: CURRENT AND FUTURE MARKETS, the value of the global market for microelectromechanical systems is an estimated $7.6 billion in 2009, but is expected to increase to $13.2 billion in 2014, for a 5-year compound annual growth rate (CAGR) of 11.8%.

Wafer Level Packaging is a confirmed high growth trend in the semiconductor packaging industry. Wafer Level Chip Scale Packaging (WLCSP), or the direct bonding of bumped integrated circuits (IC’s) on printed circuit boards (PCB’s) as one of the most visible expressions of WLP, is undoubtedly the fastest growing package type in the whole industry. The research forecasts that it will exceed 10 billion units per year by 2012, at a compound annual growth rate of more than 20% over the next 5 years.