Press Releases
The latest edition of World Fab Forecast reveals that Fab spending, which includes construction and equipping Front-End Facilities, from R&Ds to volume fabs, is expected to increase to over $30B, about 88 percent growth year-over-year.
The battle has begun and makers of micro inverters are waging a war against makers of distributed dc-dc converters for control of the power conversion market for photovoltaic (PV) systems. The emergence of disruptive power architectures including micro inverters and dc-dc converters will be one of the most important trends in the PV market in the near-term. The stakes are high, literally hundreds of millions, or even billions, of dollars.
How clean is clean when it comes to printed circuit boards and assemblies? While John Perry, IPC technical project manager, can enumerate a litany of complex variables that come into play with an answer to that question, a new cleaning standard, IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards, defines the recommended requirements for the cleanliness of unpopulated single, double-sided and multilayer printed boards.
According to a new technical market research report, MICROELECTROMECHANICAL SYSTEMS (MEMS) TECHNOLOGY: CURRENT AND FUTURE MARKETS, the value of the global market for microelectromechanical systems is an estimated $7.6 billion in 2009, but is expected to increase to $13.2 billion in 2014, for a 5-year compound annual growth rate (CAGR) of 11.8%.
Worldwide PC microprocessor shipments in the fourth calendar quarter of 2009 (4Q09) rose modestly, compared to 3Q09, but still achieved all-time record levels for a single quarter, according to the latest PC processor study. Notably, when compared to 4Q08, shipments in 4Q09 rose 31.3%. For the full year 2009, total PC processor unit shipments grew 2.5%, while revenue declined 7.1% to $28.6 billion.
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Market Research Reports - New Publications
Machine-to-Machine and RFID
Machine-to-Machine (M2M) communications and Radio Frequency ID (RFID) together represent a means of direct communication between connection hardware and the object that needs monitoring: the information about its status of performance is directly sent to a computer system without the need for human intervention. This makes automation of processes or consumer action possible.
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The 2010 IC Packaging report describes the packaging market with key player profiles, the packaging materials market, package types and selection criteria, the packaging process, packaging technology trends, packaging costs and how to select and manage a packaging foundry.
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Automotive Sensor Technologies: Global Markets
Today’s automobiles have become highly complex. Sophisticated electronic control systems and the majority of innovations have been achieved through electronics and the use of advanced sensors. A range of technologies has been used over the past 20 years, including silicon micro-engineering, thick film, capacitive, variable reluctance, optical and radar. As the electronic content in vehicles increases, demand for automotive sensor applications will continue to grow unabated. While certain types of sensor have long been featured inside vehicles, such as oil pressure, coolant temperature, vehicle speed and fuel level sensors, new applications are emerging, particularly in the emissions and safety-related areas.
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Worldwide x86 PC Core Logic Chipset Vendor Shares
This update provides the worldwide market and vendor share results for x86 PC core logic vendors, unit share, revenue share, integrated graphics controller, discrete graphics controller, supporting an Intel microprocessor, AMD microprocessor and VIA microprocessor. The accompanying Excel spreadsheet data file includes the results of quarterly x86 PC core logic chipset studies from 1Q07 to 4Q09 in a pivot table format.
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Silicon Reclaim Wafer Characterization Summary
This analysis covers the 2009 silicon wafer reclaim for the semiconductor market and provides a forecast to 2011. Reclaim is defined as the removal of several microns of the silicon wafer and subsequent re-polishing of the wafer surface. Seven regions of the world are covered in this report including North America, Japan, Europe, Korea, Taiwan, China, and Rest of World (ROW). All market size estimates reflect U.S. dollars at current exchange rates. Market estimates for reclaim wafers include semiconductor applications including equipment and IC manufacturing markets.
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