October 31, 2014

Tablet & Smart Phone Semiconductor Revenue and Shipment Forecast

Leading suppliers of high end smartphones include Samsung, Apple, Huawei, and LG. New research estimates that over $35 billion of 2013 worldwide semiconductor revenue was contributed to sales of products used in this high volume application.  In 2013 close to a billion smartphones were shipped worldwide and this market is expected to continue to grow at a compound annual growth rate of 19 percent over the next five years. Read More

New Electronics Assembly Standards IPC J-STD-001F and IPC-A-610F Revisions Cover More Advanced Technologies

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies

 IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards,  IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610 Acceptability of Electronics Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria for P-style and solder-charged Butt/I SMT terminations, a change to void criteria for BGAs, and enhancements to the language within the documents to provide ease of use and clarity. New photos facilitate further understanding.

The revision process involved dedicated volunteers from electronics companies in the Americas, Europe and Asia. With the mantra, “in data we trust,” IPC committee members focused major changes in areas such as the shrinking sizes of plastic packages that affect solder touching component bodies.

Dispelling past concerns that solder could not touch plastic components for fear of future failure, Teresa Rowe, IPC director of assembly technology, said “We [committee] didn’t find significant occurrences of failures when solder touched the plastic bodies.” Rowe explains that there was much discussion on this topic and expects that as research in this area continues, the committee will consider it in future revisions.

The chapter on conformal coatings also underwent significant changes. “We revised the way we look at conformal coatings, providing new information on coating thickness,” Rowe said. “We also looked at bubbles, voids and transparency, expanding our criterion for acceptance.”

The standards also cover Class 2 plated-through hole vertical solder fill requirements and Class 2 flux activity criteria.

IPC A-610

IPC A-610

Often used as companion documents, IPC J-STD-001F and IPC-A-610F each has a unique purpose. Whereas IPC J-STD-001 is a material and process requirements document and is critical for use during manufacturing, IPC-A-610 is a post-assembly acceptance standard.

Translations of the F revisions and training programs based on the revised standards will be released in the coming months. For more information on IPC J-STD-001F, visit www.ipc.org/001; for more information on IPC-A-610F, visitwww.ipc.org/610

Details of the new IPC J-STD-001F and IPC-A-610F standards, table of contents and ordering information can be found on Electronics.ca Publications’ web site: IPC J-STD-001F and IPC-A-610F.

Intelligent Systems Market Continues to Disrupt Traditional Industries Including Manufacturing, Energy, and Transportation

Intelligent Systems to Exceed $1 Trillion in 2019 as the Market Continues to Disrupt Traditional Industries Including Manufacturing, Energy, and Transportation

IDC study forecasts that the Intelligent Systems market will ship over two billion systems in 2019; with the Industrial, Transportation, Smart Home, and Energy segments growing fastest.

The deployment of billions of advanced systems across major industries over the next five years will be critical to enabling the vision around intelligent systems, according to a new International Data Corporation (IDC) study, Worldwide Embedded and Intelligent Systems 2014–2018 Forecast and Analysis.

The market for intelligent systems—defined by microprocessors, connectivity, and high-level operating systems/UI in systems excluding PCs, phones, servers, and tablets—will grow from 1.4 billion units and $755 billion in revenue this year to over 2.2 billion units and over $1 trillion in revenue by 2019, according to the  report.

Intelligent systems continue to play a critical role in disrupting traditional industries as connectivity, sensors, and HW SW intelligence enables the ability to drive more value for applications and data. The value chain for the embedded market is broad and fragmented across a large set of industries that span decades of development and commercialization. Solving business-specific challenges across each industry with technology and data integration will ultimately dictate the cadence of adoption and help crystallize the opportunity over the next five years.

In 2019, intelligent systems will represent over one fourth of a total available market (TAM) of more than 8.5 billion systems in the combined intelligent and embedded systems market. Among the top-growing segments are driver management and fuel management systems in the transportation sector, smart wearables and smart home lighting systems in the consumer sector, digital pathology and virtual metrology systems in the healthcare sector, and industry-specific gateway products in the industrial sector.

For this forecast update,  expanded the embedded and intelligent systems and microprocessor coverage to include 263 system segments, in areas such as energy, smart building, smart home, transportation, and wearables to provide more insight on the technology adoption of each market.

Worldwide Embedded and Intelligent Systems 2014-2019 Market Update , sizes and forecasts the traditional embedded systems and intelligent systems and microprocessor markets segmented across a broad set of industries and over 250 system categories. The study also provides the context of Intelligent Systems within the broader vision of the Internet of Things (IoT).

Optical Transceivers Markets to Reach $9.9 Billion by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Transceivers: Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020″. The global optical transceivers markets at $3.2 billion in 2013 is anticipated to grow to $9.9 billion by 2020 driven by the availability and cost effectiveness of 40 Gbps, 100 Gbps, and 400 Gbps devices. Next generation devices use less power, are less expensive, and are smaller. The adoption of widespread use of the 100 Gbps devices, and the vast increases in Internet traffic are core to change in the communications infrastructure markets. The vendors in the optical transceivers industry have to invest in high-quality technology and processes. The development of innovative products is essential to keeping and growing market share. Read More

DRAM, China, and Leading-Edge Foundry Driving IC Industry in 2014

The McClean Report offers a broad look at the integrated circuit industry. The original 490-page study (monthly updates provide approximately 500 more pages of information) is separated into 16 sections. About 400 tables, graphs, and illustrations in the original report clearly describe various market dynamics (another 400 tables, graphs, and illustrations are included in the monthly updates).

Besides covering worldwide IC market conditions and economic issues, there are chapters dedicated to each of the major IC product segments. Likewise, trends pertaining to capital spending and fab capacity, as well as technology developments and packaging, can be found in other sections of the report.

Links to summaries of each section in the report are provided below.


Section 1. Executive Summary

The executive summary serves as an introduction to The McClean Report. It highlights the major issues that are detailed in the report to give the reader an idea for what to expect in the sections that follow.

Section 2. Global IC Industry Outlook and Cycles

Electronic Industry Interdependence. This section starts by examining the relationship between the electronic systems market and the IC market, as well as how the IC market depends on the health of two smaller but important segments—the semiconductor equipment market and the semiconductor materials market.

Global IC Industry Outlook and Cycles

Global IC Industry Outlook and Cycles

Global Economics. The world and regional GDP environments are discussed and compared to the semiconductor market environment. In addition, regional electronic systems production statistics are provided and the effects of currency exchange rates on the electronic systems and semiconductor markets are covered.

Global Semiconductor Market Review and ForecastAn extensive historical review and five-year forecast through 2018 of the worldwide semiconductor market is provided. The forecasts are presented in terms of dollars, unit shipments, and average selling price, as well as by region and electronic system type. Forecast assumptions are also presented.


Section 3. Leading IC Suppliers and Foundries

Who and where are the world’s leading suppliers of ICs? Find the answers in this section. The top 50 IC suppliers, top 50 semiconductor suppliers, and top 50 fabless IC suppliers are shown for 2012 and 2013.

Section 3. Leading IC Suppliers and Foundries

Leading IC Suppliers and Foundries

In addition, a significant amount of coverage is included on IC foundries and the increasingly important role they play in the IC industry.

IC industry


Section 4. Capital Spending and Capacity Trends

Capital spending and fab capacity levels are an important indicator of health in the semiconductor industry. As in many business situations, overspending leads to overcapacity, which leads to an imbalance in supply and demand. Therefore, it is useful to track spending (or production) and capacity trends in the industry.

Worldwide Capital Spending. In addition to a review and forecast of worldwide spending, rankings of the world’s biggest spenders are provided. Spending levels within each of the world’s geographic regions are compared to show which areas are most aggressive in advancing production capabilities and adding capacity. Spending by IC product type is also covered.

Capital Spending and Capacity Trends

Capital Spending and Capacity Trends

Capital Spending Cycles. While the pronounced cycles of the semiconductor market are well documented, this section shows that capital spending trends are even more volatile. Also shown is how closely changes in capital spending and IC average selling price have tracked over the past two decades.

Worldwide IC Capacity and Production. Capacity and production statistics include die-per-wafer trends, wafer start trends, capacity utilization rates, and revenue-per-wafer trends.

Worldwide IC Capacity and Production

Worldwide IC Capacity and Production


Section 5. Market Summary by Device Type

IC Market Forecaast

This section includes a detailed review and forecast (2011-2018) of each IC product category (e.g., data conversion ICs, standard cell ASICs, MPUs, DRAMs, etc.). The details include dollar volumes, unit shipments, and average selling prices. In addition, the average annual growth rates for each category are listed.

Section 6. Memory Market Overview

This section provides a brief summary of the MOS memory IC market and the various volatile and non-volatile memory products that make up the category. Trace the MOS memory market’s best and worst times over the past few years and note any cyclical patterns through 2018.

Memory Market Overview

Memory Market Overview


Section 7. Flash and Other Non-Volatile Memory

Flash and Other Non-Volatile Memory

Flash and Other Non-Volatile Memory

Non-volatile memory ICs include ROM, EPROM, EEPROM, and flash memory devices. The unifying characteristic is that they retain their stored information even after system power is removed. ROM and EPROM devices were once the backbone of the non-volatile memory market, but now take a back seat to more versatile flash memory devices. This section examines trends, reviews market, unit shipment, and average selling price data, and highlights technical advances.


Section 8. DRAMs and SRAMs

DRAMs  SRAMs market report

The DRAM market continues to be one of the most closely watched of all IC categories. Whether in discrete package form or embedded with other technology, these devices are a critical component in PCs and are found in a growing number of wireless and portable applications. This section examines the historical and forecasted markets, unit shipments, and the all-important average selling prices for both DRAM and SRAM products. DRAM price-per-bit information and DRAM architectures are reviewed.


Section 9. Microcomponent Market Overview

This section features a high-level review of microprocessors, microcontrollers, and digital signal processors, all which fall under the banner of the microcomponent market. See how each of these segments contributes to the total microcomponent market.

Microcomponent Market Overview

Microcomponent Market Overview


Section 10. Microcontrollers and Digital Signal Processors

Microcontrollers  DSP market report

Microcontrollers are among the most ubiquitous of all integrated circuits. From 4-bit to 32-bit devices, microcontrollers are used to control and monitor both simple and extremely complex functions in the home, automobile, and office. This section reviews market, unit shipment, and pricing data and provides a review of the different segments of the MCU market.

The DSP market is suffering from a loss of identity as digital signal processing functions move into application-specific standard products (ASSPs) and field-programmable gate arrays (FPGAs) fill potential DSP sockets.  IC Insights reviews the market, unit shipments, and average selling price for the DSP market.


Section 11. Microprocessors

Microcontrollers and Digital Signal Processors

From humble beginnings in 1971, microprocessors have emerged to be among the most closely followed of all IC products. Nearly everyone recognizes Intel’s dominance in the microprocessor business, but what about processors for mobile devices such as smartphones and tablet PCs?  What does Intel’s processor roadmap hold in store?  Can Intel achieve processor dominance in the market for portable handheld devices or will ARM-based processors continue to gain market momentum?  Learn IC Insights’ take on the MPU market and review our forecast of market size, unit shipments, and average selling price.

Section 12. ASIC Market Overview

The application-specific IC (ASIC) and system-on-chip (SOC) market is an important segment of the IC industry. This section offers extensive coverage of ASIC/SOC market trends. Dollar, unit shipment, and average selling price information is provided for the total ASIC market, as well as for the standard cell, gate array, and PLD sub-segments.

ASIC Market Overview

ASIC Market Overview


Section 13. Analog Market Overview

Analog Market Overview

Analog Market Overview

Analog signals can be thought of as those that represent elements and conditions experienced in the “real” world. These include factors such as light, sound, temperature, and pressure. Analog signals are a continuous representation of phenomena in terms of points along a scale. Hype and hoopla surrounding advances in the world of digital ICs often overshadows developments in the analog IC business, but as noted in this section, the analog market continues to play a steady role in the IC industry. Important market, unit shipment, and pricing data for the overall analog market and for individual segments within this market (e.g., amplifiers, interface, comparators, etc.) are provided.


Section 14. Technology Trends

The success and proliferation of the integrated circuit since its discovery in the late 1950s has been due to the ability of manufacturers to continue offering more for the money. This ability to reduce the cost of ICs per performance has been driven by the continuous and rapid development of new and improved process technologies. Section 14 covers a variety of process technology related trends, such as the advanced lithography methods needed to continue shrinking chip geometries, new interconnect schemes, strain engineering for improved performance and lower power consumption, 3D integration, novel transistor structures, and the migration to larger wafers.

Technology Trends

Technology Trends


Section 15. Packaging Trends

IC Packaging Trends

IC Packaging Trends

The assembly and packaging of ICs no longer takes a back seat to front-end processing. For most new IC products, packaging is an integral part of the chip design and production process; it is no longer just a simple, final step in the chip supply chain. As a result, accelerating demand for smaller, faster, yet less expensive products is pressing the packaging industry to keep pace with advancements in IC process technology.

This section provides an IC unit shipment forecast by package type (e.g., SO, FP/CC, BGA, wafer-level, bare die, etc.) and data showing how packages have evolved from simple cookie-cutter type packages to highly sophisticated and customized solutions. Details are provided on the ball-grid array, chip-scale package (CSP), bare die or direct-chip attach (DCA), wafer-level packaging, and multichip package (MCP) technologies, including stacked-chip packages.


Section 16. IC Economic Issues

Minimizing costs is the primary driving force in the IC manufacturing industry. Advances in technology are needed to satisfy the requirements of leading-edge electronic systems. However, when an IC producer is confronted with the choice of using the most advanced technology or keeping costs under control, the decision almost always leans toward minimizing costs. This section covers several trends relating to the cost of designing and manufacturing ICs, such as R&D costs, IC fabrication facility costs, wafer costs, defect density and yield, and packaging costs.

IC Economic Issues

IC Economic Issues

Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site: The McClean Report.