New market research report “Physical Security Market by System and Services (Access Control, IP Video Surveillance Management Software, Locks, PSIM, Perimeter Intrusion Detection, System Integration, and Designing and Consulting) – Worldwide Forecast & Analysis (2014 – 2019)” focuses on the type of systems and services that are used to provide physical security. This report also enumerates the key factors that are driving growth in this market along with restraints and new opportunities for growth.
The market for physical security has been segmented by security systems such as access controls, biometrics scanners, locks, video surveillance, and physical security information management software and security services such as system integration, support and maintenance, and designing and consulting.
In the Physical Security Market, a wide range of products and services, such as video surveillance, access control, biometrics, remote management, technical support, security consulting, are included. Biometrics holds a major share in the products range. It is expected that the access control market will continue to grow at a higher pace. The Physical Security Market will witness a good growth trend in developing economies. There will be a rise in the demand for physical security solutions and services in these regions. With an increase in terrorist attacks and sabotages on critical infrastructure zones, the spending on physical security solutions and services will increase in the coming years. Besides, an increase in market acceptance for such solutions and services will be fuelling its growth. End users or consumers are not only looking for various devices, but are also increasingly interested in tailor-made solutions and integrated packages.
The recent trend in the industry shows that the Physical Security Market is continually improving, and there is a huge demand for physical security solutions and services in almost every industry. The current services, such as remote management, security consulting, and technical support, are suitable for usage in almost every vertical. Some of the advanced products are next-generation analytics and infinite storage devices. In recent times, there has been continuous innovation in this market. Ubiquitous sensors, smarter devices, and cloud technologies are some of the emerging technologies in the Physical Security Market.
The important vendors in the market for physical security are Anixter, CSC, Cisco, EMC Corporation, HP, Honeywell International, IBM, Genetec, Lockheed Martin, and Schneider Electric. This report on the Physical Security Market provides an in-depth analysis of the key players in tools and services ecosystem with their profiles and recent developments, key issues and opportunities in the market, global adoption trends, and future growth potential.
According to this report, the Physical Security Market will grow from $57.72 billion in 2014 to $87.95 billion by 2019, at a Compound Annual Growth Rate (CAGR) of 8.8%. In terms of regions, North America (NA) and Europe are expected to be the biggest markets in terms of revenue contribution, while Asia-Pacific (APAC) is expected to surpass Europe during the forecast period. Middle East and Africa (MEA) and Latin America (LA) are also expected to experience increased market traction during the forecast period.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Physical Security Market by System and Services (Access Control, IP Video Surveillance Management Software, Locks, PSIM, Perimeter Intrusion Detection, System Integration, and Designing and Consulting) – Worldwide Forecast & Analysis (2014 – 2019).
Image sensor is a vital part of any imaging device that converts the optical information into electrical signals. In 1960s, image sensors have gone through several technological advancements due to the continuous demand in the market for higher resolution, smaller form factor and lower power consumption.
Image sensors are being widely used in consumer sector like for digital cameras, mobile phones, tablet PC camcorders and so on. Other application area for image sensor is medical diagnosis, fault detection, visual feedback to controller, surveillance, infotainment, and entertainment since decades. Technology is never constant. Earlier, analog film based sensors and phosphor plates were used. The digitization of imaging technologies resulted in emergence of technologies such as, CCD and CMOS.
Currently, automotive and security are few sector where implementation of cameras has recently increased when compared with the earlier days. Implementation of ADAS (Advanced Driver Assistance Systems) is expected to boost the demand for cameras which leads to the higher demand for image sensor. According to estimation, more than 10 cameras may be implemented in a vehicle under ADAS. Growing awareness of security has also fueled the growth of cameras with special features such as; infrared enabled camera, ability to take picture even in low light. This has helped in the growth of image sensor market.
The figure below shows the estimated growth of the image sensor market from 2013 to 2020.
The image sensor market is expected to grow at a CAGR of 8.06% from 2014 to 2020. In the report, the driver, restraints, and opportunities for the market are covered. The major driving factors are increased demand for camera enabled mobile phones, digital cameras, tablets PC, implementation of machine vision, increased adoption of ADAS (Advanced Driver Assistance Systems) systems in vehicles, increased awareness about security. High power consumption by CCD image sensor is considered as the major restraining factor in the development of market.
The players involved in the development of image sensor include Aptina Imaging Corporation (U.S.), Canon Inc. (Japan), CMOSIS (Belgium), OmniVision Technologies, Inc. (U.S.), ON Semiconductor (U.S.), Samsung Group (South Korea), Sony Corporation (Japan), STMicroelectronics N.V. (Switzerland), Teledyne DALSA (Canada), and Toshiba Corporation (Japan).
Geographically, the image sensor market is segmented into North America (the U.S., Canada, & Mexico), Europe (Germany, UK, Sweden, the Netherland, & France), APAC (China, India, & Japan), and Rest of the World (the Middle East, South America, & Africa). The APAC market accounts for the highest market size of 38.30% and is estimated to grow at a CAGR of 10.15% from 2014 to 2020. RoW (Rest of the World) is also expected to grow at a significant CAGR of 9.75% from 2014 to 2020; this is mainly due to the fact that telecommunication infrastructure is improving in these region which is then translated to higher demand for camera enabled mobile phone and thus, will boost the demand for image sensor.
Details of the new report, table of contents and ordering information can be found on Electronics.ca Publications’ web site. View the report: Image Sensor Market by Technology (CMOS, CCD), Spectrum, Array, Scanning Method, Application and by Geography – Analysis and Forecast 2013 – 2020.
Competition for Graphene: Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2-D Semiconductors
A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.Illustration of a MoS2/WS2 heterostructure with a MoS2 monolayer lying on top of a WS2 monolayer. Electrons and holes created by light are shown to separate into different layers. (Image courtesy of Feng Wang group)
An international collaboration of researchers led by a scientist with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) has reported the first experimental observation of ultrafast charge transfer in photo-excited MX2 materials. The recorded charge transfer time clocked in at under 50 femtoseconds, comparable to the fastest times recorded for organic photovoltaics.
“We’ve demonstrated, for the first time, efficient charge transfer in MX2 heterostructures through combined photoluminescence mapping and transient absorption measurements,” says Feng Wang, a condensed matter physicist with Berkeley Lab’s Materials Sciences Division and the University of California (UC) Berkeley’s Physics Department. “Having quantitatively determined charge transfer time to be less than 50 femtoseconds, our study suggests that MX2 heterostructures, with their remarkable electrical and optical properties and the rapid development of large-area synthesis, hold great promise for future photonic and optoelectronic applications.”
Wang is the corresponding author of a paper in Nature Nanotechnology describing this research. The paper is titled “Ultrafast charge transfer in atomically thin MoS2/WS2 heterostructures.” Co-authors are Xiaoping Hong, Jonghwan Kim, Su-Fei Shi, Yu Zhang, Chenhao Jin, Yinghui Sun, Sefaattin Tongay, Junqiao Wu and Yanfeng Zhang.
MX2 monolayers consist of a single layer of transition metal atoms, such as molybdenum (Mo) or tungsten (W), sandwiched between two layers of chalcogen atoms, such as sulfur (S). The resulting heterostructure is bound by the relatively weak intermolecular attraction known as the van der Waals force. These 2D semiconductors feature the same hexagonal “honeycombed” structure as graphene and superfast electrical conductance, but, unlike graphene, they have natural energy band-gaps. This facilitates their application in transistors and other electronic devices because, unlike graphene, their electrical conductance can be switched off.
“Combining different MX2 layers together allows one to control their physical properties,” says Wang, who is also an investigator with the Kavli Energy NanoSciences Institute (Kavli-ENSI). “For example, the combination of MoS2 and WS2 forms a type-II semiconductor that enables fast charge separation. The separation of photoexcited electrons and holes is essential for driving an electrical current in a photodetector or solar cell.”
In demonstrating the ultrafast charge separation capabilities of atomically thin samples of MoS2/WS2 heterostructures, Wang and his collaborators have opened up potentially rich new avenues, not only for photonics and optoelectronics, but also for photovoltaics.
“MX2 semiconductors have extremely strong optical absorption properties and compared with organic photovoltaic materials, have a crystalline structure and better electrical transport properties,” Wang says. “Factor in a femtosecond charge transfer rate and MX2 semiconductors provide an ideal way to spatially separate electrons and holes for electrical collection and utilization.”
Wang and his colleagues are studying the microscopic origins of charge transfer in MX2 heterostructures and the variation in charge transfer rates between different MX2 materials.
“We’re also interested in controlling the charge transfer process with external electrical fields as a means of utilizing MX2 heterostructures in photovoltaic devices,” Wang says.
Image: Illustration of a MoS2/WS2 heterostructure with a MoS2 monolayer lying on top of a WS2 monolayer. Electrons and holes created by light are shown to separate into different layers. (Image courtesy of Feng Wang group)
Lawrence Berkeley National Laboratory addresses the world’s most urgent scientific challenges by advancing sustainable energy, protecting human health, creating new materials, and revealing the origin and fate of the universe. Founded in 1931, Berkeley Lab’s scientific expertise has been recognized with 13 Nobel prizes. The University of California manages Berkeley Lab for the U.S. Department of Energy’s Office of Science. For more, visit www.lbl.gov. – See more at: http://newscenter.lbl.gov/2014/08/26/competition-for-graphene/#sthash.BDDE2o1L.dpuf
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IPC-8701 – First Manufacturing Acceptability Standard for Photovoltaic (Solar) Module Assemblies Debuts
IPC-8701 Acceptability specs will help provide infrastructure for solar panel assembly
Solar panels have been in volume production for quite some time, but there are still just a limited number of standards to help original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) companies determine whether completed modules meet design and assembly requirements. IPC recently published the first document to set common acceptance criteria for finished assemblies. Read More
The reliability and functionality of electronic devices can be severely affected by foreign objects and debris (FOD). To help industry eliminate FOD issues, IPC — Association Connecting Electronics Industries® has released a training video, DVD-172C, “FOD Prevention in Electronics Assembly.” The training video provides information and techniques to help eliminate FOD during electronics assembly, including hand soldering, surface mount technology and plated-through hole assembly processes and box build/wire assembly. In addition, DVD-172C explains the six steps of proper housekeeping, and covers tool control, hardware control, material handling as well as electrostatic discharge prevention.
“It’s a manufacturer’s responsibility to ensure that all assemblies are built free from FOD — not only for the economic health and reputation of a company, but also for the safety and reliability of the final products delivered to customers,” said Mark Pritchard, IPC director of media training. “Eliminating FOD requires awareness of the problem and control of its sources and this training video drives home the importance of this often overlooked and vexing problem in electronics assembly.”
Available on standard definition DVD in wide-screen format or Blu-ray in hi-definition, DVD-172C, “FOD Prevention in Electronics Assembly” can be purchased from Electronics.ca Online Store at http://www.electronics.ca/store/fod-prevention-in-electronics-assembly.html. Online video training is also available.
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