November 27, 2014

New IPC Standards For Printed Circuit Boards

NEW IPC-A-610F Acceptability of Electronic Assemblies

IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610F illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. This revision F includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. IPC Standards for printed circuit boards: order and download IPC A-610F

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document is most often used with the material and process standard IPC J-STD-001.

NEW J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Clarification of criteria descriptions for easier understanding. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. Order and  download IPC J-STD-001F

IPC-7527 Requirements for Solder Paste Printing

IPC-7527 covers the many aspects of solder paste application, from initial placement on the board through production and testing. To equipment operators, the new standard serves as a reference guide with more than 50 photos packed into the 15-page standard.  IPC-7527 provides the operators with a standard that will help them make the right decisions when they face issues in production, and no professionals or specialists are present.

While there are standards that detail what a completed assembly should look like, IPC-7527 is the first one to provide requirements for what the printed solder paste should look like and how far off centers can be before they’re considered defects. It covers everything from basic squeegees to jet dispensers and needle dispensers to closed print heads. In addition, IPC-7527 provides information on automated paste inspection using either cameras or lasers. Order and download IPC-7527.

IPC-7093 Design and Assembly Process Implementation for Bottom Termination components

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process. Order and  download IPC-7093

IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. Order and download IPC-7095C

IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. Order and download IPC-7711/7721B.

Purchase and Download IPC Standards For Printed Circuit Boards from Electronics.ca Publications today!

Effective January 1, 2015, a price increase of 4 percent will be implemented on all standards.

IPC Standards For PCB Design and CAD IPC Member

 

CMP Consumables Market Resumes Sustainable Growth

The global CMP consumables market has resumed its growth trajectory prior to the 2008-2009 recession. At over $2.0B, 2013 CMP slurry and pad revenues are up 6.0% over 2012, and 2014 is projected to be up an additional 2.2%, according to a new report  “CMP Consumables 2014 – A Critical Materials Report“.  By 2019, the combined CMP pad and slurry market is expected to grow to $2.5B for a CAGR of 3.9% over this period. Read More

IPC/WHMA-A-620B PDF Download – Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620 is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies.  IPC/WHMA-A-620 can be used as a stand-alone document for purchasing products, however it does not specify frequency of in-process inspection or frequency of end product inspection. No limit is placed on the number of process indicators or the number of allowable repair/rework of defects. Such information should be developed with a statistical process control plan (see IPC-9191). Read More

IPC Standards For PCB Design and CAD

IPC-7351B Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Order and Download IPC Standard 7351B.

IPC-2221B Generic Standard on Printed Board Design

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series and is included i the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing. Order and Download IPC Standard 2221B.

IPC-2220 Set of IPC Standards for PCB Design and CAD

The series is built around the IPC-2221B, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology. IPC-2221B and all five sectional standards are included with the series: IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223C, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements. Order and Download IPC 2220 Family of Design Documents.

 

All IPC Standards are available from Electronics.ca Publications

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DSL and G.fast Chips Markets To Reach $4.7 Billion By 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “DSL and G.fast Chips: Market Shares, Strategy, and Forecasts, Worldwide, 2014 to 2020″. The 2014 study has 319 pages, 109 tables and figures. Worldwide DSL and G.fast Chips markets are increasingly diversified, poised to achieve significant growth as broadband is used in every industry segment. Read More