IPC Standards for Laminate Materials

USD $72.00 Flexible Base Dielectrics for Use in Flexible Printed Circuitry

IPC-4202A document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible...

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USD $93.00 IPC 4101B Specification for Base Materials for Rigid and Multilayer Printed Boards Includes Amendments 1 and 2

This specification covers the requirements for base materials (laminate and prepreg) for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 specification sheets and...

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USD $93.00 IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials

IPC-4104 covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC-JPCA-4104 cover the qualification and conformance...

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USD $62.00 IPC 4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

IPC-4203 covers the requirements for adhesive coated dielectric film materials to be used for the cover sheets and flexible adhesive bonding films used in the fabrication of flexible printed circuitry and flexible flat cable...

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USD $72.00 IPC 4204A Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

This standard establishes the classification system, qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible...

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USD $52.00 IPC DD 135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

IPC-DD-135 standard includes qualification and requirements for deposited organic interlayer dielectric materials for MCM-D applications. This standard enables a vendor to evaluate dielectric materials and express...

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USD $52.00 IPC FC 234 PSA Assembly Guidelines for Single and Double Sided Flexible Printed Circuits

IPC-FC-234 suggests guidelines for the use of pressure sensitive adhesives (PSAs) in single- or double-sided flexible printed circuits, membrane switches and component attachments. Provides information on adhesive types and...

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USD $144.00 IPC-4103A Specification for Base Materials for High Speed/High Frequency Applications

This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and...

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USD $100.00 Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC-4101C specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits...

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NEW PUBLICATIONS!

IPC-4103A Specification for Base Materials for High Speed/High Frequency Applications

USD $144.00

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IPC 4204A Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

USD $72.00

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Specification for Base Materials for Rigid and Multilayer Printed Boards

USD $100.00

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IPC FC 234 PSA Assembly Guidelines for Single and Double Sided Flexible Printed Circuits

USD $52.00

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IPC DD 135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

USD $52.00

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