This report analyzes the Global market for 3D Chips (3D IC)  in US$ Million. Annual estimates and forecasts are provided for the period 2006 through 2015. The report profiles 38 companies including many key and niche players such as Amkor Technology, GlobalFoundries, Inc., Hynix Semiconductor, Inc., International Business Machines Corporation, Intel Corporation, Micron Technology, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Sony Corporation, Tezzaron Semiconductor Corporation, Toshiba Semiconductors, and Ziptronix, Inc.  Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

TABLE OF CONTENTS

3D CHIPS (3D IC) 								MCP-6575
A GLOBAL MARKET REPORT


                                            CONTENTS


  I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-3
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3


 II. EXECUTIVE SUMMARY

  1. MARKET OUTLOOK                                                     II-1
      Semiconductor Industry: An Overview                               II-1
       Chip-Making Industry Reels Under the Economic Pressure           II-1
      3D Chips: Market & Technology Overview                            II-2
       A Quick Primer                                                   II-2
        Transition from 2D Configuration to 3D IC                       II-3
        Appeal of 3D Chip Soars Among End-Use Sectors                   II-3
        Rationale Behind the Growing Popularity of 3D IC                II-3
        TSV Technology - Ensuring Success of 3D-IC Integration          II-4
        3D TSV: Technological Trends and Issues                         II-4
       Market Adoption of 3D IC Technology: Challenges                  II-5

  2. PRODUCT OVERVIEW                                                   II-6
      Semiconductor                                                     II-6
       Discrete Devices                                                 II-6
       Integrated Circuits (ICs)                                        II-6
        Analog ICs                                                      II-6
        Digital ICs                                                     II-7
      3D IC (Three-Dimensional Integrated Circuit) - An Introduction    II-7
      3D Packaging Vs 3D Ics                                            II-7
      Benefits of 3D IC                                                 II-8
      Manufacturing Technologies for 3D IC                              II-8
      Technological Challenges                                          II-9
       Manufacturing Costs                                              II-9
       Yield                                                            II-9
       Heat                                                             II-9
       Complexity of Design                                             II-9
       Lack of Clearly Defined Standards                                II-9
       Lack of Relevance Post Insertion                                 II-9
       Supply Delay                                                     II-9

  3. PRODUCT INTRODUCTIONS/LAUNCHES                                     II-10
      TierLogic Announces the Launch of 3D FPGA                         II-10
      Movidius Rolls Out 3D Chip for Smartphones                        II-10
      STMicroelectronics Unveils 3D IC Chip for Digital TV Applications II-10
      Applied Materials Launches Avila™ Technology                      II-10
      STMicroelectronics Launches 3D IC for Enhanced Audio in
       Portable Media Players                                           II-11
      BeSang Unleashes 3D IC Technology to Enable Low Cost Solutions    II-11
      Sound Design Technologies Rolls Out New 3D Chip Stacking
       Technology                                                       II-11
      Toshiba to Develop 3D NAND Flash Chip                             II-11
      NEC Develops New 3D Chip Stacked Flexible Memory for SoC          II-12
      IMEC Introduces 3D SIC Technology                                 II-12
      Aviza Technology Launches Versalis fxP                            II-12

  4. RECENT INDUSTRY ACTIVITY                                           II-14
      CEA-Leti, SPTS Ally Over Next-Gen TSV Development                 II-14
      EVG, IME Collaborate for 3D-IC Integration Technologies           II-14
      CMC, CMP, MOSIS Ally for 3D-IC Process                            II-14
      Elpida Collaborate with PTI, UMC for 3D-IC Integration
       Development                                                      II-14
      Leti, R3Logic Partner for 3D-IC Methodologies and Designs         II-15
      NEC Electronics Merges with Renesas Technology                    II-15
      Advanced Technology Investment Company Acquires Chartered
       Semiconductor Manufacturing                                      II-15
      ON Semiconductor Acquires Sound Design Technologies               II-15
      SPP Acquires Key Assets of Aviza Technology                       II-16
      IBM Partners with ETH and EPFL to Co-Develop Eco-Friendly 3D
       Microchips                                                       II-16
      S.E.T and IMEC Collaborate to Develop Processes for 3D
       Integration                                                      II-17
      Industrial Technology Research Institute Collaborates with
       Applied Materials                                                II-17
      EV Group and Applied Materials Collaborate to Develop Wafer
       Bonding Process for 3D IC                                        II-18
      Soitec Collaborates with CEA-Leti for 3D Integration              II-18
      Apple Acquires Stake in Imagination Technologies                  II-18
      Applied Materials Acquires Semitool                               II-19
      KLA- Tencor Acquires Stake in ICOS Vision Systems                 II-19
      Zoran Corporation Takes Over Let It Wave                          II-19
      SanDisk Enters into Collaboration with Toshiba for Rewriteable
       3D Chip Development                                              II-19
      BeSang Collaborates with National NanoFab Centre and Stanford
       NanoFab to Develop 3D IC                                         II-20
      Singapore forms Novel Consortium to Boost 3D Adoption             II-20
      DDD and Samsung Collaborate for Development of 3D Chips           II-21

  5. FOCUS ON SELECT PLAYERS                                            II-22
      Amkor Technology (US)                                             II-22
      GlobalFoundries, Inc. (US)                                        II-22
      Hynix Semiconductor, Inc. (South Korea)                           II-22
      International Business Machines Corporation (US)                  II-23
      Intel Corporation (US)                                            II-23
      Micron Technology, Inc. (US)                                      II-23
      Renesas Electronics Corporation (Japan)                           II-24
      Samsung Electronics Co., Ltd. (South Korea)                       II-24
      Sony Corporation (Japan)                                          II-24
      Tezzaron Semiconductor Corporation (US)                           II-25
      Toshiba Semiconductors (Japan)                                    II-25
      Ziptronix, Inc. (US)                                              II-25

  6. GLOBAL MARKET PERSPECTIVE                                          II-26
      Table 1: World Recent Past, Current & Future Analysis for 3D
      Chips (3D IC) Analyzed with Annual Sales Figures in US$
      Million for Years 2006 through 2015 (includes corresponding
      Graph/Chart)                                                      II-26


 III. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 38 (including Divisions/Subsidiaries - 40)

     ------------------------------------------
     Region/Country                     Players
     ------------------------------------------
     The United States                     16
     Canada                                 1
     Japan                                  6
     Europe                                 9
      France                                3
      The United Kingdom                    1
      Rest of Europe                        5
     Asia-Pacific (Excluding Japan)         8
     ------------------------------------------