This report contains a list of all the 3D silicon/glass interposer opportunities by application.  We analyze the key drivers, expected benefits, and the various technology options and alternatives.  In addition we will cover the 3D interposer industry players and the respective supply chain changes.

MARKET AND TECHNOLOGY TRENDS

Several concurrent factors account for the growing momentum of 3D silicon and glass interposers: the continuously increasing gap between printed circuit boards and integrated circuits, both in terms of geometries and materials, has driven research and development of new innovative semiconductor assembly and packaging solutions over the past 10 years, including System-in-Package (SiP), Package-on-package (PoP), flip-chip Ball grid Array (fc-BGA) or more recently fan-out Wafer Level Packaging. The introduction of these recent technologies fills the gap by offering finer pitch interconnections and by alleviating the external IO interface thanks to recombined interconnections inside the package. However, a growing number of industry players now claim that the gap has become so wide that a new disruptive technology, such as 3D silicon or glass interposers, is needed.

Concurrently, the so-called “mid-end infrastructure” (foundries for wafer-level packaging operations) has developed at an unprecedented pace over the past 3 years to meet the growing demand for Wafer-Level Chip-Scale Packaging (or “fan-in WLCSP”) and flip-chip. These new facilities, half way between front-end foundries and conventional assembly and packaging facilities now support high volume manufacturing on large size wafers, thus permitting economies of scale.  These players, in search of growth opportunities, have positioned as service providers for the back-end operations for the making of through silicon vias (TSV’s) and other related wafer-level assembly operations. Thanks to 3D silicon/glass interposers, they can go one step further, and actually propose products combined with their service offer.

MYTH, NICHE OR HIGH VOLUME NECESSITY?

The industry is not clear where 3D interposers will have the most impact. These new interposer technologies, based on silicon wafer technologies such as wafer-level photolithography, are introducing thinner and denser substrates which can profoundly change the semiconductor packaging and assembly ecosystem. Of course, the upfront investments can sometimes limit the technology benefits.

This report first focuses on the driver applications and the associated drivers by application. For each application, we simulate costs and compare them with projected market prices, we compare the 3D si/glass interposer solution with existing and other emerging alternatives and we derive detailed market and wafer forecasts.

Will 3D silicon/glass interposers be an intermediate step to 3D TSV’s in active IC’s, or is this a long term trend? How will the supply chain evolve to serve these emerging technologies? These are the questions we address in this first-ever dedicated report on 3D glass/silicon interposers. Despite the emerging character of the 3D silicon/glass interposer solutions and the associated uncertainties, this report brings clear answers as to which applications and uses they are likely or unlikely to support in the future, and whether these will stay niche or rather expand to high volume manufacturing.

KEY FEATURES OF THE REPORT

• Detailed account of all the application fields of 3D interposers (examples are logic, logic+memory, 3D RF/analogue integrated passive and MEMS capping interposers…)
• Drivers and expected benefits by application
• Comparison with technology alternatives and likeliness of 3D interposer penetration by application
• Market trends and figures with breakdown by application, substrate type, wafer and panel size
• Analysis of target wafer prices for a few key applications
• Cost analysis of several technology and industrial cases
• Supply chain analysis: main manufacturers and contract assemblers for 3D interposers, likely high volume players. Design, test and liability considerations

COMPANIES CITED IN THE REPORT

AAC Microtec, Allvia, AMD, Altera, Amkor Technology, APM, ASE, ASET, Avago Technologies, Bridgelux, CEA-LETI, ChipMOS, Cree, Corning, Dai Nippon Printing, Dalsa, Discera, Elpida, Epcos, Epistar, EPWorks, Fraunhofer IZM, Georgia Tech, Hitachi , Hymite, Hynix, Ibiden, IBM, IME, IMT, Infineon Technologies, Intel, Ipdia, Liquid Design Solutions, LG Innotek, Lumileds, Maxim, Micron, Nanium, National semiconductor, NEC / Schott, Nepes, Nichia, Nippon Electric Glass, Nokia, NXP Semiconductors, On Semiconductors, Panasonic, Qualcomm, Renesas, Replisaurus Technologies, Samsung, Schott, Sensonor, Shinko Electric, Silex Microsystems, SMIC, Soitec, Sony, StatsChipPac, STEricsson, STMicroelectronics, Süss Microtec, Tecnisco, Texas Instruments, TMT, Toshiba, TSMC, UltraTech, UMC, UTAC, VTI Technologies, WLCSP, Xilinx, Xintec.

WHO SHOULD BUY THIS REPORT?

• Integrated semiconductor Device Manufacturers and fabless semiconductor companies
  Visualize the drivers and expected benefits by application of 3D silicon/glass interposers as well as the alternative options
  Benchmark the industrialization status of 3D glass/silicon
  Identify possible partnership /or second source packaging subcontractors for your forthcoming developments
• Assembly and Test Service companies
  Get the list of the main companies involved in 3D silicon/glass interposers development and industrialization
  Screen possible new applications and technologies to support diversification strategy with 3D silicon/glass interposers
• Silicon Wafer foundries
  Screen possible new applications and technologies to support diversification strategy with 3D silicon/glass interposers, especially by loading aging facilities
• Equipment and Material suppliers
  Understand the differentiated value of your products and technologies in this emerging but fast growing market
  Identify new business opportunities and prospects
• Electronic module makers and Original Equipment Makers
  Evaluate the availability and benefits of using 3D silicon/glass interposers in your end system
  Monitor different 3D silicon/glass interposers suppliers to adjust your sourcing strategy
• PCB and IC substrate manufacturers
  Monitor the evolution of IC packaging, assembly and test, especially linked to the emerging 3D silicon/glass interposers
  Measure the threat of 3D silicon/glass interposers to the established PCB interposer and substrate businesses
  Screen possible new applications and technologies to support diversification strategy with 3D silicon/glass interposers

TABLE OF CONTENTS

1 Scope of the report, definitions and background                                

2 Executive summary                                                             

3 Supply chain analysis                                                          

4 Market forecasts                                                               

- 2009-2015 market forecasts In $M
- 2009-2015 wafer forecasts in kWafers (wspy) by application, substrate material size and shape

5 Applications and drivers                                                       

- Logic interposers                                                              
- Logic + memory interposers                                                     
- Interposers for memory stacks                                                  
- Interposers for MEMS & sensors                                                 
- Interposers for CMOS image sensors                                             
- 3D silicon submounts for HB LEDs                                               
- 3D Power/RF/analogue integrated passives                                       
- Misc Glass/silicon package substrates  

6 Technologies & Design rules for 3D Glass / Silicon interposers                                                                      

- Technologies and design rules for interposers
by application                                                                   
- Passive integration in interposers                                             
- Mixing FO WLP and 3D interposer concepts?                                      
- Focus on Glass interposers                                                     
- Focus on PANEL interposers                                                     

7 Cost structure example                                                         

- Case study #1                                                                  
- Case study #2                                                                  
- Case study #3                                                                  

8 Conclusions                                                                    

APPENDIX