A Strategic Report on the Latest Technologies in IC Packaging With Forecasts of Key Markets. Despite a global recession, the demand for handheld portable products remains strong. To continue to meet the ever-increasing needs for higher bandwidth, IC packaging technologies are continually being pushed to the limit. This report details the advances in those limits.

Report Coverage

    Stacked Packages
    Through Silicon Vias (TSV)
    System in Package (SiP)
    Fan-in QFN
    WLPs including Fan-out Style
    Interconnect and Bumping
    Substrates
    Wire Bonds

Report Highlights

    Technology Updates
    Research News
    New Products Introductions
    Industry Outlook
    End Markets/Applications
    Market Analysis and Forecasts, 2010 - 2015

 TABLE OF CONTENTS

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Stacked Packages

    Types of Stacked Packages
    The Ins and Outs of Stacked Packages
    Interconnection
    Stacked Package as a Multicomponent Package
    Wafer Thinning
    End Markets and Application Trends
    New Product Introductions
    Stacked Package Forecasts
    Stacked Packages by Application
    End Markets for Stacked Packages
    Potential Markets
    Stacked Packages by Device Type
    Stacked Packages by Interconnection

Chapter 4: Through Silicon Via (TSV) Market

    Overview
    Creating the Vias
    Issues
    3D Die-Stacking Technology Requirements
    2.5D - Silicon Interposers and Microbumps
    Wafer-to-Wafer Bonding
    Die-to-Wafer Bonding
    Die-to-Die Bonding
    Via First, Middle, or Last Technology
    Via Etching and Filling
    Specific Company Applications
    Companies with TSV Designs
    New Product Highlights
    Advances in Test
    Moving Forward
    Industry Consortiums
    Market Potential
    Forecasts for 2.5D and 3D

Chapter 5: System in Package (SiP) Solutions

    Overview
    New Product Introductions/Highlights
    SiP Forecasts
        Summary
        SiPs by Application
        SiPs by Device Type
        SiPs by Interconnection

Chapter 6: Fan-in QFN Packages

    Overview
    New Product Introductions
    Market Forecasts

Chapter 7: Wafer-Level Packages including Fan-out

    WLPs
    Wafer-Level Package Overview
    New Product / Process Introductions
    Market Forecasts for WLP
    Forecasts by Product
    Forecasts by Pitch
    Forecasts of Fan-out WLP

Chapter 8: Interconnection, Wire Bond, Flip Chip and

    Bumping
    Interconnection Overview
    Wire Bonding
    Flip Chip
    TAB
    Wafer-Bumping and Process Overview
    Alternatives to Solder
    Product Highlights
    Flip Chip Applications
    Forecasts for:
        Interconnect by Package Units
        Wire Bond Package Units and Materials
        Flip Chip
        Flip Chip Bumps
        UBM Process Techniques
        Total Wire Bond and Flip Chip

Chapter 9: Substrates

    Overview
    Ceramic
    Laminate
    HDIS
    Flex Tape
    Embedded Passives
    Thermal Substrates
    Product Highlights
    Forecasts
    Units by Pitch
    Units, Area, Revenue by Package Family
    Units, Area, Revenue by Material

Chapter 10: State of the Industry and Applications for Mobile Devices

    Overview of Current Market Status
    Mobile Electronic Applications for IC device by Product Group
    Total IC for each Product Category
    Total IC Revenue

Partial List of Figures and Tables

    Dual-Die TSOP Stack
    STATS ChipPAC's PiP
    High Performance Stakpak
    DAG Process Steps
    Dice Before Grinding Method
    Die Thickness Relative Strength
    8-Gigabit TSV DRAM Package Outline and Cross Section
    A Schematic Illustration Showing the CoW Bonding Process
    Micro-Bump and UMB Pad Structure
    Die Stack FBGA Packages, 2010-2015
    PoP Packages, 2010-2015
    PiP Packages, 2010-2015
    TSOP Stacked Packages, 2010-2015
    QFN Stacked Packages, 2010-2015
    MCM Stacked Packages
    Stacked WLPs, 2010 - 2015
    Stacked Package Assembly Revenue, 2010 - 2015
    Total ICs in Stacked Packages, 2010-2015
    Stacked ICs as a Percentage of Total ICs, 2010-2015
    Stacked Packaging Revenue as a Percentage of Total
    Packaging Revenue, 2010-2015
    Application Breakdown for Stacked Packages, 2010
    Cellular Handsets vs. Stacked Packages, 2010-2015
    Market for Various End Products Using Stacked Packages
    Total Memory Devices in FBGAs
    Total Memory Devices in WLPs
    Stacked Packages by Device Type
    Interconnection of Stacked Packages, 2010-2015
    SiPs, 2010-2015
    SiPs by Device Type, 2010-2015
    Interconnection of SiPs, 2010-2015
    Applications for SiPs, 2010
    QFN Interconnection Forecast, 2010-2015
    PGA Interconnection Forecast, 2010-2015
    BGA Interconnection Forecast, 2010-2015
    FBGA Interconnection Forecast, 2010-2015
    Total Flip Chip Forecast, 2010-2015
    Flip Chip Bump Styles, 2010-2015
    UBM Process, 2010-2015
    Bump Composition Units, 2010-2015
    Devices in QFN Packages
    Array QFN Forecast, 2010-2015

The latest advanced packaging products, services, and research of the following companies and organizations are interspersed throughout the report:

    Amkor Technology
    Avago Technologies
    Brewer Science
    Cadence Design Systems
    Dow Chemical
    Elpida Memory
    Endicott Interconnect Technologies
    EPWorks
    FlipChip International
    Fraunhofer Institute for Reliability and Microintegration
    Fujikura Ltd.
    Georgia Institute of Technology, 3D Systems Packaging Center
    IBM Corp.
    IBM T.J. Watson Research Center
    Imec
    Infineon Technologies
    ITRI
    KSG Leiterplatten
    Mentor Graphics
    Micron Technology
    Micro Systems Engineering
    NAMICS
    Nanium
    Nokia Japan
    Pac Tech Packing Technologies
    Powertech Technology
    Renesas Electronics Corp.
    Rochester Institute of Technology
    Samsung
    Sandia National Laboratory
    SphereTek
    SPTS, SPP Process Technology Systems
    STATS ChipPAC
    STMicroelectronics
    Sumitomo Bakelite
    SunRay Scientific
    Suss MicroTec
    Technical University Berlin
    Texas Instruments
    Tokyo Ohka Kogyo
    University Erlangen-Nuremberg, Institute for Manufacturing Automation and Production Systems
    UTAC
    Wacker
    Xilinx
    Zymet