Physical Analysis of the Device, Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price

Electronics.ca Publications is proud to publish the reverse costing report of the dual-axis, high-g, MEMS Accelerometer ADXL278 supplied by Analog Devices for automotive applications. The ADXL278 is the fourth-generation surface micromachined iMEMS® accelerometer from ADI. It offers an integration of a MEMS accelerometer and a control IC in one silicon die. The component is provided in a standard ceramic LCC 8-pin package, compatible with SMD process. The ADXL278 2-axis MEMS accelerometer is designed for use in front and side impact airbag applications, but can be used in a wide variety of other applications.

This report provides complete teardown of the accelerometer with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

Benefits:

- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor’s products

TABLE OF CONTENTS

Glossary

Overview/Introduction
 Executive Summary
 Reverse Costing Methodology

Product Specification

Physical analysis
Synthesis of the Physical Analysis
Physical Analysis Methodology
Package Characteristics & Markings
Package Opening
Die Dimensions
IC – Markings
IC – Bond Pads & Wire Bondings
IC – Logic Area
IC – Analog Area
IC – Metal Layer
MEMS Sensor – Optical Overview
MEMS Sensor – SEM Overview
MEMS Sensor – SEM Views
MEMS Cross-Section
Physical Data Summary

Manufacturing Process Flow Cost Analysis
Synthesis of the Cost Analysis
Main Steps of Economic Analysis
Supply Chain Analysis
Yields Explanation
Economics Analysis
Front-End Cost – Wafer Fab Unit
Front-End Cost
Back-End 0 : Probe Test
Die per wafer & Probe Test
Back-End 0 : Dicing
Total Wafer Cost (Front-End + Back-End 0)
Die cost
Back-End 1 : Packaging Hypotheses & Process Flow
Back-End 1 : Packaging Cost
Back-End 1 : Final Test
Component Cost (FE + BE 0 + BE 1)

Estimated Manufacturer Price

Analysis Conclusion

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