The Back-End Pricing Report shows how much fabless companies and IDMs are paying for outsourced back-end services. The data is collected confidentially and tabulated in aggregate by an audit firm.

The Back-End Pricing Report includes a written analysis of the survey results, a downloadable MS Access database of all aggregated results, and interactive online results showing rolling average assembly prices for four consecutive quarters by:

• Company Type
• Supplier Location
• Package Family
• Leads
• Units Per Week 

Subscribers can sort average pricing by the following:

• Company Type (fabless, IDM)
• Manufacturing Location (ALL (default), Asia (China, Hong Kong, Indonesia, Japan, Korea, Malaysia, Philippines, Singapore, Taiwan, Thailand), Europe, U.S., Other)
• Package Family (Wirebond FBGA/LGA (<1.0 pitch), Flip-Chip FBGA/LGA (<1.0 pitch), Wirebond BGA (>=1.0 pitch), Flip-Chip BGA (>=1.0 pitch), Cavity Down Wirebond BGA (>=1.0 pitch), Hermetic, MCP (MCM, SiP & Stack), PDIP, PLCC, QFN, SOIC/xSOP, WLP, xQFP)
• Leads (ALL (Default), <=64, 65-128, 129-256, 257-512, 513-768, 769-1024, >1024)
• Units Per Week (ALL (Default), <25, 25-50, 51-100, 101-250, 251-500, 501-1000, >1000)
• Drop-In Heat Spreader Used (ALL (Default), Yes, No)
• Wire-to-Package Ball Ratio (ALL (Default), 0.8-1.2, 1.3-1.6, 1.7-2.0)
• Substrate Cost (ALL (Default), Inclusive, Exclusive)
• Substrate Technology (ALL, Std, HDI, Build Up, Ceramic)
• Substrate Layers (ALL, 2, 4, 6, 8, 10)
• Wafer Size (for WLP only) (ALL (Default), 100mm, 125mm, 150mm, 200mm, 300mm)

Related Product: Wafer Fabrication Pricing Report.