The defect and photo albums provide a collection of the most common process defects for use in inspection standards, posters, training manuals and technical articles. Each file is stored on the CD in a tiff file format. Just think of the process defects and they will be on the disks. This CD contains 271 images.


Ball Grid Array Photo Album Listing


1 BGA dumbbell pad
2 BGA pads with alignment marks
3 Dumbbell pads overlapping resist
4 BGA teardrop & alignment marks
5 BGA dumbbell pads open resist
6 BGA dumbbell overlapping resist
7 BGA pads with alignment marks
8 BGA showing alignment mark
9 BGA showing alignment marks
10 Poor solderability of BGA pads
11 Satisfactory pad solderability
12 Failed solderability test board
13 Satisfactory pad solderability
14 Poor solderability of gold pads
15 Close-up paste deposit
16 Paste deposit on teardrop pads
17 Paste deposit on teardrop pads
18 Paste slump on teardrop pads
19 Paste slump on teardrop pads
20 Paste on dumbbell pads
21 Paste smear on teardrop pads
22 Paste deposit on teardrop pads
23 Paste deposit on teardrop pads
24 Top view of plastic BGA
25 SMART Group dummy BGAs
26 Top view of plastic BGA
27 Side view of ceramic BGA & balls
28 Bottom view of BGA balls
29 Close-up of balls on ceramic BGA
30 Bottom view of Tessia micro BGA
31 Bottom view of IBM Tape BGA
32 Close-up of IBM Tape BGA
33 Close-up of Tessia BGA base
34 Bottom of plastic BGA
35 Close-up of BGA balls
36 Side view of ceramic hybrid BGA
37 Top view IBM Tape BGA
38 Close-up of balls on plastic BGA
39 Top of IBM plastic BGA encapsulate
40 Bottom view of ceramic hybrid BGA
41 Side view of ceramic hybrid BGA
42 Multi panel of BGAs
43 Close-up of balls on IBM Tape BGA
44 Base of over moulded plastic BGA
45 Close-up of balls on ceramic BGA
46 Base of balls on ceramic BGA
47 PBGA microsection through ball
48 Microsection through SMART demo
49 Microsection through SMART demo
50 Microsection through ball and pad
51 Microsection of ball, pad and resist
52 PBGA microsection of package
53 Microsection BGA joint area
54 Microsection BGA joint cracking
55 Microsection BGA joint cracking
56 Microsection BGA ball and joint
57 BGA joint minor voiding
58 BGA joint minor voiding
59 Satisfactory BGA joint
60 Close-up via mounted BGA joint
61 Close-up via mounted BGA joint
62 Via mounted BGA joint
63 Via mounted BGA joint
64 Via mounted BGA joint with voiding
65 Via mounted BGA joint
66 Via mounted BGA with incomplete fill
67 Bottom of BGA after shear test
68 Close-up after shear testing
69 Close-up of sheared balls
70 Side of ceramic BGA and joints
71 Top BGA view and alignment marks
72 Top BGA view misplaced with marks
73 Side of ceramic BGA and joints
74 Solder pre-form for BGA
75 Solder spikes after rework
76 Rework ball matrix
77 Rework ball matrix
78 Rework ball matrix
79 Rework ball matrix
80 Damaged resist after rework
81 BGA pads after satisfactory rework
82 BGA pads after rework
83 Solder balling on BGA footprint
84 Pads after rework with solder in vias
85 Via mounted BGA with voiding
86 Missing solder ball on BGA
87 Missing solder ball on BGA
88 Top view of plastic BGA
89 Microsection of die cracking
90 Popcorn cracking on side of BGA
91 Topside plastic BGA cracking
92 Close-up of cracking
93 Close-up of BGA cracking
94 Cracking of die attachment
95 Open circuit BGA joint
96 Open circuit BGA joint
97 Solder paste in via holes
98 Open circuit BGA joint
99 Open circuit BGA joint
100 Solder shorts after BGA removal
101 Solder in via holes
102 Solder protruding from vias
103 Solder short after BGA removal
104 Flux left after BGA removal
105 Solder paste in via holes
106 Misplaced solder paste deposit
107 Missing solder balls
108 Close-up of deformed BGA balls
109 Multi panel of BGA devices
110 Close-up precision solder balls
111 X-ray of BGA joints
112 X-ray of BGA shorts
113 X-ray of BGA short
114 X-ray of joints
115 X-ray of joints
116 X-ray of Joints
117 X-ray with missing ball
118 X-ray variable ball size
119 X-ray of minor voiding
120 X-ray of minor voiding
121 X-ray of misshapen balls
122 X-ray of misshapen balls
123 X-ray of incomplete reflow
124 X-ray of incomplete joint
125 X-ray missing balls and short
126 X-ray of short/insufficient joints
127 X-ray incomplete reflow and skewing
128 X-ray incomplete reflow and skewing
129 X-ray of minor voiding
130 X-ray voiding and misshapen balls
131 X-ray minor voiding
132 X-ray misshapen balls
133 X-ray minor voiding
134 As above
135 BGA microsection with void
136 Microsection with high temp. ball
137 As above
138 BGA microsection with void
139 Example of CSP
140 Microsection with high temp. ball
141 Microsection with high temp. ball
142 Example of CGA
143 Example of CGA
144 BGA with corner marks
145 Close up of a CSP
146 BGA microsection with void
147 BGA with corner marks
148 Close-up of a CSP
149 Close-up example of CGA
150 Close-up x-ray of BGA with wetting indicator
151
152 Close-up x-ray of BGA with wetting indicator
153 Close-up x-ray of BGA with wetting indicator with voids and solder balls
154 Close-up x-ray of BGA with wetting indicator
155 X-Ray of uBGA with corner copper marks
156 X-Ray of uBGA joints
157 X-Ray of BGA with corner copper marks
158 X-Ray of BGA showing daisy chains
159 X-Ray of uBGA joints angled view
160 Close up X-Ray of uBGA joints
161 Close up X-Ray of uBGA joints
162 BGA joint interface with solder balls
163 uBGA panel with underfill
164 uBGA panel with underfill
165 uBGA panel on process fixture
166 uBGA panel on process fixture
167 uBGA rework with liquid flux
168 Cleaning the uBGA site with cleaner pen
169 Wicking off solder from uBGA site
170 Placement of uBGA using surface alignment marks
171 Manual placement of uBGA using reference marks
172 uBGA site after removal of component
173 Speedline dummy BGA
174 uBGA on the surface of the board with alignment marks
175 Placement of Speedline dummy BGA
176 Placement of Speedline dummy BGA
177 Placement of Speedline dummy BGA
178 Placement of Speedline dummy BGA
179 Placement of Speedline dummy BGA
180 Reflow of BGA with IR rework tool
181 Speedline dummy BGA soldered in place
182 uBGA site after printing
183 uBGA site after printing
184 uBGA site after printing
185 Microsection of cracking on BGA joint
186 Microsection of cracking on BGA joint
187 Comparing Dual in Line with uBGA size
188 uBGA devices and through hole parts
189 uBGA in tape and reel package
190 uBGA tape and reel package tape
191 uBGA in tape and reel package
192 uBGA in tape and reel package
193 uBGA in tape and reel package
194 uBGA in tape and reel package
195 Flip chips in waffle tray
196 X-ray of  BGA joints
197 X-ray of BGA joints with wetting indicators
198 X-ray of BGA joints with wetting indicators
199 BGA joints after mechanical testing
200 BGA joints after mechanical testing
201 BGA joints after mechanical testing, slight misplacement
202 Solder balls between terminations
203 Solder balls around terminations after mechanical testing
204 As above
205 As above
206 BGA rework
207 As above close up
208 Repair grid in holder with BGA
209 BGA before repair, positioned in holder
210 BGA reballing holder plate
211 Moisture indicator labels in BGA packing
212 BGA positioned with corner marks
213 BGA positioned with corner marks
214 BGA with no corner marks
215 BGA pad with contaminates from resist
216 Damage to BGA balls
217 Pad failure on BGA joint after mechanical testing
218 Nickel gold pad failure on BGA site, note surface of copper
219 Nickel gold pad failure on BGA site
220 Examples of satisfactory and pad failure on BGA
221 Nickel gold pad failure on BGA site
222 Pad failure on BGA joint after mechanical testing
223 Nickel gold pad failure on BGA site
224 X-ray of BGA delamination under chip
225 X-ray of BGA delamination under chip
226 X-ray of BGA delamination under chip
227 SEM of satisfactory test and pad failure
228 SEM of failed BGA joint
229 Site of pad failure on BGA after mechanical testing
230 SEM of failed BGA joint
231 SEM of failed BGA joint
232 SEM of failed ball to nickel pad on PCB
233 SEM of failed ball to nickel pad on PCB
234 SEM of failed ball to nickel pad on PCB
235 Poor solderability of ball terminations
236 Good solderabilituy of ball terminations
237 As above
238 Ceramic Ball Grid Array
239 Distortion of ceramic BGA
240 CSP package
241 CSP package
242 Distortion of CSP package
243 Distortion of CSP package
244 Distortion of CSP package
245 Solder shorts due to CSP distortion
246 Voiding in ball due to via in pad gassing
247 Distortion of CSP x-ray
248 Incomplete reflow of paste on BGA
249 Flip chip/CSP balls
250 Flip chip/CSP balls
251 As above
252 CSP package
253 CSP package
254 X-ray of CSP joints
255 X-ray of misplaced CSP
256 X-ray of CSP joints
257 X-ray of CSP joints
258 BGA popcorn shorts, squashed balls
259 BGA Alignment marks
260 Voids in BGA balls due to via gassing
261 Inconsistend ball formation
262 As above plus voids
263 Voids in BGA balls due to via gassing
264 Voids in BGA balls due to via gassing plus short
265 Voids in BGA balls due to via gassing
266 Voids in BGA balls due to via gassing
267 BGA pads with wetting indicators
268 BGA pads with wetting indicators
269 X-ray of balls with voids due to via gassing
270 X-ray of balls with voids due to via gassing
271 X-ray of balls with voids due to via gassing