The 2010 upswing has helped the market to bounce back with additional height.  This report reviews in detail the markets and technology as it applies to materials related to Chemical Mechanical Polishing, including Pads, Slurries, Abrasives, Conditioners, PCMP Clean Chemistry, Equipment. Material forecasts and market shares are included.

TABLE OF CONTENTS

EXECUTIVE SUMMARY

1 SEMICONDUCTOR EVOLUTION AND ITS IMPLICATIONS FOR CMP
1.1 HISTORY OF CMP USE IN SEMICONDUCTOR FABRICATION9
1.2 CMP TECHNOLOGY: 2011 TO 2016 9

2 TECHNOLOGY DRIVERS FOR THE CMP INDUSTRY ROADMAP
2.1 CMP: SEMICONDUCTOR DRIVERS IN BUSINESS AND TECHNOLOGY.19
2.2 NON-SEMICONDUCTOR DRIVERS22

3 CMP CONSUMABLES BUSINESS ENVIRONMENT UPDATE
3.1 SLURRY BUSINESS ENVIRONMENT27
3.1.1 ILD .30
3.1.2 Selective STI.30
3.1.3 Tungsten.31
3.1.4 Copper 31
3.1.5 Polysilicon32
3.1.6 Emerging Applications .32
3.1.7 Abrasive Supplier Business Environment33
3.1.8 Slurry Supply Chain Threats33
3.2 PAD BUSINESS ENVIRONMENT 33
3.2.1 Pad Design .38
3.2.2 Pad Patents.38
3.2.3 Subpads 38
3.2.4 Wafer Carrier Films .38
3.2.5 Pad Supply Chain Threats39
3.3 BUSINESS ENVIRONMENT FOR OTHER CMP SEGMENTS39
3.3.1 Post-CMP Cleaning Business Environment 39
3.3.1.1 ILD40
3.3.1.2 STI.40
3.3.1.3 Tungsten.40
3.3.1.4 Copper40
3.3.1.5 PCMP Supply Chain Threats41
3.3.2 Pad Conditioners41
3.3.3 PVA Brushes 42
3.3.4 Slurry Filters 43
3.3.5 CMP Equipment 44
3.3.6 Metrology .44
3.3.7 Services.44
3.3.7.1 NCCAVS CMPUG.45
3.3.7.2 SemiNeedle 45
3.3.7.3 USPTO .45
3.4 THREATS TO THE CMP CONSUMABLE BUSINESS.45

4 CMP SLURRY & ABRASIVE SUPPLIERS
4.1 ADCON LAB, INC. 48
4.2 ANJIMICROELECTRONICS, INC. .49
4.3 ASAHI GLASS COMPANY, LTD.49
4.4 AZ ELECTRONIC MATERIALS.49
4.5 BAIKOWSKI .50
4.6 BASF SE.50
4.7 CABOT CORPORATION50
4.8 CABOT MICROELECTRONICS CORPORATION.50
4.9 CHEIL INDUSTRIES INC51
4.10 DONGJIN SEMICHEM COMPANY, LTD. .51
4.11 DOW ELECTRONIC MATERIALS 51
4.12 DUPONT AIR PRODUCTS NANOMATERIALS, LLC.52
4.13 EKA CHEMICAL 53
4.14 ELKEM AS.53
4.15 EMINESS TECHNOLOGIES, INC. .53
4.16 EVONIK INDUSTRIES AG .54
4.17 FERRO .54
4.18 FUJIFILM PLANAR SOLUTIONS, LLC .54
4.19 FUJIMI INCORPORATED55
4.20 FUSO CHEMICAL COMPANY, LTD. 56
4.21 W.R. GRACE &COMPANY 56
4.22 HITACHI CHEMICAL CO., LTD. .56
4.23 INNOVATIVE ORGANICS 57
4.24 INTERSURFACE DYNAMICS57
4.25 JGC CATALYSTS &CHEMICALS 58
4.26 JSRMICRO, INC. 58
4.27 KC TECH COMPANY, LTD. 58
4.28 KEMESYS.59
4.29 MITSUI MINING &SMELTING COMPANY, LTD. .59
4.30 NALCO COMPANY.59
4.31 NANOPHASE TECHNOLOGIES CORPORATION 59
4.32 NISSAN CHEMICAL INDUSTRIES, LTD. 59
4.33 NITTA-HAAS INCORPORATED .59
4.34 PRECISION COLLOIDS, LLC60
4.35 RHODIA SA .60
4.36 SHOWA DENKO KK 60
4.37 SILBOND CORPORATION.60
4.38 SAINT-GOBAIN SA60
4.39 TECHNO SEMICHEM COMPANY, LTD60
4.40 UK ABRASIVES, INC61
4.41 UMICORE GROUP61
4.42 UNIVERSAL PHOTONICS 61
4.43 UWIZ TECHNOLOGY61
4.44 WACKER CHEMIE AG.61
4.45 OTHERS .61

5 CMP PAD SUPPLIERS
5.1 3M.63
5.2 CABOT MICROELECTRONICS CORPORATION.64
5.3 DOW ELECTRONIC MATERIALS 65
5.4 EMINESS TECHNOLOGIES INC. 66
5.5 FUJIBO HOLDINGS, INC. 66
5.6 INNOPAD, INC66
5.7 IVT67
5.8 JSRMICRO, INC. 67
5.9 KPX CHEMICAL CO., LTD. .68
5.10 NEXPLANAR CORPORATION .68
5.11 NIHON MICRO COATING COMPANY, LTD. .69
5.12 NITTA-HAAS INCORPORATED .69
5.13 PLANAR LABS CORP. .69
5.14 PRAXAIR TECHNOLOGY, INC. .70
5.15 ROGERS CORPORATION 70
5.16 SK CHEMICALS CO., LTD71
5.17 SPARTAN FELT COMPANY.71
5.18 THOMAS WEST INCORPORATED .71
5.19 TORAY INDUSTRIES, INC. 72
5.20 TOYO TIRE &RUBBER CO., LTD. .72
5.21 TOYOBO COMPANY, LTD.72
5.22 OTHERS .73

6 POST-CMP CLEANING SUPPLIERS
6.1 AIR PRODUCTS AND CHEMICALS, INC. .75
6.2 ANJI MICROELECTRONICS, INC. .76
6.3 ATMI INC. 76
6.4 BASF.77
6.5 CABOT MICROELECTRONICS CORP77
6.6 DUPONT EKC TECHNOLOGY77
6.7 J.T. BAKER77
6.8 KANTO CHEMICAL COMPANY, INC.77
6.9 MITSUBISHI CHEMICAL CORPORATION .78
6.10 SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD. 78
6.11 TECHNIC FRANCE.78
6.12 WAKO PURE CHEMICAL INDUSTRIES, LTD. .78
6.13 OTHERS .78

7 PAD CONDITIONER SUPPLIERS
7.1 3M.80
7.2 ABRASIVE TECHNOLOGY, INC.80
7.3 ADVANCED DIAMOND SOLUTIONS, INC. .81
7.4 ADVANCED DIAMOND TECHNOLOGIES, INC.81
7.5 ASAHI DIAMOND INDUSTRIAL CO., LTD. 81
7.6 EHWA DIAMOND INDUSTRIAL CO., LTD. 81
7.7 KINIK COMPANY LTD.81
7.8 MITSUBISHI MATERIALS CORPORATION82
7.9 MORGAN TECHNICAL CERAMICS .82
7.10 NORITAKE COMPANY, LTD. 83
7.11 SAESOL DIAMOND INDUSTRIAL CO., LTD.83
7.12 SHINHAN DIAMOND INDUSTRIAL CO., LTD. .83
7.13 SAINT-GOBAIN SA84
7.14 TBWINDUSTRIES, INC. .84
7.15 OTHERS .84

8 PVA BRUSH SUPPLIERS
8.1 AION CO., LTD.86
8.2 BRUSHTEK 86
8.3 ENTEGRIS, INC. .86
8.4 ITWRIPPEY86
8.5 OTHERS .87

9 CMP FILTER SUPPLIERS
9.1 3M.88
9.2 ENTEGRIS, INC. .88
9.3 GRAVER TECHNOLOGIES 88
9.4 MEISSNER FILTRATION PRODUCTS, INC.88
9.5 PALL CORPORATION .88
9.6 PARKER HANNIFIN CORPORATION.89
9.7 ROKI TECHNO CO., LTD89
9.8 WHATMAN PLC .89
9.9 OTHERS .89

10 CMP EQUIPMENT SUPPLIERS
10.1 ACCRETECH90
10.2 ALPSITEC SARL.90
10.3 APPLIED MATERIALS, INC.90
10.4 DAINIPPON SCREEN MFG. CO., LTD. 91
10.5 EBARA CORPORATION91
10.6 G&P TECHNOLOGIES.91
10.7 KC TECH COMPANY, LTD. 91
10.8 NOVELLUS SYSTEMS, INC. .91
10.9 SOLID STATE EQUIPMENT CORPORATION91
10.10 STRASBAUGH.92
10.11 OTHERS .92

11 RETAINING RINGS & CARRIER PARTS SUPPLIERS
11.1 DUPONT 93
11.2 ENTEGRIS, INC. .93
11.3 NIPPON POLYPENCO LTD. .93
11.4 QUADRANT AG.93
11.5 SEMICONDUCTOR PRODUCTS MANUFACTURING INCORPORATED93
11.6 SAINT-GOBAIN PLASTICS 94
11.7 SEMPLASTICS, LLC94
11.8 VICTREX PLC.94
11.9 OTHERS .94

12 OTHER SUPPORT PRODUCT SUPPLIERS
12.1 ADCON LAB, INC. 95
12.2 ADVANTIV TECHNOLOGIES, INC. 95
12.3 AIR LIQUIDE SA95
12.4 ARACA, INC. 96
12.5 ATMI INC. 96
12.6 AXUS TECHNOLOGY .96
12.7 CMP CONSULTING .96
12.8 DIVIND LLC .96
12.9 ECO PHYSICS AG.96
12.10 EDWARDS LIMITED.96
12.11 ENTEGRIS, INC. .97
12.12 ENTREPIX, INC. .97
12.13 FÄTH GMBH97
12.14 JETALON SOLUTIONS, INC. 97
12.15 KIEFER TECH CO. LTD97
12.16 KINETIC SYSTEMS, INC97
12.17 LAREDO TECHNOLOGIES97
12.18 LEVITRONIX, LLC97
12.19 MALEMA ENGINEERING CORPORATION.98
12.20 NETMOTION, INC98
12.21 SAINT-GOBAIN98
12.22 SILYB WAFER SERVICES, INC. 98
12.23 SKWASSOCIATES, INC. 98
12.24 SVTC TECHNOLOGIES LLC.98
12.25 OTHERS .98

13 UNIVERSITY RESEARCH
13.1 ALBANY NANOTECH.99
13.2 CARNEGIE MELLON99
13.3 CLARKSON UNIVERSITY 100
13.4 COLORADO SCHOOL OF MINES.100
13.5 DRESDEN UNIVERSITY OF TECHNOLOGY .100
13.6 FRAUNHOFER INSTITUTE100
13.7 GEORGIA INSTITUTE OF TECHNOLOGY100
13.8 HANYANG UNIVERSITY.100
13.9 IMEC101
13.10 IOWA STATE UNIVERSITY .101
13.11 KYUSHU UNIVERSITY 101
13.12 MASSACHUSETTS INSTITUTE OF TECHNOLOGY.101
13.13 NORTHEASTERN UNIVERSITY .101
13.14 PUSAN NATIONAL UNIVERSITY.102
13.15 RENSSELAER POLYTECHNIC INSTITUTE.102
13.16 ROCHESTER INSTITUTE OF TECHNOLOGY .102
13.17 SUNGKYUNKWAN UNIVERSITY102
13.18 TOHOKU UNIVERSITY.102
13.19 TUFTS UNIVERSITY.102
13.20 UNIVERSITY OF ALBERTA .102
13.21 UNIVERSITY OF ARIZONA102
13.22 UNIVERSITY OF CALIFORNIA - BERKELEY .103
13.23 UNIVERSITY OF FLORIDA 103
13.24 UNIVERSITY OF SOUTH FLORIDA103

14 CMP PROCESS FLOWS
14.1 FEOL104
14.1.1 STI104
14.1.2 PRE-METAL DIELECTRIC HKMG104
14.1.3 POLY OPEN POLISH FOR METAL GATES .104
14.1.4 ALUMINUM FOR METAL GATES .104
14.1.5 TUNGSTEN CONTACTS 104
14.1.6 POLY CONTACTS105
14.2 BEOL105
14.2.1 COPPER.105
14.2.2 BARRIER.105
14.2.3 TUNGSTEN 105
14.2.4 ILD.106
14.3 THROUGH SILICON VIAS .106
14.3.1 TSV FRONT SIDE 106
14.3.2 TSV BACK SIDE .106

LIST OF FIGURES

Figure 2. Transition to Copper Contact Plug.14
Figure 2.1a. Annual Wafer Starts (200mm Equivalent) 20
Figure 2.1b. Global Semiconductor Sales Revenue ($M) .20
Figure 2.1c. Introduction of New CMP Steps in Advanced Nodes .22
Figure 3a. Total Pads & Slurry Consumables Revenue Forecast by Process Type .24
Figure 3b. Total Pads & Slurry Consumables Revenue Forecast 24
Figure 3c. CMP Process Demand Forecast by Process Type 25
Figure 3d. Typical CMP Costs .26
Figure 3.1a. Slurry Revenue Forecast by Process Type 27
Figure 3.1b. Point of Use Slurry Volume Forecast by Process Type 28
Figure 3.1c. Overall Slurry Revenue Market Share by Process.30
Figure 3.2a. Pad Revenue Forecast by Process Type 34
Figure 3.2b. Pad Revenue for 300mm as a Percent of Total by Process Type 35
Figure 3.2c. Pad Usage (Number of Pads) Forecast by Process Type.35
Figure 3.2d. Pad Usage for 300mm as a Percent of Total Pads Used by Process Type.36

LIST OF TABLES

Table 1. Process Learning and Process Options Reflected in the Changes Over More Than 15 Years of CMP Technology.10
Table 2a. FEP14: STI Process Requirements (2010 Interconnect ITRS) 12
Table 2b. INTC15: Planarization Applications and Equipment Potential Solutions (2010 Interconnect
ITRS) .13
Table 2c. Air Gap Dielectric.15
Table 2d. Barrier Resistivity.15
Table 2e. INTC11: Barrier Potential Solutions (2009 Interconnect ITRS)16
Table 2f. INTC13: Conductor Potential Solutions (2009 Interconnect ITRS) 17
Table 2g. INTC16: Planarization Consumables Potential Solutions (2010 Interconnect ITRS) .18
Table 2h. INTC9: Interconnect Surface Preparation Potential Solutions (2009 Interconnect ITRS) 19
Table 3.4. Competitive Technology Threats to Conventional CMP46
Table 4. CMP Slurry and Abrasive Suppliers47
Table 5. Polishing Pad Suppliers 63
Table 6. Post-CMP Cleaning Chemistry Suppliers75
Table 7. CMP Pad Conditioner Suppliers79
Table 8. PVA Brush Suppliers86
Table 9. CMP Slurry Filter Suppliers 88
Table 10. CMP Equipment Suppliers 90
Table 11. Retaining Rings and Miscellaneous Carrier Parts Suppliers93
Table 12. Other CMP Support Product Suppliers95
Table 13. CMP-related University Research Institutions 99