Physical Analysis of the Device, Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price

Electronics.ca Publications is proud to publish the reverse costing report of the Xlamp XP-E Cool White LED supplied by Cree. Based on a complete teardown process, the report provides an estimation of the production cost as well as the selling price of the component.

•The XP-E is a pure white series and have a typical brightness of 114lm with a consumption of 1.12W at 350mA.
•The component is provided in a specific 2-pins package, compatible with SMT process.
•It can be used in a wide range of lighting applications, including: Portable, LED light bulbs, Architectural, Signage, Retail display, Transportation and Emergency vehicle.
•This report provides complete teardown of the LED with:
1.Detailed photos
2.Material analysis
3.Schematic assembly description
4.Manufacturing Process Flow
5.In-depth economical analysis
6.Manufacturing cost breakdown
7.Selling price estimation

Benefits:

- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor’s products

TABLE OF CONTENTS

Glossary                                                                         

1. Overview / Introduction

•Executive Summary
•Comparison of the analyzed LEDs
•Reverse Costing Methodology

2. Physical Analysis

•Physical Analysis Methodology
•Package Characteristics
•Package X-Ray
•Package Opening
•Package Cross-Section
•Fluorescent Material
•Package Parameters Summary
•LED Dimensions
•LED Emission
•LED Cross-Section
•LED Structure

3. Manufacturing Process Flow

•LED Die Process Flow
•Description of the Wafer Fabrication Unit

4. Cost Analysis

•Synthesis of the Cost Analysis
•Yields Explanation
•LED Front-End Cost
•Front-End : Epitaxy Cost
•Front-End : Other Front-End Cost
•Dies per Wafer & Probe Test
•Back-End 0 : Probe Cost
•Back-End 0 : Dicing Cost
•LED Wafer & Die Cost (FE + BE 0)
•Back-End 1 : Packaging Process Flow
•Back-End 1 : Final Test Cost
•Component Manufacturing Cost (FE+BE0+BE1)
•Cost Analysis Evolution

5. Estimated Manufacturer Price Analysis

•Price definitions
•Manufacturers financial ratios
•Binning Impact on Manufacturing Price
•Ideal manufacturer Price
•Manufacturing Price with Binning Yield

Conclusion

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