Chemical Mechanical Polishing (CMP) Equipment and Materials

Category
Advanced Materials
Processing Technologies
Chemical Mechanical Polishing (CMP) Equipment and Materials

Chemical Mechanical Polishing (CMP) Equipment and Materials

Price:

USD $4,850.00

ISBN/SKU #:

GB-AVM047B

Research Group:

BCC

Date of Publication:

October 2008

Summary

Chemical mechanical polishing (CMP) is a process that, during the past 20 years, has achieved a high level of importance in various industrial sectors, particularly in microelectronics. During the last 5 years, various technological advances have occurred in this field, leading to increased market demand for CMP equipment and materials.

The main goal of this report is to provide new insights into current CMP technology, outlining technological trends, and supplying an updated market analysis of equipment and materials utilized for chemical mechanical polishing.

Specifically, the major objectives of this study are to:

Provide an updated revie w of the chemical mechanical polishing process and related equipment, focusing on the most advanced equipment upgrades and variants.
Provide an overview of materials commonly used in chemical mechanical polishing and identify new materials.
Highlight new technological developments in chemical mechanical polishing, while outlining technical issues.
Review the fields of application for CMP and investigate emerging applications.
Estimate current global markets for CMP equipment and materials (including CMP and post-CMP equipment, CMP slurries, CMP pads and pad conditioners) with growth forecasts through 2013 for each market segment.
Identify important technology and market trends within each market segment.
Supply an updated review of current producers of equipment and materials for chemical mechanical polishing.
Identify major users of CMP equipment, slurries, pads and pad conditioners.
Provide a description of current worldwide research activities and evaluate their impact on industry growth.
Determine trends in U.S. patents issued during the most recent years

Chemical mechanical polishing (CMP) is used to create very smooth (i.e., polished) surfaces. During manufacturing of advanced devices used in microelectronics and other fields of application, chemical mechanical polishing serves the critical function of producing near perfectly flat (or planar) films and preparing the film surface for the deposition of successive layers. For this reason, the CMP process is also known as chemical mechanical planarization. Although the origins of the CMP process can be traced back to the 1960s, it was not until the 1980s that this technology entered the main stream, when IBM introduced CMP for the planarization of inter-layer dielectrics and multilayered metal structures in semiconductor devices. Since then the market for CMP equipment and materials has grown steadily, accompanied by a rapid increase in R&D activities aimed at developing slurry formulations and equipment designs to meet more stringent requirements associated with the increasing miniaturization of microelectronic devices.

Today, the CMP market is worth $2.8 billion and still growing at a fairly healthy pace.

The principal reason for doing this study is to present a current assessment of the CMP industry from both a technological and market point of view and to outline future trends and key developments. There is also a need to evaluate the current status and future trends of the CMP industry from a global standpoint. With the ongoing globalization of markets and the relocation of many manufacturing facilities to lower cost countries, it is also necessary to provide a geographical mapping of points of production of CMP equipment and materials, relative to global sales and distribution. Such an evaluation will contribute to a broader understanding of growth opportunities for CMP equipment and materials, and their applications within the U.S. and abroad.

An equally important reason for performing this study is to provide an overview of global R&D activities related to the CMP industry, both within public and private organizations, and to illustrate the latest technological developments that can assist companies in finding opportunities for process and productivity improvements and, consequently, positively impact their future market growth.

This study will be of primary interest to all companies that:

Manufacture, sell, and distribute materials and equipment for chemical mechanical polishing.
Fabricate semiconductors and other devices requiring planarization in their manufacturing process.
Offer coating services to the thin film industry.
Supply abrasive powders and nanomaterials.
Produce cleaning solutions for the post-CMP process.
Manufacture analytical instruments for thickness, flatness, and/or surface roughness characterization.
Provide technical and/or marketing services for the microelectronics industry.
Are planning to enter the semiconductor industry as manufacturers of polishing equipment or suppliers of chemicals, abrasives, and etching solutions.

Overall, this study applies to industry segments such as microelectronics, data storage media, flat panel displays, optical coatings, and the general coating sector.

This study provides an updated review of chemical mechanical polishing technology, including equipment and materials, and identifies current and potential applications for this technology.

This study determines the current market status of chemical mechanical polishing, defines trends, and presents forecasts of growth over the next 5 years. Technological issues, including the latest process developments, are also discussed.

This report analyzes the CMP industry on a worldwide basis from the standpoint of both manufacturing and consumption. In addition, the study examines commercial and public research activities in major regions of the world. Research objectives and areas of interest related to equipment, materials, and applications of chemical mechanical polishing are also outlined.

More specifically, this market analysis is divided into five parts.

In the first part, a historical review of the CMP process is provided, including an outline of recent events. In addition, the report supplies a revised and detailed description of a typical CMP process and of recent equipment and process upgrades. In this section, current and emerging applications of chemical mechanical polishing are also identified and divided by sector (i.e., electronics and optics).

The second part of the report entails a global market analysis of CMP equipment and materials. Current technical issues are described, followed by a review of related, recent technological developments and patent abstracts. Global revenues (sales data in M$) for CMP equipment and materials are presented by product type, application, and region, with actual data referring to the years 2006, 2007, and estimated data for the year 2008. This section is completed by a presentation of market growth trends, based on industry growth, technological trends, and regional trends. Projected revenues for CMP equipment and materials are reported, with forecast CAGR (compound annual growth rate) for the period 2008 through 2013.

In the third part, covering global industry structure, the report provides a complete list of suppliers of CMP equipment and materials with a description of their products. The analysis includes a description of the geographical distribution of these firms and an evaluation of production versus consumption for CMP equipment and materials, always from a geographical standpoint. Detailed company profiles of the top industry players and relative market share for the five leading companies are also provided.

In the fourth part of this study, an analysis of industry competitiveness is performed. This analysis encompasses a review of global research and development activities, with profiles of the most important R&D players divided by region, and an outline of the most critical factors contributing to industry competitiveness.

The fifth and final section includes extensive U.S. patent analysis, with a summary of patents related to CMP equipment, materials, process, and applications, issued during the period 2006 through 2008. Patent analysis is performed by region, country, assignee, patent category, application, and material type.

This report:

Provides an in-depth analysis of CMP technology and its applications
Analyzes and forecasts the size and future growth of the markets for CMP and post-CMP equipment, slurries, pads and pad conditioners, and other consumables, with forecasts through 2012
Identifies major users and end-uses.
Identifies the technological issues related to CMP
Examines major new R&D and technology changes and their impact on CMP
Analyzes domestic and foreign competition among companies within each market segment
Profiles all worldwide producers of CMP and post CMP equipment and materials
Includes market shares, industry structure and patent analysis.

TABLE OF CONTENTS

Chapter- 1: INTRODUCTION

STUDY GOALS AND OBJECTIVES	1
REASONS FOR DOING THIS STUDY	2
INTENDED AUDIENCE	2
SCOPE OF REPORT	3
METHODOLOGY AND INFORMATION SOURCES	4

Chapter- 2: SUMMARY

EXECUTIVE SUMMARY	8
SUMMARY TABLE GLOBAL MARKET FOR CHEMICAL MECHANICAL POLISHING, THROUGH 2013 ($MILLIONS)	9
SUMMARY FIGURE GLOBAL MARKET FOR CHEMICAL MECHANICAL POLISHING, 2006-2013 ($MILLIONS)

Chapter- 3: OVERVIEW

INTRODUCTION	11
HISTORY OF CHEMICAL MECHANICAL POLISHING	11
TABLE 1 CHEMICAL MECHANICAL POLISHING TECHNOLOGICAL MILESTONES	13
FIGURE 1 CHEMICAL MECHANICAL POLISHING WORLDWIDE PATENT APPLICATIONS AND PATENTS ISSUED SINCE 1960	14
CHEMICAL-MECHANICAL POLISHING: PROCESS AND EQUIPMENT	15
POLISHING	15
Requirements of a CMP Process	15
TABLE 2 GENERAL REQUIREMENTS OF A CMP PROCESS	15
Equipment and Process	15
Dual Force Planarization	16
Multiple Polishing Systems	17
POST-CMP CLEANING	17
Cleaning Steps and Chemistries	17
Post-CMP Equipment Technology	18
Wet Process	18
Dry and Other Processes	19
CURRENT AND EMERGING APPLICATIONS OF CHEMICAL MECHANICAL POLISHING	19
TABLE 3 APPLICATIONS OF CHEMICAL MECHANICAL POLISHING BY INDUSTRY	20
ELECTRONICS	20
Microelectronics	20
Semiconductor Devices	20
TABLE 4 IC CONFIGURATIONS	21
TABLE 5 TYPICAL APPLICATIONS OF CHEMICAL MECHANICAL POLISHING IN SEMICONDUCTOR MANUFACTURING	22
Wafer Planarization	22
Deep Trench Capacitor Fabrication	22
Polysilicon Films	23
Shallow Trench Isolation	23
Pre-metal Dielectric Layers	23
Inter-layer Dielectric Films	23
Aluminum and Aluminum Alloys	24
Metal Polishing for Vias and Contacts	24
Damascene Process	24
MEMS and NEMS	24
Inkjet Printheads	25
Data Storage Media and Recording Heads	25
Magnetic Storage Media	25
Recording Heads	26
Advanced Displays	26
OPTICS	26
Lenses	26
Color Filters for Image Sensors	26
Sapphire Substrates	27

Chapter- 4: GLOBAL MARKET

ANALYSIS OUTLINE	28
GLOBAL MARKET SUMMARY	28
MARKET SEGMENTATION BY PRODUCT CATEGORY	28
TABLE 6 CHEMICAL MECHANICAL POLISHING: GLOBAL REVENUES BY PRODUCT CATEGORY, THROUGH 2013 ($MILLIONS)	30
FIGURE 2 CHEMICAL MECHANICAL POLISHING: GLOBAL MARKET BY PRODUCT CATEGORY, 2006-2013 ($MILLIONS)	31
FIGURE 3 CHEMICAL MECHANICAL POLISHING: MARKET SHARE BY PRODUCT CATEGORY, 2008 AND 2013 (%)	31
MARKET SEGMENTATION BY APPLICATION	32
TABLE 7 CHEMICAL MECHANICAL POLISHING: GLOBAL REVENUES BY APPLICATION, THROUGH 2013 ($MILLIONS)	33
FIGURE 4 CHEMICAL MECHANICAL POLISHING: MARKET SHARE BY APPLICATION, 2008 AND 2013 (%)	34
MARKET SEGMENTATION BY REGION	35
TABLE 8 CHEMICAL MECHANICAL POLISHING: REVENUES BY REGION, THROUGH 2013 ($MILLIONS)	35
FIGURE 5 CHEMICAL MECHANICAL POLISHING: MARKET SHARE BY REGION, 2008 AND 2013 (%)	36
CMP EQUIPMENT	37
BASIC EQUIPMENT DESIGN	37
TABLE 9 BASIC CHEMICAL MECHANICAL POLISHING PROCESS	37
CURRENT TECHNICAL ISSUES	37
Uniform Polishing Pressure	37
Carrier Head Position	37
Determination of Polishing Endpoint	38
Higher Production Throughput	38
On-line Inspection	38
Uniform Polishing Rate	38
Reduction of Polishing Defects	39
LATEST TECHNOLOGICAL DEVELOPMENTS, 2005 TO PRESENT	39
Electro-chemical Mechanical Polishing	39
Apparatuses and Methods for In-situ Endpoint Detection	40
Laser Interferometer Detector	40
Combined Eddy Current Sensing and Optical Monitoring	41
System for Endpoint Detection in Copper Damascene Process	41
Polishing Equipment with Pad Drum	42
Chemical Mechanical Polishing Equipment with Rotating Belt	42
CMP Equipment with Electromagnetic Coil	43
CURRENT MARKET STATUS	43
Current Market Summary	43
Revenues by Equipment Type	43
TABLE 10 SEMICONDUCTORS: REVENUES BY REGION, THROUGH 2008 ($ BILLIONS)	44
FIGURE 6 SEMICONDUCTORS: REVENUES BY REGION, 2003-2008 ($ BILLIONS)	44
TABLE 11 CMP AND POST-CMP EQUIPMENT: GLOBAL REVENUES BY TYPE, THROUGH 2008 ($ MILLIONS)	45
FIGURE 7 CMP AND POST-CMP EQUIPMENT: GLOBAL REVENUES, 2003-2008 ($ MILLIONS)	46
FIGURE 8 CMP AND POST-CMP EQUIPMENT: MARKET SHARE BY TYPE, 2008 (%)	46
The Post-CMP Equipment Market	47
TABLE 12 POST-CMP EQUIPMENT: GLOBAL REVENUES BY PROCESS TYPE, 2008	47
Revenues by Application	47
TABLE 13 CMP AND POST-CMP EQUIPMENT: GLOBAL REVENUES BY APPLICATION, 2008 ($ MILLIONS)	48
FIGURE 9 CMP AND POST-CMP EQUIPMENT: MARKET SHARE BY APPLICATION, 2008 (%)	48
Revenues by Region	48
TABLE 14 CMP AND POST-CMP EQUIPMENT: REVENUES BY REGION, THROUGH 2008 ($MILLIONS)	50
FIGURE 10 CMP AND POST-CMP EQUIPMENT: MARKET SHARE BY REGION, 2008 (%)	50
MARKET GROWTH TRENDS	51
Semiconductor Industry Growth	51
TABLE 15 FORECAST - SEMICONDUCTORS: REVENUES BY REGION, THROUGH 2013 ($BILLIONS)	51
FIGURE 11 FORECAST - SEMICONDUCTORS: MARKET GROWTH BY REGION, 2008 AND 2013 ($ BILLIONS)	52
Industry Growth for Other Emerging Applications	52
Data Storage Media	53
TABLE 16 FORECAST - HARD DISK DRIVES: GLOBAL PRODUCTION BY TYPE, THROUGH 2013 (MILLION UNITS)	53
FIGURE 12 FORECAST � HARD DISK DRIVES: PRODUCTION SHARE BY TYPE, 2013 (% UNITS)	54
TABLE 17 FORECAST - HARD DISKS: GLOBAL PRODUCTION BY TYPE, THROUGH 2013 (MILLION UNITS)	55
FIGURE 13 FORECAST � HARD DISKS: GLOBAL PRODUCTION BY TYPE, 2008 AND 2013 (MILLION UNITS)	55
FIGURE 14 FORECAST � HARD DISKS: PRODUCTION SHARE BY TYPE, 2013 (% UNITS)	56
Recording Heads	56
Advanced Displays	57
TABLE 18 FORECAST � FLAT PANEL DISPLAYS: GLOBAL REVENUES BY TYPE, THROUGH 2013 ($BILLIONS)	57
FIGURE 15 FORECAST � FLAT PANEL DISPLAYS: GLOBAL REVENUES BY TYPE, 2008 AND 2013 (MILLION UNITS)	58
FIGURE 16 FORECAST - FLAT PANEL DISPLAYS: MARKET SHARE BY TYPE, 2013 (%)	58
Optics	59
TABLE 19 FORECAST � OPTICS: GLOBAL MARKET GROWTH, THROUGH 2013 ($ BILLIONS)	59
Technological Trends	59
Regional Trends	60
PROJECTED MARKET FOR CMP AND POST-CMP EQUIPMENT	61
Key Observations

Chapter- 5: GLOBAL INDUSTRY STRUCTURE

GLOBAL INDUSTRY STRUCTURE	121
SUPPLIERS OF CMP EQUIPMENT AND MATERIALS	122
TABLE 52 MANUFACTURERS OF CMP EQUIPMENT, SLURRIES, AND CONSUMABLES	122
TABLE 53 MANUFACTURERS OF CMP EQUIPMENT AND MATERIALS, BY PRODUCT CATEGORY	125
FIGURE 39 MANUFACTURERS OF CMP EQUIPMENT AND MATERIALS: DISTRIBUTION BY SIZE, 2007 (NUMBER OF COMPANIES)	128
FIGURE 40 HISTORICAL GROWTH OF PRODUCERS OF CMP EQUIPMENT AND MATERIALS, 1995-2000+ (NUMBER OF COMPANIES)	129
TABLE 54 NOTABLE INDUSTRY CHANGES SINCE 2000	130
CMP EQUIPMENT AND MATERIALS: PRODUCTION BY REGION	131
TABLE 55 CMP EQUIPMENT AND MATERIALS: MANUFACTURING BY REGION, 2006-2013 (PERCENT OF SALES)	132
CMP EQUIPMENT AND MATERIALS: CONSUMPTION BY REGION	132
TABLE 56 CMP EQUIPMENT AND MATERIALS: CONSUMPTION BY REGION, 2006-2013 (PERCENT OF SALES)	133
COMPANY PROFILES	133
3M	133
APPLIED MATERIALS	134
CABOT MICROELECTRONICS	136
TABLE 57 CABOT MICROELECTRONICS - CMP SLURRIES	136
DUPONT AIR PRODUCTS NANOMATERIALS	138
TABLE 58 DA NANOMATERIALS - CMP SLURRIES	139
EBARA CORP.	140
FERRO CORPORATION	141
FUJIMI	143
HITACHI CHEMICAL	145
JSR CORPORATION	146
LAM RESEARCH	147
NIHON MICRO COATING	148
NOVELLUS SYSTEMS	149
PRAXAIR	151
ROHM AND HAAS	152
TABLE 59 ROHM AND HAAS - CMP SLURRIES AND CLEANING SOLUTIONS	153
TOKYO ELECTRON	155
TOP PLAYERS MARKET SHARE	156
CMP AND POST-CMP EQUIPMENT	156
TABLE 60 CMP AND POST-CMP EQUIPMENT: MARKET SHARE OF TOP 5 MANUFACTURERS, 2007 AND 2008	156
FIGURE 41 CMP AND POST-CMP EQUIPMENT: MARKET SHARE BY COMPANY, 2007 (%)	157
CMP SLURRIES	157
TABLE 61 CMP SLURRIES: MARKET SHARE OF TOP 5 MANUFACTURERS, 2007 AND 2008	158
FIGURE 42 CMP SLURRIES: MARKET SHARE BY COMPANY, 2007 (%)	158
PADS AND OTHER CMP CONSUMABLES	158
TABLE 62 PADS AND OTHER CMP CONSUMABLES: MARKET SHARE OF TOP 5 MANUFACTURERS, 2007 AND 2008	159
FIGURE 43 PADS AND OTHER CMP CONSUMABLES: MARKET SHARE BY COMPANY, 2007 (%)

Chapter- 6: INDUSTRY COMPETITIVENESS

CHEMICAL MECHANICAL POLISHING DEVELOPMENT ACTIVITIES	160
TABLE 63 RESEARCH ORGANIZATIONS INVOLVED IN CHEMICAL MECHANICAL POLISHING, WORLDWIDE	160
UNITED STATES	165
Clarkson University	165
TABLE 64 CLARKSON UNIVERSITY RESEARCH	166
Massachusetts Institute of Technology	166
TABLE 65 MIT RESEARCH	167
National Institute of Standards and Technologies	167
TABLE 66 NIST RESEARCH	168
Rensselaer Polytechnic Institute	168
TABLE 67 RENSSELAER POLYTECHNIC INSTITUTE RESEARCH	169
University of Florida at Gainesville	169
TABLE 68 UNIVERSITY OF FLORIDA RESEARCH	170
EUROPE	171
Interuniversitair Microelektronica Centrum, Belgium	171
TABLE 69 IMEC CMP RESEARCH	171
University of Twente, The Netherlands	172
TABLE 70 UNIVERSITY OF TWENTE RESEARCH	172
ASIA PACIFIC	172
Hanyang University, South Korea	172
TABLE 71 HANYANG UNIVERSITY RESEARCH	173
Kyushu University, Japan	173
TABLE 72 KYUSHU UNIVERSITY RESEARCH	174
Nanyang Technological University, Singapore	174
TABLE 73 NTU RESEARCH	175
SUMMARY OF GLOBAL R&D ACTIVITIES IN CMP TECHNOLOGY	175
FIGURE 44 CURRENT GLOBAL RESEARCH AND DEVELOPMENT BY SUBJECT (%)	176
Industry Initiatives	177
TABLE 74 PRIVATE ORGANIZATIONS INVOLVED IN CMP RESEARCH	177
OTHER CONSIDERATIONS	178
COST FACTOR	178
Equipment Cost	178
Materials Cost	179
QUALITY FACTOR	179
TECHNOLOGY FACTOR	180
MANUFACTURING CAPABILITY	180
KEY GROWTH MARKETS	181
TABLE 75 GLOBAL GROWTH FORECAST FOR CURRENT AND POTENTIAL CMP APPLICATIONS, 2008-2013	182
MARKET GROWTH FACTORS	183
DRIVING FORCES	183
IMPACT OF MARKET GROWTH FACTORS	184
TABLE 76 PERCENTAGE IMPACT OF MAJOR COMPETITIVE FACTORS ON THE GROWTH OF THE CMP MARKET, 2008-2013

Chapter- 7: U.S. PATENT ANALYSIS

INTRODUCTION	185
SUMMARY OF PATENTS AWARDED DURING THE PERIOD 2006 THROUGH 2008	185
TABLE 77 CHEMICAL MECHANICAL POLISHING � U.S. PATENTS, 2008	186
TABLE 78 CHEMICAL MECHANICAL POLISHING � U.S. PATENTS, 2007	194
TABLE 79 CHEMICAL MECHANICAL POLISHING � U.S. PATENTS, 2006	210
GENERAL TRENDS	231
TABLE 80 CHEMICAL MECHANICAL POLISHING: GLOBAL PATENT TRENDS, 2006-2008	232
FIGURE 45 CHEMICAL MECHANICAL POLISHING: GLOBAL PATENT TRENDS, 2006-2008 (NUMBER OF PATENTS)	232
TRENDS BY COUNTRY AND REGION	232
FIGURE 46 SHARES OF GLOBAL PATENTS RELATED TO CHEMICAL MECHANICAL POLISHING BY REGION, 2006-2008 (%)	233
FIGURE 47 CHEMICAL MECHANICAL POLISHING: PATENTS BY COUNTRY, 2006-2008 (%)	234
TRENDS BY ASSIGNEE	235
TABLE 81 ASSIGNEES OF U.S. PATENTS RELATED TO CHEMICAL MECHANICAL POLISHING, 2006-2008	236
TRENDS BY PATENT CATEGORY	240
FIGURE 48 CHEMICAL MECHANICAL POLISHING: SHARES OF GLOBAL PATENTS BY CATEGORY, 2006-2008 (%)	241
TRENDS BY APPLICATION	241
FIGURE 49 CHEMICAL MECHANICAL POLISHING: SHARES OF GLOBAL PATENTS BY APPLICATION, 2006-2008 (%)	242
TRENDS BY MATERIAL TYPE	243
FIGURE 50 CHEMICAL MECHANICAL POLISHING: SHARES OF GLOBAL PATENTS BY MATERIAL TYPE, 2006- 2008 (%)

Additional Information

Number of Pages: 237

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