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This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes < 100 nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and projection of the worldwide chemical market; and Trends in usage as devices features decrease.
TABLE OF CONTENTS
Chapter 1 Introduction
Chapter 2 Executive Summary
2.1 Key Industry Trends
2.2 Market Outlook
2.3 Supplier Opportunities
Chapter 3 IC Industry Trends
3.1 IC Industry Growth Forecast
3.2 Trends in IC Processing Technology
Chapter 4 Liquid Chemicals
4.1 Technology Issues
4.1.1 Acids and Solvents
4.1.2 Resists
4.2 Purity Requirements
4.2.1 Purification Methods
o Trends For Purity - Trace Elements
4.2.2 Particulates
o Effects on Yield
o Particulate Removal Techniques
o Particle Monitoring
4.3 Chemical Management
4.3.1 Introduction
4.3.2 Chemical Usage Reduction
Chapter 5 Gases
5.1 Technology Issues
5.2 Requirements
5.2.1 Purification Alternatives
o Historical Perspective
o Trends For Purity - Consistency
5.2.2 Particulate Considerations
o Particle Monitoring
o Filtration Methods
5.2.3 Summary
Chapter 6 Sputtering and Evaporation Materials
6.1 Technology Issues
6.2 Purity Requirements
Chapter 7 Market Forecast
7.1 Market Driving Forces & Assumptions
7.2 Chemicals and Materials Forecast
7.2.1 Forecast By Chemical and Material
7.2.2 Chemical Use Per Unit Area Of Silicon Processed
7.2.3 Market Shares
Chapter 8 Strategic Customer Issues
8.1 Benchmarking a Vendor
8.1.1 Statistical Quality Control
o Assay and Related Items
o Trace Elements
o Particles
8.1.2 Analytical Capabilities
8.1.3 Product Manufacturing And/Or Sourcing
8.1.4 General Considerations
o Installation and Retrofitting Costs
8.2 In-House Quality Control And Assurance
8.2.1 Analytical Tools
8.2.2 How Much Testing
8.2.3 Exhaust Gas Analysis
LIST OF FIGURES
4.1 Relationship Between Device Yield and Particles
4.2 Relationship Between Die Yield and Chip Size
4.3 Chemical Management Services Tasks
6.1 ITRS Roadmap
6.2 Gate-Last Approach
6.3 Gate-First Approach
7.1 Chemical/Semiconductor Revenue Ratio
7.2 Worldwide Resist Market
7.3 Resist/Semiconductor Revenue Ratio
7.4 2009 Silicon Wafer Market
7.5 2013 Silicon Wafer Market
7.6 Cost of Chemicals Per Square Inch of Silicon
7.7 2009 Worldwide Market Shares for Gas Suppliers
7.8 2009 Worldwide Market Shares for Liquid Chemical Suppliers
7.9 2009 Worldwide Market Shares for Photoresist Suppliers
7.10 2009 Worldwide Market Shares for Sputtering Target Suppliers
7.11 2009 Worldwide Market Shares for Silicon Wafer Companies
7.12 Pricing Trend For Silicon Wafers
LIST OF TABLES
4.1 Common Wafer Processing Chemicals
4.2 Photoresist Stripping Solutions
5.1 Gas Control System Issues
5.2 Potential Hazards of Processing Gases
7.1 Worldwide Forecast of Chemicals and Materials for IC Manufacture 2007-2013
7.2 Worldwide Market Forecast of Si Wafers 2007-2013
7.3 Worldwide Market Forecast of Sputtering Targets 2007-2013
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