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This report covers the design analysis of an Ericsson WCDMA 2100MHz RRU22 21IV40 40W Remote Radio Unit. This unit is part of the RBS3418/3518 WCDMA base station platform for Ericsson. The unit was manufactured in Q1 2008.
Key Findings:
Component and semiconductor suppliers mentioned in this report include: Analog Devices, Altera, Anaren Microwave, ATC, Atmel, Avago Technologies, Coilcraft, Epcos AG, Epson Toyocom. Fairchild Semiconductor, Freescale Semiconductor, Fujitsu Microelectronics, Hittite Microwave, Infineon Technologies, Integrated Device Technology, International Rectifier, Linear Technology, M/A-COM, Maxim Integrated Products, Micron, National Semiconductor, NDK, Nippon Chemi-Con, NXP Semiconductors, ON Semiconductor, RF MicroDevices, Skyworks Solutions, STMicroelectronics, Texas Instruments, TriQuint Semiconductors and Xilinx.
Important Note: There is NO component pricing contained within the report.
TABLE OF CONTENTS
EXECUTIVE SUMMARY
Active/Passive Component Summary
CHAPTER 1: ERICSSON W-CDMA BBU/RRU SYSTEM
Overview of RBS3402/3418/3518 BBU/RRU Product Offering
CHAPTER 2: RRU 22IV40 MECHANICAL ANALYSIS
Mechanical Analysis
Sun Shield/Mounting Frame
RRU Metal Mounting Frame
Digital System Housing (RRU Chassis)
Fan Unit
Digital/RF Cables
CHAPTER 3: RRU POWER SUPPLY SUBSYSTEM/ALARM INDICATOR PANEL
Alarm Indicator Panel
CHAPTER 4: RRU TRX SUBSYSTEM
Digital Processor and TRx PCB
Area A: Baseband Signal Processing
Area B: Power Management
Area C: TRx Dual RF Transmitter
Area D: TRx Diversity Receiver
Area E: Tx Timing Section
Area F: Tx RF Sampling Circuit
Area G: Receiver Timing
Fiber Optic Transceiver PCB
TRx RF Shield
CHAPTER 5: RRU22 RF SUBSYSTEM
RRU RF Power Amplifier
RF Power Amplifier Shield
RF Power Amplifier Heat Sink
RRU RF Subsystem Duplexer Cavity Filter/TMA
Area X: Low Noise Amplifier
Area Y: Power Management
Area Z: TMA Scanning Receiver
APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS
LIST OF TABLES
Table 1: Ericsson W-CDMA RRU Types
Table 2: RRU RF/Digital Cables Bill of Materials
Table 3: RRU Protection Circuit Bill of Materials
Table 4: Alarm Indicator Panel Bill of Materials
Table 5: Area A Bill of Materials
Table 6: Area B Bill of Materials
Table 7: Area C Bill of Materials
Table 8: Area D Bill of Materials
Table 9: Area E Bill of Materials
Table 10: Area F Bill of Materials
Table 11: Area G Bill of Materials
Table 12: RRU Fiber Optic Transceiver PCB Module Bill of Materials, Top
Table 13: RRU Fiber Optic Transceiver PCB Module Bill of Materials, Bottom
Table 14: RF Power Amplifier Area I Bill of Materials
Table 15: RF Power Amplifier Area J Bill of Materials
Table 16: Area X Bill of Materials
Table 17: Area Y Bill of Materials
Table 18: Area Z Bill of Materials
Table 19: Passive Component Case Size Distribution by System Subsection
Table 20: Identified Passive Component Supplier Distribution by System Subsection
Table 21: Active/Passive Component Distribution by System Subsection
Table 22: Active Semiconductor/Component Vendor Distribution by System Subsection
LIST OF EXHIBITS
Exhibit 1: Ericsson RBS3000 W-CDMA NodeB System
Exhibit 2: Ericsson RRU 22IV40 System Block Diagram
Exhibit 3: RRU Sun Shield External View
Exhibit 4: RRU Sun Shield Internal View
Exhibit 5: RRU Mounting Frame w/brackets
Exhibit 6: RRU Mounting Frame External/Internal Views
Exhibit 7: RRU Mounting Frame Side Views
Exhibit 8: RRU FCC ID Label
Exhibit 9: RRU Fan Unit, External with Cover Removed
Exhibit 10: RRU Fan Unit, Internal
Exhibit 11: RRU, Top View with Fan Unit (L), Bottom View w/o Fan Unit (R)
Exhibit 12: RRU, End View
Exhibit 13: RRU Chassis Internal View
Exhibit 14: RRU RF Cables Diagram
Exhibit 15: RRU Power Supply Product Label
Exhibit 16: RRU Power Supply Front/Back Views
Exhibit 17: RRU Power Supply Side View
Exhibit 18: RRU Protection Circuit PCB Component Diagram, Top View
Exhibit 19: RRU Protection Circuit PCB, Bottom View
Exhibit 20: RRU Alarm Indicator Panel Circuit Component Diagram
Exhibit 21: RRU Digital Processor/TRX PCB, Top View
Exhibit 22: RRU Digital Processor/TRX PCB, Bottom View
Exhibit 23: Area A Component Diagram
Exhibit 24: Area B Component Diagram
Exhibit 25: Area C Component Diagram
Exhibit 26: Dual Tx Path Block Diagram
Exhibit 27: Area D Component Diagram
Exhibit 28: Diversity Dual Rx Block Diagram
Exhibit 29: Area E Component Diagram
Exhibit 30: Area F Component Diagram
Exhibit 31: RRU Transmit (Tx) Sampling receiver Path Block Diagram
Exhibit 32: Area G Component Diagram
Exhibit 33: RRU Fiber Optic TRx Module
Exhibit 34: Fiber Optic TRx Metal Cover
Exhibit 35: RRU Fiber Optic Transceiver
Exhibit 36: RRU Fiber Optic Transceiver PCB Module Component Diagram, Top View
Exhibit 37: RRU Fiber Optic Transceiver PCB Module Component Diagram, Bottom View
Exhibit 38: TRx RF Shield External View
Exhibit 39: TRx RF Shield Internal View
Exhibit 40: RRU RF Subsystem Internal View
Exhibit 41: Tx Path Block Diagram
Exhibit 42: RRU RF Power Amplifier Area I Component Diagram
Exhibit 43: RRU RF Power Amplifier Area J Component Diagram
Exhibit 44: RF Power Transistor Clamp Assembly
Exhibit 45: RF Power Amplifier PCB, Bottom View
Exhibit 46: RF Power Amplifier Shield, External View
Exhibit 47: RF Power Amplifier Shield, Internal View
Exhibit 48: RF Power Amplifier Heat Sink, Internal View
Exhibit 49: RF Power Amplifier Heat Sink, Side View
Exhibit 50: RF Power Amplifier Heat Sink, External View
Exhibit 51: RRU Duplexer Filter/TMA, Top View
Exhibit 52: RRU Duplexer Filter/TMA, Bottom View
Exhibit 53: RRU Duplexer/TMA RF Shield, Internal View
Exhibit 54: RRU Duplexer Filter Tuning Screws
Exhibit: 55: RRU Duplexer Filter Tx/Rx Paths
Exhibit 56: RRU TMA PCB, Bottom View
Exhibit 57: RRU TMA/Duplexer Filter Baseplate
Exhibit 58: RRU TMA, Top View
Exhibit 59: Area X Component Diagram
Exhibit 60: TMA Block Diagram
Exhibit 61: Area Y Component Diagram
Exhibit 62: Area Z Component Diagram
Exhibit 63: Passive Component Case Size Distribution
Exhibit 64: Identified Passive Component Market Share by Vendor
Exhibit 65: Active Semiconductor Component Share
Exhibit 66: High Pin Count IC vs. Discrete
Exhibit 67: Active Semiconductor Market Share by Vendor
Exhibit 68: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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