Physical Analysis of the Device, Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price

Electronics.ca Publications is proud to publish the reverse costing report of the new generation of MEMS oscillator supplied by Discera. The DSC8002 is a programmable CMOS oscillator incorporating a Silicon MEMS resonator. Thanks to the TSV technology of Silex Microsystems (TSI™, Through Silicon Insulator), this new generation of Discera wafer-level packaged MEMS resonator achieves an area of ~0.3mm². The DSC8002 is available in industry standard packages (2.5 x 2.0 x 0.85 mm, 3.2 x 2.5 x 0.85 mm, 5.0 x 3.2 x 0.85 mm and 7.0 x 5.0 x 0.85 mm) and can replace standard crystal oscillators.

This report provides complete teardown of the MEMS oscillator with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth economical analysis
• Manufacturing cost breakdown
• Selling price estimation

Benefits:

- Analyze the cost of projects at the R&D level
- Enhance the negotiation power of purchasing managers
- Benchmark competitor’s products

TABLE OF CONTENTS

Glossary

Overview/Introduction
 Executive Summary
 Reverse Costing Methodology

Discera Company Profile
 Product Range
 Business Model

Physical analysis
 Physical Analysis Methodology
 Package Characteristics & Markings
 Package Opening
 Package Cross-Section
 ASIC – Dimensions
 ASIC – Markings
 ASIC – Optical Views
 ASIC – Delayering
 ASIC – Cross-Section
 ASIC Process Characteristics
 MEMS – Dimensions & Markings
 MEMS – Cap Opening
 MEMS – Resonator
 MEMS – Cap
 MEMS – Cross-Section
 MEMS Process Characteristics
 Comparison with Previous Generation

Manufacturing Process Flow
 Overview
 MEMS Process Flow
 Description of the Wafer Fabrication Units

Cost Analysis
 Synthesis of the Cost Analysis
 Main Steps of Economic Analysis
 Supply Chain Analysis
 Manufacturers financial ratios
 Yields Explanation
 Yields Hypotheses
 ASIC Front-End Cost
 ASIC Back-End 0 Cost (Probe Test and Dicing)
 ASIC Die Cost (Front End + Back End 0)
 MEMS Front-End Cost
 MEMS Front-End Cost per Process Steps
 MEMS Front-End : Equipment Cost per Family
 MEMS Front-End : Material Cost per Family
 MEMS Back-End 0 Cost (Probe Test and Dicing)
 MEMS Die Cost (Front End + Back End 0)
 Back-End 1 : Packaging Cost
 Back-End 1 : Final Test Cost
 DSC8002 Component Cost (FE + BE 0 + BE 1) Estimated Manufacturer Price Analysis Conclusion

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 -  On demand Reverse Costing studies are performed on ICs, ASICs, MEMs, Power Devices, ECUs, electronic boards and full electronic systems

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COSTING TOOLS :

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 Cost Simulation Tools
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