Electronic Materials & Packaging (EM&P) is an international bi-monthly review of technical and business developments in electronics packaging and assembly technology. Providing news updates, market information, Patents, informed comment and technical advice in a concise, accessible and readable format, it includes regular coverage of new products, new techniques and analysis of packaging and assembly trends.

EM&P aims to help the technical manager and engineer with the implementation of packaging and assembly technology such as surface mount, tape automated bonding and multi-chip modules, through feature articles and reviews written by industry experts.

The major highlight of the electronic packaging future would seem to lie in the fields of Wafer Scale and Chip Scale Packaging along with Ball Connect Technology, Copper Posts and Redistribution techniques. EM&P will keep its readers fully up-to-date in these specific areas. General coverage includes:

• Fine pitch
• Multi-chip modules
• Conductive adhesives
• Design and test
• Thick/thin film hybrids
• Chip Stacking
• Contract assembly
• Green electronics
• Lead-free assembly & hazardous substances
• Surface mount technology
• COB , TAB and flip-chip thermal management
• Chip-scale packaging
• Wafer level packaging
• Copper Posts
• Redistribution Techniques

Any further developments in this area will be followed up and thoroughly reported.