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Electronic Thermal Management - A Global Strategic Business Report

Price:
USD $4,950.00
ISBN/SKU #:
GIA-MCP1523
Research Group:
Global Industry Analysts
Date of Publication:
November 2010
Select License:



Summary

This report analyzes the worldwide markets for Electronic Thermal Management in US$ Million by the following end-use segments:  Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, the report provides market analytics for the Global and US market for the product segments - Hardware, Software, and Interfaces & Substrates. Annual estimates and forecasts are provided for the period 2007 through 2015. A six-year historic analysis is also provided for these markets. The report profiles 158 companies including many key and niche players such as  II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansys, Inc., Ansoft Corporation, Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., Ceramics Process Systems Corporation, Chomerics, Comair Rotron, Inc., Cookson Electronics Assembly Materials, Cool Innovations, Inc., Cooler Master Co., Ltd., C-Therm Technologies Ltd., CTS Corporation, Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Ferraz Shawmut, LLC, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mentor Graphics Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc.., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc.., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc.., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., Tennmax United, The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

TABLE OF CONTENTS

ELECTRONIC THERMAL MANAGEMENT 							MCP-1523
A GLOBAL STRATEGIC BUSINESS REPORT


                                            CONTENTS



  1. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS                       1
      Study Reliability and Reporting Limitations                          1
      Disclaimers                                                          2
      Data Interpretation & Reporting Level                                3
       Quantitative Techniques & Analytics                                 3
      Product Definitions and Scope of Study                               3
       End-Use Segments                                                    4
        1. Computers                                                       4
        2. Telecom                                                         4
        3. Medical/Office Equipment                                        4
        4. Industrial/Military                                             4
        5. Consumer Electronics                                            5
        6. Automotive                                                      5
       Product Segments                                                    5
        1. Hardware                                                        5
        2. Software                                                        5
        3. Interfaces and Substrates                                       5

  2. INDUSTRY OVERVIEW                                                     6
      Sophisticated Technology Needs Effective Thermal Management          6
      Current and Future Analysis                                          6
       Regional Perspective                                                6
       End-Use Perspective                                                 6
       Product Segment Perspective                                         7

  3. MARKET TRENDS                                                         8
      Recession Impacts the Market                                         8
      Rising Complexities Present Lucrative Opportunities for
       Electronic Thermal Management                                       8
      PC Market Stimulates Growth                                          8
      Thermal Management Subsystems Set for Robust Growth                  8
      New Technologies Under Development                                   9
      Liquid Cooling Gaining Foothold                                      9
      Semiconductor Manufacturers Look for Thermal Management
       Technology                                                          9
      Heat Pipe Gains Popularity among PC Manufacturers                    10
      Imminent Growth for ICs                                              10

  4. PRODUCT OVERVIEW                                                      11
      Thermal Management - A Critical Function                             11
      Electronic Thermal Management Products                               11
       Hardware                                                            11
        Heat Sinks                                                         11
        Heat Pipes                                                         11
        Micro Channels                                                     12
        Spray Cooling                                                      12
        Electronic Cooling Fans                                            12
        Metal Backplanes                                                   12
        BGAs                                                               13
       Software                                                            13
        Computational Methods of Heat Transfer (CHT) and Fluid
         Dynamics (CFD)                                                    13
        Electronic Design Automation (EDA) Software, Electronic
         Computer Aided Design (ECAD) Software, and Technology
          Computer Aided Design (TCAD) Software                            13
       Interfaces and Substrates                                           14
        Thermal Compounds and Thermal Interface Materials                  14
      Thermal Management Applications                                      15
       Computers                                                           15
        Notebooks/Laptops                                                  15
        Servers                                                            16
        Embedded PCs                                                       16
       Telecom                                                             16
       Medical                                                             16
       Industrial Electronics                                              17
       Aerospace/Military                                                  17
       Consumer Electronics                                                17
       Automotive                                                          17

  5. COMPETITIVE ENVIRONMENT IN RECENT PAST                                18
      Thermal Management - A Fragmented Market                             18
       Table 1: Leading Vendors in the Worldwide Thermal Management
       Market (2006 & 2007) - Percentage Breakdown by Value Sales
       for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and
       Others (includes corresponding Graph/Chart)                         18
      Thermal Management Hardware Market                                   19
       Table 2: Leading Players in the Worldwide Thermal Management
       Hardware Market (2006 & 2007) - Percentage Breakdown by Value
       Sales for Aavid Thermalloy, Thermacore, Lytron, and Others
       (includes corresponding Graph/Chart)                                19
      Fluent - The Undisputed Thermal Management S/W Market Leader         20
       Table 3: Leading Players in the Worldwide Thermal Management
       Software Market (2006 & 2007) - Percentage Breakdown by Value
       Sales for Fluent, Ansys, Flomerics, Daat, and Others
       (includes corresponding Graph/Chart)                                20
      Chomerics and Bergquist Lead Thermal Management Interface Market     21
       Table 4: Leading Players in the Worldwide Thermal Management
       Interface Market (2006 & 2007) - Percentage Breakdown by
       Value Sales for Chomerics, Bergquist, Aavid Thermalloy,
       Lytron, and Others (includes corresponding Graph/Chart)             21
      Amkor Dominates Thermal Management Substrate Market                  22
       Table 5: Leading Players in the Worldwide Thermal Management
       Substrate Market (2006 & 2007) - Percentage Breakdown by
       Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and
       Others (includes corresponding Graph/Chart)                         22

  6. PRODUCT INTRODUCTIONS/INNOVATIONS                                     23
      LORD Unveils MT-815 Low Modulus Increased Thermal Conductivity
       Adhesive                                                            23
      Thermaltake Introduces Thermaltake SlimX3                            23
      Honeywell Electronic Materials Launches Honeywell PCM45M-SP          23
      AdaptivCool Develops HotSpotr HT-510                                 24
      Nuventix Introduces SynJet Spot Light Cooler                         25
      DSM Engineering Plastics Unveils Thermally Conductive PA46
       Material                                                            25
      Micropelt Launches MPC-D40x Thermoelectric Coolers                   25
      Pfannenberg Unveils New DTS 3000 Side-Mount Cooling Units            26
      California Micro Devices Launches LuxGuard™ CM1771                   26
      Honeywell Unveils Pb-free Die Attach Solder                          26
      Nuventix Introduces New Line of SynJet Coolers                       27
      Indium Launches Heat-Spring® Thermal Interface Material              27
      Parker Hannifin Launches Two-Phase Liquid Cooling System             28
      Nuventix and National Semiconductor Launch Electronic Drive
       and Reference Design                                                28
      Honeywell International Unveils Honeywell PTM 3180                   29
      RS Components Unveils New Thermal Management Solutions               29
      Arun Components Launches Alutronic Line of Heatsink Systems          30
      Nextreme Thermal Solutions Introduces New Series of OptoCooler
       High Voltage Modules                                                30
      Vette Introduces Aluma-Cop Liquid Cooling                            31
      SprayCool Launches Multi-Platform Enclosure                          31
      Celsia Technologies Unveils Advanced NanoSpreader                    31
      STABLCOR Introduces ST10-LC909 Products                              32

  7. PRODUCT INNOVATIONS/LAUNCHES IN RECENT PAST - A PERSPECTIVE
     BUILDER                                                               33
      SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs               33
      LORD Develops Materials for Thermal Management                       33
      Dow Corning Introduces New Thermally Conductive Compound             33
      Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures            34
      Dell Develops a Liquid-Cooled Heat Sink                              34
      Fujipoly America Develops an Innovative Thermal Interface
       Material                                                            34
      Flomerics to Offer T3Ster Thermal Testing System                     34
      Andigilog® Develops ThermalEdge™ Cooling Technology                  34
      Andigilog® Introduces Thermal Management Solutions                   35
      Celsia Releases MicroSpreader™                                       35
      Sunon Develops Liquid Circulation Cooling System                     35
      EBM-PAPST Develops Advanced Liquid Cooling System                    36
      EBM-PAPST Introduces New Fan-Cooling Technology                      36
      Hybricon Introduces Liquid-Cooled ATR Chassis                        36
      Ansoft Launches Latest Version of ePhysics as ePhysics v2            37
      CTS Launches New Line of Low-Profile Forged Heat Sinks               37
      Honeywell Introduces Screen Printable Phase Change Material in
       Chip Manufacture                                                    37
      Laird Launches Thermally Conductive, Electrically Insulating
       T-preg™ HTD for PCBs                                                38
      Laird Introduces Deep Drawing Capability for Shielding
       Applications                                                        38
      Laird Introduces Low-Cost T-Gard™ for SMPS Devices                   38
      Laird Introduces T-Gard™ 500 High Performance Insulator for
       Automotive Industry                                                 39
      Jaro Develops 450 CFM AC Cooling Fan for Industrial Use              39
      Jaro Develops IC Cooling Fan With High Flow and Cooling Value        39
      Mathis Develops Mathis TCi™ For Improved Thermal Conductivity
       Testing                                                             39
      Melcor Introduces Extrusion Heat Sinks With Improved Performance     39
      Fluent Launches New Environmental Thermal Audit Solution for
       Data Centers                                                        40
      Kooltronic Introduces Advanced Enclosure Accessories                 40
      Pfannerberg Develops Filterfan®                                      40

  8. RECENT INDUSTRY ACTIVITY                                              41
      Thermacore Snaps Up Pittsburgh Materials Technology                  41
      Parker Hannifin Takes Over SprayCool                                 41
      Dow Kokam Acquires Societe de Vehicles Electriques                   41
      BorgWarner Establishes Manufacturing Plant                           42
      MAHLE Acquires Majority Stake in BEHR Industry                       42
      CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling    42
      Curtiss-Wright Snaps Up EST Group                                    43
      Arlington Capital Partners Acquires J.A. Reinhardt                   43
      Thermacore Takes Over k Technology                                   43
      IBM Collaborates with Vette                                          44
      Bias Power Collaborates with Nuventix                                44
      Roal Electronics Collaborates with Nuventix                          45
      Electronic Environments Inks Partnership Agreement with
       AdaptivCool                                                         45
      Asetek Forms Alliance with Corsair                                   45
      AdaptivCool and Yamatake Sign Agreement                              46
      Toyal America forms Alliance with E.W. Kaufmann                      46
      Stablcor and Elvia PCB Group Ink Licensing Agreement                 46
      Weidmann Electrical Technology and LumaSense Technologies Ink
       Strategic Partnership Agreement                                     46
      Thermacore Bags Contract from Defense Advanced Research
       Projects Agency                                                     47
      Waytronx Takes Over CUI                                              47
      Photochemie Signs Licensing Agreement with Stablcor                  47
      ON Semiconductor Establishes Research and Development Centre         48
      Stablcor and Graphic Ink Licensing Agreement                         48
      Texas Instruments Takes Over Commergy Technologies                   48
      Thermal Energy International Takes Over Gardner Energy Management    48
      nCoat Inks Agreement with BSR Solar Technologies and
       Sunvention USA                                                      48
      CSP Inc. MultiComputer Division Signs Agreement with
       SprayCool® Technologies                                             49
      Mentor Graphics Takes Over Flomerics Group                           49
      Modine Divests Thermacore                                            49

  9. CORPORATE ACTIVITY IN RECENT PAST - A PERSPECTIVE BUILDER             50
      Moog Takes Over Thermal Control Products                             50
      Rensselaer Teams Up with Varsities to Develop Cooling Techniques     50
      Laird Partners with Sager Electronics                                51
      Honeywell to Expand R&D Facility                                     51
      Vette Adds ERM                                                       51
      Laird Takes Over Supercool                                           52
      Arlington Capital Acquires Woven Electronics Through Thermal
       Solutions                                                           52
      Parker Hannifin Purchases Acofab and Adecem                          52
      Ametek Adds Land Instruments                                         52
      Lytron Adds Lockhart Industries                                      53
      Seki Technotron Purchases 10% Interest in sp3 Inc.                   53
      OnScreen Purchases Patent of WayCool Thermal Cooling Technology      53
      Flomerics Acquires NIKA                                              54
      Aavid Merges with Ansys and Spins-Off Thermal Management Business    54
      Celsia and Yeh-Chiang Sign Agreement                                 54
      Nextreme Inks License Deal with Caltech                              54
      Celsia Signs Sales & Development Pact with Lighting Science          55
      Celsia Contracts with Kubo to Expand in Japan                        55
      Hybricon and Parker Hannifin Sign Pact for Cooling Solutions         55
      Rogers and Thermal Transfer Composites Partner                       56
      sp3 Partners with CPS                                                56
      Celsia Teams Up with AET                                             56
      Mathis Forms Distribution Partnership with Setaram
       Instrumentation                                                     57

  10. FOCUS ON SELECT PLAYERS                                              58
         VI, Incorporated (US)                                             58
       Marlow Industries (US)                                              58
      Aavid Thermalloy, LLC (US)                                           58
      Advanced Thermal Solutions, Inc. (US)                                58
      Alcoa, Inc. (US)                                                     59
      Alpha Technologies, Inc. (US)                                        59
      Ametek, Inc. (US)                                                    59
      Amkor Technology, Inc. (US)                                          60
      Ansys, Inc. (US)                                                     60
       Ansoft Corporation (US)                                             61
       Fluent, Inc. (US)                                                   61
      ASAT Holdings Ltd. (Hong Kong)                                       61
      Brush Engineered Materials, Inc. (US)                                62
      Ceramics Process Systems Corporation (US)                            62
      Chomerics (US)                                                       62
      Comair Rotron, Inc. (US)                                             63
      Cookson Electronics Assembly Materials (US)                          63
      Cool Innovations, Inc. (US)                                          63
      Cooler Master Co., Ltd. (UK)                                         64
      C-Therm Technologies Ltd. (Canada)                                   64
      CTS Corporation (US)                                                 64
      Daat Research Corp. (US)                                             65
      Degree Controls, Inc. (US)                                           65
      Dow Corning Corporation (US)                                         65
      Dynatron Corporation (US)                                            65
      Enertron, Inc. (US)                                                  66
      Ferraz Shawmut, LLC (Canada)                                         66
      Fujikura Ltd. (Japan)                                                66
      Henkel Loctite Corporation (US)                                      66
      Honeywell Electronic Materials (US)                                  67
      Intricast Company Inc (US)                                           67
      ITW Vortec (US)                                                      67
      JARO Components, Inc. (US)                                           68
      Kooltronic, Inc. (US)                                                68
      Kyocera Corporation (Japan)                                          68
      Laird Technologies (US)                                              68
      Liebert Corporation (US)                                             69
      Lord Corporation (US)                                                69
      Lytron Incorporated (US)                                             69
      Mentor Graphics Corporation (US)                                     69
      Metal Matrix Cast Composites, LLC (US)                               70
      Micronel U.S. (US)                                                   70
      Netzsch Instruments, Inc. (US)                                       70
      Netzsch Thermal Analysis (Germany)                                   70
      NMB Technologies Corporation (US)                                    71
      Noren Products, Inc. (US)                                            71
      Orient Semiconductor Electronics Ltd. (Taiwan)                       71
      PC Power & Cooling, Inc. (US)                                        71
      Pfannenberg, Inc. (US)                                               72
      PLANSEE Thermal Management Solutions (US)                            72
      Sumitomo Electric Industries, Ltd. (Japan)                           72
      Tech Spray, L. P. (UK)                                               72
      Tellurex Corp. (US)                                                  73
      Tennmax United (US)                                                  73
      The Bergquist Company (US)                                           73
      The Filter Factory, Inc. (US)                                        74
      Thermacore (US)                                                      74
      Transene Company, Inc. (US)                                          74
      U.S. Toyo Fan Corporation (US)                                       75
      United Thermal Engineering Corporation (US)                          75
      Vette Corp. (US)                                                     75
      Wakefield Thermal Solutions, Inc. (US)                               76

  11. GLOBAL MARKET PERSPECTIVE                                            77
      Table 6: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest
      of World Independently Analyzed with Annual Sales Figures in
      US$ Million for Years 2007 through 2015 (includes
      corresponding Graph/Chart)                                           77

      Table 7: World Historic Review for Electronic Thermal
      Management by Geographic Region - US, Canada, Japan, Europe,
      Asia-Pacific (excluding Japan), and Rest of World Markets
      Independently Analyzed with Annual Sales Figures in US$
      Million for Years 2001 through 2006 (includes corresponding
      Graph/Chart)                                                         78

      Table 8: World 11-Year Perspective for Electronic Thermal
      Management by Geographic Region - Percentage Breakdown of
      Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific
      (excluding Japan) and Rest of World Markets for Years 2005,
      2010 & 2015 (includes corresponding Graph/Chart)                     79

      Table 9: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management by Product Segment- Hardware,
      Software, and Interfaces & Substrates Independently Analyzed
      with Annual Sales Figures in US$ Million for Years 2007
      through 2015 (includes corresponding Graph/Chart)                    80

      Table 10: World Historic Review for Electronic Thermal
      Management by Product Segment - Hardware, Software, and
      Interfaces & Substrates Markets Independently Analyzed with
      Annual Sales Figures in US$ Million for Years 2001 through
      2006 (includes corresponding Graph/Chart)                            81

      Table 11: World 11-Year Perspective for Electronic Thermal
      Management by Product Segment - Percentage Breakdown of Dollar
      Sales for Hardware, Software, and Interfaces & Substrates
      Markets for Years 2005, 2010 & 2015 (includes corresponding
      Graph/Chart)                                                         81

      Table 12: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management in Computers by Geographic
      Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
      Japan) and Rest of World Independently Analyzed with Annual
      Sales Figures in US$ Million for Years 2007 through 2015
      (includes corresponding Graph/Chart)                                 82

      Table 13: World Historic Review for Electronic Thermal
      Management in Computers by Geographic Region - US, Canada,
      Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
      World Markets Independently Analyzed with Annual Sales Figures
      in US$ Million for Years 2001 through 2006 (includes
      corresponding Graph/Chart)                                           83

      Table 14: World 11-Year Perspective for Electronic Thermal
      Management in Computers by Geographic Region - Percentage
      Breakdown of Dollar Sales for US, Canada, Japan, Europe,
      Asia-Pacific (excluding Japan) and Rest of World Markets for
      Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)         84

      Table 15: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management in Telecom by Geographic Region
      - US, Canada, Japan, Europe, Asia-Pacific (excluding Japan)
      and Rest of World Independently Analyzed with Annual Sales
      Figures in US$ Million for Years 2007 through 2015 (includes
      corresponding Graph/Chart)                                           85

      Table 16: World Historic Review for Electronic Thermal
      Management in Telecom by Geographic Region - US, Canada,
      Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
      World Markets Independently Analyzed with Annual Sales Figures
      in US$ Million for Years 2001 through 2006 (includes
      corresponding Graph/Chart)                                           86

      Table 17: World 11-Year Perspective for Electronic Thermal
      Management in Telecom by Geographic Region - Percentage
      Breakdown of Dollar Sales for US, Canada, Japan, Europe,
      Asia-Pacific (excluding Japan) and Rest of World Markets for
      Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)         87

      Table 18: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management in Medical/ Office Equipment by
      Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
      (excluding Japan) and Rest of World Independently Analyzed
      with Annual Sales Figures in US$ Million for Years 2007
      through 2015 (includes corresponding Graph/Chart)                    88

      Table 19: World Historic Review for Electronic Thermal
      Management in Medical/Office Equipment by Geographic Region -
      US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
      Rest of World Markets Independently Analyzed with Annual Sales
      Figures in US$ Million for Years 2001 through 2006 (includes
      corresponding Graph/Chart)                                           89

      Table 20: World 11-Year Perspective for Electronic Thermal
      Management in Medical/Office Equipment by Geographic Region -
      Percentage Breakdown of Dollar Sales for US, Canada, Japan,
      Europe, Asia-Pacific (excluding Japan) and Rest of World
      Markets for Years 2005, 2010 & 2015 (includes corresponding
      Graph/Chart)                                                         90

      Table 21: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management in Industrial/Military by
      Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
      (excluding Japan) and Rest of World Independently Analyzed
      with Annual Sales Figures in US$ Million for Years 2007
      through 2015 (includes corresponding Graph/Chart)                    91

      Table 22: World Historic Review for Electronic Thermal
      Management in Industrial/Military by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
      Rest of World Markets Independently Analyzed with Annual Sales
      Figures in US$ Million for Years 2001 through 2006 (includes
      corresponding Graph/Chart)                                           92

      Table 23: World 11-Year Perspective for Electronic Thermal
      Management in Industrial/Military by Geographic Region -
      Percentage Breakdown of Dollar Sales for US, Canada, Japan,
      Europe, Asia-Pacific (excluding Japan) and Rest of World
      Markets for Years 2005, 2010 & 2015 (includes corresponding
      Graph/Chart)                                                         93

      Table 24: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management in Consumer Electronics by
      Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
      (excluding Japan) and Rest of World Independently Analyzed
      with Annual Sales Figures in US$ Million for Years 2007
      through 2015 (includes corresponding Graph/Chart)                    94

      Table 25: World Historic Review for Electronic Thermal
      Management in Consumer Electronics by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
      Rest of World Markets Independently Analyzed with Annual Sales
      Figures in US$ Million for Years 2001 through 2006 (includes
      corresponding Graph/Chart)                                           95

      Table 26: World 11-Year Perspective for Electronic Thermal
      Management in Consumer Electronics by Geographic Region -
      Percentage Breakdown of Dollar Sales for US, Canada, Japan,
      Europe, Asia-Pacific (excluding Japan) and Rest of World
      Markets for Years 2005, 2010 & 2015 (includes corresponding
      Graph/Chart)                                                         96

      Table 27: World Recent Past, Current & Future Analysis for
      Electronic Thermal Management in Automotive by Geographic
      Region - US, Canada, Japan, Europe, Asia-Pacific (excluding
      Japan) and Rest of World Independently Analyzed with Annual
      Sales Figures in US$ Million for Years 2007 through 2015
      (includes corresponding Graph/Chart)                                 97

      Table 28: World Historic Review for Electronic Thermal
      Management in Automotive by Geographic Region - US, Canada,
      Japan, Europe, Asia-Pacific (excluding Japan), and Rest of
      World Markets Independently Analyzed with Annual Sales Figures
      in US$ Million for Years 2001 through 2006 (includes
      corresponding Graph/Chart)                                           98

      Table 29: World 11-Year Perspective for Electronic Thermal
      Management in Automotive by Geographic Region - Percentage
      Breakdown of Dollar Sales for US, Canada, Japan, Europe,
      Asia-Pacific (excluding Japan) and Rest of World Markets for
      Years 2005, 2010 & 2015 (includes corresponding Graph/Chart)         99

  12. UNITED STATES                                                        100
      A.Market Analysis                                                    100
        Current and Future Analysis                                        100
         By End-Use Segment                                                100
         By Product Segment                                                100
        Rising Complexities Present Lucrative Opportunities for
         Electronic Thermal Management                                     100
        Price Pressures and Shifting of Manufacturing to Asia to
         Restrain Growth                                                   100
      B.Market Analytics                                                   101
        Table 30: US Recent Past, Current & Future Analysis for
        Electronic Thermal Management by Product Segment - Hardware,
        Software, and Interfaces & Substrates Markets Independently
        Analyzed with Annual Sales Figures in US$ Million for Years
        2007 through 2015 (includes corresponding Graph/Chart)             101

        Table 31: US Historic Review for Electronic Thermal
        Management by Product Segment - Hardware, Software, and
        Interfaces & Substrates Markets Independently Analyzed with
        Annual Sales Figures in US$ Million for Years 2001 through
        2006 (includes corresponding Graph/Chart)                          102

        Table 32: US 11-Year Perspective for Electronic Thermal
        Management by Product Segment - Percentage Breakdown of
        Dollar Sales for Hardware, Software, and Interfaces &
        Substrates Markets for Years 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         102

        Table 33: US Recent Past, Current & Future Analysis for
        Electronic Thermal Management by End-Use Segment -
        Computers, Telecom, Medical/Office Equipment,
        Industrial/Military, Consumer Electronics, and Automotive
        Markets Independently Analyzed with Annual Sales Figures in
        US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                         103

        Table 34: US Historic Review for Electronic Thermal
        Management by End-Use Segment - Computers, Telecom,
        Medical/Office Equipment, Industrial/Military, Consumer
        Electronics, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2001
        through 2006 (includes corresponding Graph/Chart)                  104

        Table 35: US 11-Year Perspective for Electronic Thermal
        Management by End-Use Segment - Percentage Breakdown of
        Dollar Sales for Computers, Telecom, Medical/Office
        Equipment, Industrial/Military, Consumer Electronics, and
        Automotive Markets for 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         105

  13. CANADA                                                               106
       Market Analysis                                                     106
        Table 36: Canadian Recent Past, Current & Future Analysis
        for Electronic Thermal Management by End-Use Segment -
        Computers, Telecom, Medical/ Office Equipment,
        Industrial/Military, Consumer Electronics, and Automotive
        Markets Independently Analyzed with Annual Sales Figures in
        US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                         106

        Table 37: Canadian Historic Review for Electronic Thermal
        Management by End-Use Segment - Computers, Telecom,
        Medical/Office Equipment, Industrial/Military, Consumer
        Electronics, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2001
        through 2006 (includes corresponding Graph/Chart)                  107

        Table 38: Canadian 11-Year Perspective for Electronic
        Thermal Management by End-Use Segment - Percentage Breakdown
        of Dollar Sales for Computers, Telecom, Medical/Office
        Equipment, Industrial/Military, Consumer Electronics, and
        Automotive Markets for 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         108

  14. JAPAN                                                                109
       Market Analysis                                                     109
        Table 39: Japanese Recent Past, Current & Future Analysis
        for Electronic Thermal Management by End-Use Segment -
        Computers, Telecom, Medical/ Office Equipment,
        Industrial/Military, Consumer Electronics, and Automotive
        Markets Independently Analyzed with Annual Sales Figures in
        US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                         109

        Table 40: Japanese Historic Review for Electronic Thermal
        Management by End-Use Segment - Computers, Telecom,
        Medical/Office Equipment, Industrial/Military, Consumer
        Electronics, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2001
        through 2006 (includes corresponding Graph/Chart)                  110

        Table 41: Japanese 11-Year Perspective for Electronic
        Thermal Management by End-Use Segment - Percentage Breakdown
        of Dollar Sales for Computers, Telecom, Medical/Office
        Equipment, Industrial/Military, Consumer Electronics, and
        Automotive Markets for 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         111

  15. EUROPE                                                               112
       Market Analysis                                                     112
        Table 42: European Recent Past, Current & Future Analysis
        for Electronic Thermal Management by End-Use Segment -
        Computers, Telecom, Medical/ Office Equipment,
        Industrial/Military, Consumer Electronics, and Automotive
        Markets Independently Analyzed with Annual Sales Figures in
        US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                         112

        Table 43: European Historic Review for Electronic Thermal
        Management by End-Use Segment - Computers, Telecom,
        Medical/Office Equipment, Industrial/Military, Consumer
        Electronics, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2001
        through 2006 (includes corresponding Graph/Chart)                  113

        Table 44: European 11-Year Perspective for Electronic
        Thermal Management by End-Use Segment - Percentage Breakdown
        of Dollar Sales for Computers, Telecom, Medical/Office
        Equipment, Industrial/Military, Consumer Electronics, and
        Automotive Markets for 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         114

  16. ASIA-PACIFIC                                                         115
      A.Market Analysis                                                    115
        Current and Future Analysis                                        115
        Taiwan Market Scenario                                             115
      B.Market Analytics                                                   116
        Table 45: Asia-Pacific Recent Past, Current & Future
        Analysis for Electronic Thermal Management by End-Use
        Segment - Computers, Telecom, Medical/Office Equipment,
        Industrial/ Military, Consumer Electronics, and Automotive
        Markets Independently Analyzed with Annual Sales Figures in
        US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                         116

        Table 46: Asia-Pacific Historic Review for Electronic
        Thermal Management by End-Use Segment - Computers, Telecom,
        Medical/Office Equipment, Industrial/Military, Consumer
        Electronics, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2001
        through 2006 (includes corresponding Graph/Chart)                  117

        Table 47: Asia-Pacific 11-Year Perspective for Electronic
        Thermal Management by End-Use Segment - Percentage Breakdown
        of Dollar Sales for Computers, Telecom, Medical/Office
        Equipment, Industrial/Military, Consumer Electronics, and
        Automotive Markets for 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         118

  17. REST OF WORLD                                                        119
       Market Analysis                                                     119
        Table 48: Rest of World Recent Past, Current & Future
        Analysis for Electronic Thermal Management by End-Use
        Segment - Computers, Telecom, Medical/Office Equipment,
        Industrial/Military, Consumer Electronics, and Automotive
        Markets Independently Analyzed with Annual Sales Figures in
        US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                         119

        Table 49: Rest of World Historic Review for Electronic
        Thermal Management by End-Use Segment - Computers, Telecom,
        Medical/Office Equipment, Industrial/Military, Consumer
        Electronics, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2001
        through 2006 (includes corresponding Graph/Chart)                  120

        Table 50: Rest of World 11-Year Perspective for Electronic
        Thermal Management by End-Use Segment - Percentage Breakdown
        of Dollar Sales for Computers, Telecom, Medical/Office
        Equipment, Industrial/Military, Consumer Electronics, and
        Automotive Markets for 2005, 2010 & 2015 (includes
        corresponding Graph/Chart)                                         121


 COMPETITION

     Total Companies Profiled: 158 (including Divisions/Subsidiaries - 178)

     ------------------------------------------
     Region/Country                     Players
     ------------------------------------------
     The United States                    120
     Canada                                 4
     Japan                                  6
     Europe                                35
      France                                3
      Germany                               4
      The United Kingdom                   17
      Italy                                 5
      Spain                                 1
      Rest of Europe                        5
     Asia-Pacific (Excluding Japan)        13
     ------------------------------------------

Additional Information

Number of Pages: 570
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