It takes a lot to be successful in electronics assembly: get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 38 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.

Kit Products:

3406: Guidelines for Electrically Conductive Surface Mount Adhesives

3408: General Requirements for Anisotropically Conductive Adhesives Films

7095B: Design and Assembly Process Implementation for BGAs

7351A: Generic Requirements for Surface Mount Design and Land Pattern Standard

9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects

9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline

A-610D: Acceptability of Electronic Assemblies

A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies

C-406: Design & Application Guidelines for Surface Mount Connectors

CA-821: General Requirements for Thermally Conductive Adhesives

CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly

CM-770E: Component Mounting Guidelines for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
 
HDBK-005: Guide to Solder Paste Assessment

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-001D: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1

J-STD-003B: Solderability Tests for Printed Boards

J-STD-004B: Requirements for Soldering Fluxes

J-STD-005: Requirements for Soldering Pastes - includes Amendment 1

J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

J-STD-012: Implementation of Flip Chip & Chip Scale Technology

J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps

J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

MC-790: Guidelines for Multichip Module Technology Utilization

S-816: SMT Process Guideline & Checklist

SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

SM-784: Guidelines for Chip-on-Board Technology Implementation

SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

SM-817: General Requirements for Dielectric Surface Mounting Adhesives

T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology