It takes a lot to be successful in electronics assembly: get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620. Get the complete collection and save 55% on individual document prices.

This Kit Includes:

2611: Generic Requirements for Electronic Product Documentation
2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript
2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
3406: Guidelines for Electrically Conductive Surface Mount Adhesives
3408: General Requirements for Anisotropically Conductive Adhesives Films
7095B: Design and Assembly Process Implementation for BGAs
7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard
9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline
9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering
A-610E: Acceptability of Electronic Assemblies
A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies
C-406: Design & Application Guidelines for Surface Mount Connectors
CA-821: General Requirements for Thermally Conductive Adhesives
CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl
CM-770E: Component Mounting Guidelines for Printed Boards
D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse
HDBK-005: Guide to Solder Paste Assessment
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Incl
J-STD-003B: Solderability Tests for Printed Boards
J-STD-004B: Requirements for Soldering Fluxes
J-STD-005: Requirements for Soldering Pastes - includes Amendment 1
J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
J-STD-012: Implementation of Flip Chip & Chip Scale Technology
J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf
J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps
J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Mi
J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
MC-790: Guidelines for Multichip Module Technology Utilization
S-816: SMT Process Guideline & Checklist
SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting
SM-784: Guidelines for Chip-on-Board Technology Implementation
SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
SM-817: General Requirements for Dielectric Surface Mounting Adhesives
T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology