IPC-C-1000 creates an instant library that includes all of the C-10X segment collections, plus selected additional documents. Documents were reviewed and recommended for inclusion by IPC's technical staff. Contains 107 documents, including the widely used IPC-A-600, IPC-A-610, J-STD-001 and IPC-A-620.

Kits Products:

2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

2221A: Generic Standard on Printed Board Design

2222: Sectional Design Standard for Rigid Organic Printed Boards

2223B: Sectional Design Standard for Flexible Printed Boards

2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

2226: Sectional Design Standard for High Density Interconnect (HDI) Boards

2251: Design Guide for the Packaging of High Speed Electronic Circuits

2252: Design Guide for RF/Microwave Circuit Boards

2316: Design Guide for Embedded Passive Device Printed Boards

2615: Printed Board Dimensions and Tolerances

3406: Guidelines for Electrically Conductive Surface Mount Adhesives

3408: General Requirements for Anisotropically Conductive Adhesives Films

4101B: Specification for Base Materials for Rigid and Multilayer Printed Boards - Includes Amendments 1 & 2

4103: Specification for Base Materials for High Speed/High Frequency Applications

4104: Specification for High Density Interconnect (HDI) and Microvia Materials

4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

4202: Flexible Base Dielectrics for Use in Flexible Printed Circuitry

4203: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

4204: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

4552: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

4553: Specification for Immersion Silver Plating for Printed Circuit Boards

4554: Specification for Immersion Tin Plating for Printed Circuit Boards

4562A: Metal Foil for Printed Board Applications

4563: Resin Coated Copper Foil for Printed Boards Guideline

4761: Design Guide for Protection of Printed Board Via Structures

4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend

4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed

4821:  Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Board

5701: Users Guide for Cleanliness of Unpopulated Printed Boards

5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards

6011: Generic Performance Specification for Printed Boards

6012B: Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

6013B: Qualification and Performance Specification for Flexible Printed Boards

6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

6018A: Microwave End Product Board Inspection and Test

7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

7095B: Design and Assembly Process Implementation for BGAs

7351A: Generic Requirements for Surface Mount Design and Land Pattern Standard

7526: Stencil and Misprinted Board Cleaning Handbook

9201A: Surface Insulation Resistance Handbook

9252A: Requirements for Electrical Testing of Unpopulated Printed Boards

9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)

9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects

9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline

A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

A-600G: Acceptability of Printed Boards

A-610D: Acceptability of Electronic Assemblies

A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies

AC-62A: Aqueous Post Solder Cleaning Handbook

C-406: Design & Application Guidelines for Surface Mount Connectors

CA-821: General Requirements for Thermally Conductive Adhesives

CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes Amendment 1

CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

CH-65A: Guidelines for Cleaning of Printed Boards & Assemblies

CM-770E: Component Mounting Guidelines for Printed Boards

D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

D-325A: Documentation Requirements for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

DR-572A: Drilling Guidelines for Printed Boards

HDBK-001: Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001 B-C-D Comparisons)

HDBK-005: Guide to Solder Paste Assessment

HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) Amendent 1

HDBK-830: Guidelines for Design, Selection and Application of Conformal Coatings

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-001D: Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1

J-STD-003B: Solderability Tests for Printed Boards

J-STD-004B: Requirements for Soldering Fluxes

J-STD-005: Requirements for Soldering Pastes - includes Amendment 1

J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

J-STD-012: Implementation of Flip Chip & Chip Scale Technology

J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface

J-STD-026: Semiconductor Design Standard for Flip Chip Applications

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps

J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

MC-790: Guidelines for Multichip Module Technology Utilization

ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print

MS-810: Guidelines for High Volume Microsection

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

S-816: SMT Process Guideline and Checklist

SA-61A: Post Solder Semi-Aqueous Cleaning Handbook

SC-60A: Post Solder Solvent Cleaning Handbook

SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

SM-784: Guidelines for Chip-on-Board Technology Implementation

SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

SM-817: General Requirements for Dielectric Surface Mounting Adhesives

SM-839: Pre & Post Solder Mask Application Cleaning Guidelines

SM-840D: Qualification and Performance Specification of Permanent Solder Mask

T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology

TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress Microsectioning Evaluations for Detecting the Presence of Inner lay

TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

TR-583: An In-Depth Look At Ionic Cleanliness Testing

WP/TR-584A: White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")

WP-008: Setting Up Ion Chromatography Capability