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Flexible Printed Circuit Boards - A Global Strategic Business Report

Price:
USD $4,950.00
ISBN/SKU #:
GIA-MCP1852
Research Group:
Global Industry Analysts
Date of Publication:
February 2010
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Summary

This report analyzes the worldwide markets for Flexible Printed Circuit Boards in US$ Millions by the following end-use markets: Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical, and Packaging. The report provides separate comprehensive analytics for US, Canada, Japan, Europe, Asia-Pacific and Rest of World. Annual Production forecasts are provided for each region for the period 2007 through 2015. The report profiles 154 companies including many key and niche players worldwide such as 3M, Amphenol Corp, Benchmark Electronics, Inc., Career Technology (MFG.) Co., Ltd., Flexible Circuit Technologies, Inc., Fujikura Ltd., Hutchinson Technology, Inc., Innovex, Inc., MFS Technology Ltd., Minco Products, Inc., Molex, Inc., Multek Flexible Circuits Inc., Multi-Fineline Electronix, Inc., Nan Ya PCB Co., Ltd., Nippon Mektron, Ltd., Nitto Denko Corp., Northpoint Technologies, Inc., Parlex Corp, Si Flex Co., Ltd., Sony Chemical & Information Device Corp., Sumitomo Bakelite Co., Ltd., Sumitomo Electric Industries, Ltd., and Youngpoong Electronics Co., Ltd. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

TABLE OF CONTENTS 

FLEXIBLE PRINTED CIRCUIT BOARDS			MCP-1852
A GLOBAL STRATEGIC BUSINESS REPORT


                                       CONTENTS



  I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-2
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3


 II. EXECUTIVE SUMMARY

  1. GLOBAL OUTLOOK                                                     II-1
      Current Scenario and Outlook                                      II-1
       Asia-Pacific Continues to Dominate Global Market                 II-1
       Communications End-use Segment Leads; While Consumer
        Electronics to Post Fastest Growth                              II-1
      Japan Continues to Dominate Flexible Circuits Production;
       China Catching Up Fast                                           II-2
       Table 1: Leading Flexible and Rigid-flex Circuit Producers
       Worldwide (2007 & 2008) (In US$ Million) (includes
       corresponding Graph/Chart)                                       II-3

       Table 2: Leading Flexible Circuit Producing Countries
       Worldwide: 2007 & 2008 (includes corresponding Graph/Chart)      II-4

       Table 3: Leading Rigid-Flex Circuit Producing Countries
       Worldwide: 2007 & 2008 (includes corresponding Graph/Chart)      II-5
      Competitive Scenario                                              II-5
       Table 4: Global Flexible Printed Circuit Board Market (2007):
       Percentage Breakdown of Revenues for Nippon Mektron,
       Fujikura, Nitto Denko, 3M, M-Flex, MCS, Sony Chemical, Shindo
       Electric, Sumitomo Bakelite, Hutchinson and Others (includes
       corresponding Graph/Chart)                                       II-6
      Overview of End-Use Markets                                       II-6
       Major Applications of Flexible Printed Circuit Boards            II-6
       Automotive                                                       II-7
       Communication                                                    II-7
       Computing                                                        II-8
       Consumer Electronics                                             II-8
       Defense and Aerospace                                            II-8
       Industrial and Medical Sciences                                  II-9
       Packaging                                                        II-9
      Global PCB Industry - An Overview                                 II-9
       PCB Production Across Major Producing Nations Declines           II-9
        Table 5: Global Production of Printed Circuit Boards:
        2000-2008 (includes corresponding Graph/Chart)                  II-10

        Table 6: Leading Producers of Printed Circuit Boards (2007 &
        2008): Value Breakdown for China, Japan, Taiwan, South
        Korea, North America and Europe in US$ Millions (includes
        corresponding Graph/Chart)                                      II-10

  2. MARKET TRENDS                                                      II-11
      Increased R&D Efforts in Substrate Materials                      II-11
       List of Common Substrate Materials and Compatible Adhesives      II-11
      Polyimide Leads the FPC Substrate Materials Domain                II-11
       Demand for New Materials to Surge                                II-12
      Product Related Advantages Fuel Market Growth                     II-12
      Wireless Telecommunications Spawning Significant Demand           II-13
       Mobile Phones - A Key Application Area for Flexible Circuits     II-13
      Less Complex FPCs Dominate Global FPC Market                      II-14
       Production Relocation to Low-cost Countries                      II-14
       EMS Providers Gain Prominence                                    II-14
      Adhesiveless Laminates - Gain Popularity                          II-15

  3. PRODUCT OVERVIEW                                                   II-16
      Flexible Circuits- An Introduction                                II-16
      Introduction to Flexible Circuit Technology                       II-16
      History and Evolution of Flexible Circuits                        II-16
      Types of Flexible Circuits                                        II-17
       Single Layered Flexible Circuits                                 II-17
        Single Layered Single-Sided Flexible Circuits                   II-17
        Single Layered Double-Sided Flex Circuits                       II-17
       Multilayered Flex Circuits                                       II-18
       Rigid-Flex Circuits                                              II-18
       Other Select Types                                               II-18
        Double Access Flexible Circuits                                 II-18
        Sculptured Flex                                                 II-19
        Backplanes                                                      II-19
      Materials Used in Flexible Circuit Manufacture                    II-19
       Base Material                                                    II-19
        Polyimide                                                       II-20
        Polyester                                                       II-20
        Polyimide Vs. Polyester                                         II-21
        New Substrates                                                  II-22
       Conductor Materials                                              II-22
        Copper as a Conducting Material                                 II-22
        Non-Copper Metal Foils                                          II-23
        Promising Direct Apply Technologies                             II-23
       Adhesives                                                        II-23
        Polyester Adhesives                                             II-24
        Polyimide Adhesives                                             II-24
        Epoxies and Modified Epoxies                                    II-24
        Acrylic Adhesives                                               II-24
        Supplementary Adhesives                                         II-25
       Protective Coatings                                              II-25
        Selection of Cover-lay Film                                     II-25
         Benefits of Coverlay                                           II-25
         Benefits of Cover Coatings                                     II-26
      Manufacturing of Flexible Circuits                                II-26
       The Two Generic Methods of Manufacturing                         II-26
        Subtractive Method of Producing Flexible Circuits               II-27
         Image Resist                                                   II-27
         Resist Removal                                                 II-27
         Placement of Cover Layer                                       II-27
         Creation of Outlines and Holes                                 II-27
         Testing and Verification                                       II-28
      Key Advantages of Flexible Circuits                               II-28
       Minimization of Packaging Size                                   II-28
       Minimization of Packaging Weight                                 II-28
       Reduction in Assembly Time & Cost                                II-29
       Reduction in Assembly Error                                      II-29
       Enhancing System Reliability                                     II-29
       Other Benefits                                                   II-29

  4. PRODUCT INTRODUCTIONS                                              II-30
      IMEC Develops a Novel 3-Dimensional Flex Circuit Integration
       Process                                                          II-30
      DuPont Launches a New APR Copper Clad Resistor Laminate, Pyralux(R) II-30
      Pacothane Technologies Introduces PACOFLEX 5000                   II-30
      All Flex Develops Customized Flexible Heater circuits             II-31
      Oki Electric Cable Pioneers the Launch of a Three- Dimensional
       FPC                                                              II-31
      Oki Electric Cable Launches High-Speed Transmission Flexible
       Circuits                                                         II-31

  5. RECENT INDUSTRY ACTIVITY                                           II-32
      Midwest and Bartlett to Integrate PCB Manufacturing Businesses    II-32
      Bomin Electronics Sets-up Facility to Produce PCBs and HDI Board  II-32
      Falcon Holdings Takes Over MBM Flexible Circuits                  II-32
      Molex Acquires AFlextech                                          II-32
      FTG Corp. Inks Supply Deal with Honeywell Aerospace               II-33
      3M and Arrow Electronics Extend Distribution Agreement            II-33
      Honeywell Inks New Collaborative Agreement with the USDC          II-34
      Circuitronics Takes Over Price Printed Circuits                   II-34
      Hanita Coatings Takes Over Stakes in Cidav Printed Circuits       II-35
      Vulcan Flex Circuit Buys and Installs Real-Time X-Ray
       Inspection System, XRI-1                                         II-35
      Vulcan Flex Circuit Completes Acquisition of Polar Impedance
       Test System                                                      II-35
      Flextronics Obtains EC Clearance for Acquiring Solectron          II-36
      Molex Expands Production of Copper Flex Circuits and Assemblies   II-36
      AirBorn Takes Over StrataFlex                                     II-36
      Tohoku Fujikura to Initiate Construction of US$16.3 Million
       FPC Facility                                                     II-36
      Fair Friend Group Acquires J & T Flex                             II-37
      Cirflex Signs Agreement with PRECO                                II-37
      Nistica and Fujikura Sign a Strategic Partnership                 II-37
      ITRI Sets up First Flexible Electronics R&D Laboratory in Taiwan  II-37
      Vitex Systems Signs Strategic Partnership with Samsung America    II-37
      General Electric Takes Over GE Fuji Drives America                II-38
      Tonka Bay Completes Acquisition of All Flex Inc                   II-38

  6. FOCUS ON SELECT GLOBAL PLAYERS                                     II-39
      3M (US)                                                           II-39
      Amphenol Corp. (US)                                               II-39
      Benchmark Electronics, Inc. (USA)                                 II-40
      Career Technology (MFG.) Co., Ltd. (Taiwan)                       II-40
      Flexible Circuit Technologies, Inc. (USA)                         II-41
      Fujikura Ltd. (Japan)                                             II-41
      Hutchinson Technology, Inc. (US)                                  II-41
      Innovex, Inc. (USA)                                               II-42
      MFS Technology Ltd. (Singapore)                                   II-42
      Minco Products, Inc. (USA)                                        II-42
      Molex, Inc. (USA)                                                 II-43
      Multek Flexible Circuits Inc. (USA)                               II-43
      Multi-Fineline Electronix, Inc. (US)                              II-44
      Nan Ya PCB Co., Ltd. (Taiwan)                                     II-44
      Nippon Mektron, Ltd. (Japan)                                      II-45
      Nitto Denko Corp. (Japan)                                         II-45
      Northpoint Technologies, Inc. (USA)                               II-45
      Parlex Corp. (USA)                                                II-45
      Si Flex Co., Ltd. (South Korea)                                   II-46
      Sony Chemical & Information Device Corp. (Japan)                  II-46
      Sumitomo Bakelite Co., Ltd. (Japan)                               II-46
      Sumitomo Electric Industries, Ltd. (JAPAN)                        II-47
      Youngpoong Electronics Co., Ltd. (South Korea)                    II-47

  7. GLOBAL MARKET PERSPECTIVE                                          II-48
      By Region                                                         II-48
      Table 7: World Recent Past, Current & Future Analysis for
      Flexible Printed Circuit Board Market by Geographic Region -
      US, Canada, Japan, Europe, Asia-Pacific and Rest of World
      Markets Independently Analyzed with Annual Sales in US$
      Million for Years 2007 through 2015 (includes corresponding
      Graph/Chart)                                                      II-48

      Table 8: World Historic Analysis for Flexible Printed Circuit
      Board Market by Geographic Region - US, Canada, Japan, Europe,
      Asia-Pacific and Rest of World Markets Independently Analyzed
      with Annual Sales in US$ Million for Years 2001 through 2006
      (includes corresponding Graph/Chart)                              II-49

      Table 9: World 15-year Perspective for Flexible Printed
      Circuit Board Market by Geographic Region - Percentage
      Breakdown of Dollar Sales for US, Canada, Japan, Europe,
      Asia-Pacific and Rest of World Markets for Years 2003, 2009 &
      2015 (includes corresponding Graph/Chart)                         II-50
      By End-Use Segment                                                II-51
      Table 10: World Recent Past, Current & Future Analysis for
      Flexible Printed Circuit Board Market by End-Use Segment-
      Automotive, Communication, Computing, Consumer Electronics,
      Defense & Aerospace, Industrial/Medical and Packaging Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2007 through 2015 (includes corresponding Graph/Chart)      II-51

      Table 11: World Historic Analysis for Flexible Printed Circuit
      Board Market by End-Use Segment- Automotive, Communication,
      Computing, Consumer Electronics, Defense & Aerospace,
      Industrial/Medical and Packaging Markets Independently
      Analyzed with Annual Sales in US$ Million for Years 2001
      through 2006 (includes corresponding Graph/Chart)                 II-52

      Table 12: World 15-year Perspective for Flexible Printed
      Circuit Board Market by End-Use Segment - Percentage Breakdown
      of Dollar Sales for Automotive, Communication, Computing,
      Consumer Electronics, Defense & Aerospace, Industrial/Medical
      and Packaging Markets for Years 2003, 2009 & 2015 (includes
      corresponding Graph/Chart)                                        II-53


 III. MARKET

  1. NORTH AMERICA                                                      III-1
      Industry Overview                                                 III-1
      Flexible Circuit Production Statistics                            III-1
       Table 13: North American Flexible Circuit Production by Bare
       Circuits, and Circuit Assembly and Services: 2001 - 2008
       (includes corresponding Graph/Chart)                             III-2

       Table 14: North American Flexible Circuit Production
       (1994-2000): A Historical Perspective (includes corresponding
       Graph/Chart)                                                     III-2
      Slowdown Affects Shipments and Bookings                           III-2
      Market Participants                                               III-3

  1A. THE UNITED STATES                                                 III-4
      A.Market Analysis                                                 III-4
        Current and Future Analysis                                     III-4
        Exports & Imports                                               III-4
         Table 15: US Exports of Flexible Circuits: 2000-2008 
         (includes corresponding Graph/Chart)                           III-5
         Table 16: US Exports of Flexible Circuits by Region: 2008
         (includes corresponding Graph/Chart)                           III-5
         Table 17: US Imports of Flexible Circuits: 2000-2008 
         (includes corresponding Graph/Chart)                           III-6
         Table 18: US Imports of Flexible Circuits by Region: 2008
         (includes corresponding Graph/Chart)                           III-6
        Product Launches                                                III-7
        Strategic Corporate Developments                                III-8
        Select Players                                                  III-11
      B.Market Analytics                                                III-17
        Table 19: US Recent Past, Current & Future Analysis for
        Flexible Printed Circuit Board Market Analyzed with Annual
        Sales in US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                      III-17

        Table 20: US Historical Analysis for Flexible Printed
        Circuit Board Market Analyzed with Annual Sales in US$
        Million for Years 2001 through 2006 (includes corresponding
        Graph/Chart)                                                    III-18

  1B. CANADA                                                            III-19
      A.Market Analysis                                                 III-19
        Current and Future Analysis                                     III-19
      B.Market Analytics                                                III-19
        Table 21: Canadian Recent Past, Current & Future Analysis
        for Flexible Printed Circuit Board Market Analyzed with
        Annual Sales in US$ Million for Years 2007 through 2015
        (includes corresponding Graph/Chart)                            III-19

        Table 22: Canadian Recent Past, Current & Future Analysis
        for Flexible Printed Circuit Board Market Analyzed with
        Annual Sales in US$ Million for Years 2001 through 2006
        (includes corresponding Graph/Chart)                            III-20

  2. JAPAN                                                              III-21
      A.Market Analysis                                                 III-21
        Current and Future Analysis                                     III-21
        Japan - A Global Leader in the Production of Flexible Circuits  III-21
        FPC and PCB Production Declines in 2008                         III-21
         Table 23: Japanese Production of Bare Printed Circuit
         Boards by Type (2007 and 2008): Single and Double Sided
         Rigid PCBs, Standard Multilayer Rigid PCBs,
         HDI/Microvial/Build-Up PCBs, Flexible and Rigid Flex
         Circuits, and IC Substrates and Others (includes
         corresponding Graph/Chart)                                     III-21
        Vertical Integration Keeps Japanese Producers in the Lead       III-22
        Japan's PCB Industry Suffers; Korea and Taiwan Head Out of
         Recession                                                      III-22
        Strategic Corporate Developments                                III-22
        Select Players                                                  III-23
      B.Market Analytics                                                III-26
        Table 24: Japanese Recent Past, Current & Future Analysis
        for Flexible Printed Circuit Board Market Analyzed with
        Annual Sales in US$ Million for Years 2007 through 2015
        (includes corresponding Graph/Chart)                            III-26

        Table 25: Japanese Historical Analysis for Flexible Printed
        Circuit Board Market Analyzed with Annual Sales in US$
        Million for Years 2001 through 2006 (includes corresponding
        Graph/Chart)                                                    III-26

  3. EUROPE                                                             III-27
      A.Market Analysis                                                 III-27
        Current and Future Analysis                                     III-27
         Production of FPCs Rises in 2008; Total PCB Production Plunges III-27
          Table 26: European PCB Production by Type (2007 & 2008):
          Values for Single and Double Sided Rigid PCBs, Standard
          Multilayer Rigid PCBs, HDI/Microvial/Build-Up PCBs,
          Flexible and Rigid Flex Circuits, and IC Substrates and
          Others in US$ Million (includes corresponding Graph/Chart)    III-27

          Table 27: European PCB Production by Country (2008): Value
          Breakdown By Country (includes corresponding Graph/Chart)     III-28
        Product Launches                                                III-28
        Strategic Corporate Developments                                III-29
      B.Market Analytics                                                III-30
        Table 28: European Recent Past, Current & Future Analysis
        for Flexible Printed Circuit Board Market Analyzed with
        Annual Sales in US$ Million for Years 2007 through 2015
        (includes corresponding Graph/Chart)                            III-30

        Table 29: European Historical Analysis for Flexible Printed
        Circuit Board Market Analyzed with Annual Sales in US$
        Million for Years 2001 through 2006 (includes corresponding
        Graph/Chart)                                                    III-31

  4. ASIA-PACIFIC                                                       III-32
      A.Market Analysis                                                 III-32
        Current and Future Analysis                                     III-32
        Industry Overview                                               III-32
      B.Market Analytics                                                III-33
        Table 30: Asia-Pacific Recent Past, Current & Future
        Analysis for Flexible Printed Circuit Board Market by
        Geographic Region - China, and Rest of Asia-Pacific -
        Analyzed with Annual Sales in US$ Million for Years 2007
        through 2015 (includes corresponding Graph/Chart)               III-33

        Table 31: Asia-Pacific Historical Analysis for Flexible
        Printed Circuit Board Market by Geographical Region - China,
        and Rest of Asia-Pacific - Analyzed with Annual Sales in US$
        Million for Years 2001 through 2006 (includes corresponding
        Graph/Chart)                                                    III-34

        Table 32: Asia-Pacific 15-year Perspective for Flexible
        Printed Circuit Board Market by Geographic Region - China,
        and Rest of Asia-Pacific - for Years 2003, 2009 & 2015          III-34

  4A. CHINA                                                             III-35
      A.Market Analysis                                                 III-35
        Current and Future Analysis                                     III-35
         China - Leading Consumer of Flexible Circuits Worldwide        III-35
        China- The Second Largest Supplier of FPCs Worldwide            III-35
        FPC Production Rises in 2008                                    III-35
         Table 33: Chinese PCB Production by Product Type (2007 &
         2008): Values for Single and Double Sided Rigid PCBs,
         Standard Multilayer Rigid PCBs, HDI/ Microvial/Build-Up
         PCBs, Flexible and Rigid Flex Circuits, and IC Substrates
         and Others (includes corresponding Graph/Chart)                III-36
        Chinese Printed Circuit Board Industry - An Overview            III-37
        China Leads the Global PCB Industry                             III-37
        PCB Production in China Falls in 2009                           III-37
         Table 34: PCB Production in China (2000-2009) (includes
         corresponding Graph/Chart)                                     III-38
        Challenges Aplenty in Chinese PCB Industry                      III-38
        Strategic Corporate Developments                                III-38
      B.Market Analytics                                                III-39
        Table 35: Chinese Recent Past, Current & Future Analysis for
        Flexible Printed Circuit Board Market Analyzed with Annual
        Sales in US$ Million for Years 2007 through 2015 (includes
        corresponding Graph/Chart)                                      III-39

        Table 36: Chinese Historical Analysis for Flexible Printed
        Circuit Board Market Analyzed with Annual Sales in US$
        Million for Years 2001 through 2006 (includes corresponding
        Graph/Chart)                                                    III-39

  4B. REST OF ASIA-PACIFIC                                              III-40
      A.Market Analysis                                                 III-40
        Current and Future Analysis                                     III-40
        FPC Production Continues to Rise in Taiwan                      III-40
         Table 37: Taiwanese PCB Production by Product Type (2007 &
         2008): Value Breakdown for Single and Double Sided Rigid
         PCBs, Standard Multilayer Rigid PCBs,
         HDI/Microvial/Build-Up PCBs, Flexible and Rigid Flex
         Circuits, and IC Substrates and Others (includes
         corresponding Graph/Chart)                                     III-40
        Production of FCPs and PCBs Decline in South Korea              III-41
         Table 38: South Korean PCB Production by Product Type (2007 & 
         2008): Value Breakdown for Single and Double Sided Rigid
         PCBs, Standard Multilayer Rigid PCBs, HDI/Microvial/
         Build-Up PCBs, Flexible and Rigid Flex Circuits, and IC
         Substrates and Others (includes corresponding Graph/Chart)     III-42
        Strategic Corporate Developments                                III-42
        Select Players                                                  III-43
      B.Market Analytics                                                III-45
        Table 39: Rest of Asia-Pacific Recent Past, Current & Future
        Analysis for Flexible Printed Circuit Board Market Analyzed
        with Annual Sales in US$ Million for Years 2007 through 2015
        (includes corresponding Graph/Chart)                            III-45

        Table 40: Rest of Asia-Pacific Historical Analysis for
        Flexible Printed Circuit Board Market Analyzed with Annual
        Sales in US$ Million for Years 2001 through 2006 (includes
        corresponding Graph/Chart)                                      III-45

  5. REST OF WORLD                                                      III-46
      A.Market Analysis                                                 III-46
        Current and Future Analysis                                     III-46
      B.Market Analytics                                                III-46
        Table 41: Rest of World Recent Past, Current & Future
        Analysis for Flexible Printed Circuit Board Market Analyzed
        with Annual Sales in US$ Million for Years 2007 through 2015
        (includes corresponding Graph/Chart)                            III-46

        Table 42: Rest of World Historical Analysis for Flexible
        Printed Circuit Board Market Analyzed with Annual Sales in
        US$ Million for Years 2001 through 2006 (includes
        corresponding Graph/Chart)                                      III-47


 IV. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 154 (including Divisions/Subsidiaries - 160)

     ------------------------------------------
     Region/Country                     Players
     ------------------------------------------
     The United States                     46
     Canada                                 3
     Japan                                 14
     Europe                                60
        France                              5
        Germany                            25
        The United Kingdom                 12
        Italy                               6
        Rest of Europe                     12
     Asia-Pacific (Excluding Japan)        35
     Middle East                            2
     ------------------------------------------

 


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Number of Pages: 493

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