A system-in-a-package or system in package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically used inside a mobile phone, digital music player, etc.

This report aims to capture the market roadmap with market sizes, revenue forecasts, value chain, market and product trends, price trends and regulations, competitive landscape, leading players, and their key developments, strategies and profiles. This report also aims to analyze the market by product, application and geography.

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Other reports on the topic include the following studies.