The 2012 IC Cost and Price Model revision 1203 is now available with updated data and new features.

Introduction

IC Cost and Price Model is the industry standard for cost and price modeling of low power silicon integrated circuits. Very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

Example of product cost summary

Supported processes
The Model supports over 500 processes broken out by company and process node and looking forward one to two process nodes. See the links in the gray bar at the right for the specific list of processes.

Supported wafer sizes
100mm, 125mm, 150mm, 200mm and 300mm.

Supported cost elements
Wafer cost, wafer test, packaging and final test.

Who should buy this product
IC Cost and Price Model is widely used by IDMs, OEMs, Fabless companies, Analysts, Materials Companies, Consultants, Electronics Companies and many others. The model is used for benchmarking, evaluating pricing, market research and many other uses. Our model customers include most of the worlds largest IDMs, OEMs, Fabless and Electronics companies.

Revision History

Revision 1200 - added Samsung 27nm NAND Flash process and estimated die sizes. Added Intel 32nm die sizes. Updated Samsung 24nm Flash and DRAM processes. Added Samsung 19nm Flash process. Added TSMC 55nm - 6 Cu with Al bond pads and TSMC 90nm - 6 Cu with Al bonds pads and embedded Flash processes. Updated DL and IDL rates. Updated electric and natural gas rates.

Revision 1201 - added 200mm - 180nm - BCD for TSMC, Dongbu HiTek, Global Foundries Singapore, TowerJazz, UMC and SMIC. Fixed an error that caused maintenance costs to be under reported for fabs that bought used equipment. Adjusted SMIC labor efficiency factors. Updated packaging costs. Added UMC 40nm and 28nm processes. Added TSMC 28nm MPM processes. Updated TSMC 28nm and 40nm processes.

Revision 1202 - updated 200mm - 180nm - BCD for TSMC, Dongbu HiTek, Global Foundries Singapore, TowerJazz, UMC and SMIC processes based on new information. Added 300mm - 180nm and 130nm TI LBC8 and LBC9 processes. Added 19nm Flash die sizes. Added volume guidance on the '8 Pricing' worksheet. Adjusted the color fills on the '8 Pricing' worksheet to indicate cells than may be changed and cells that are formula driven.

Revision 1203 - added very high as a packaging volume selection. Adjusted TSMC and UMC 65nm depreciation factors to reflect the latest financial's from both. Changed the labeling on the '11 OH - Capital and Tool Maint' sheet to more accurately reflect what is in each category. Updated SMIC gross margins. Added IM Flash 20nm NAND Flash die size.

System Requirements
The Model runs inside of Microsoft Excel and requires the user to have Excel 2007 or higher installed on their computer. The model does not run in any other "Excel compatible" programs.

Model Cost and How to Buy
A single user license for one person to install the model on one computer is $2,050. An enterprise license allowing an unlimited number of users at a company is $6,970. The model is delivered by email within a few hours of our receiving an order. The cost includes twelve months of updates with phone and email support. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

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