Although IC shipments have dropped significantly in 2009, this is merely a dip in the road. Volumes have already begun to move upward again, and customers will require an ever-increasing portfolio of IC packaging materials to meet the unique needs of various products.

In its report we use information from IC packaging industry insiders to present the most realistic forecasts available regarding the IC packaging materials markets. This report covers all the critical materials found in IC packaging, as well as the newest IC packaging materials and latest research from many organizations.

Chapter 1 explains the scope and methodology of the report; Chapter 2 summarizes the IC packaging material revenue.

Chapter 3 presents NVR ’s views on the state of the semiconductor industry. This includes NVR ’s base semiconductor forecast and a review of the industry’s third-quarter results.

Chapter 4 presents the wire bonding market—including wire bonding methods, product highlights, and forecasts of bonding wire materials, wire thicknesses, and wire revenue.

Chapter 5 details the leadframe market. This chapter presents product highlights and leadframe unit and revenue forecasts by I/O count, pitch, and plating finish.

Chapter 6 presents the substrate market, including an overview of substrate types and materials, and highlights of recent developments in substrates. Forecasts are provided for substrate units, area, and revenue by package type and substrate material.

Chapter 7 gives an overview of the solder sphere market, with product highlights and forecasts of solder sphere units, price, and revenue by package family, material, and size.

Chapter 8 reviews the underfill market, with  product highlights and volume and revenue forecasts for the various types of underfill.

Chapter 9 covers the molding/encapsulation market, including product highlights and forecasts for the halogen-free transition and overall mold compound revenue.

As the future of the IC packaging materials is critical to your business, please review the report's outline on the following pages. IC Packaging Materials, 2009 Edition will provide you with the critical information you need to assess this market.

 

TABLE OF CONTENTS

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: The State of the Industry

World Economic Outlook

2009 Base Forecast

Third-Quarter Update

Chapter 4: Wire Bonding

Wire Bonding Methods

Product Highlights

Forecasts

Units by Package Family
Wire Usage by Package Family,
Wire Material, and Wire Thickness
Wire Revenue by Material

Chapter 5: Leadframes

Plating Finishes

Product Highlights

Forecasts

Units by I/O Range, Pitch, and Plating Finish

Revenue by Size and Plating Finish

Chapter 6: Substrates

Ceramic

Laminate

HDIS

Flex Tape

Embedded Passives

Thermal Substrates

Product Highlights

Forecasts

Units, Area, Revenue by Package Family

Units, Area, Revenue by Material

Chapter 7: Solder Spheres

Preformed Solder Spheres

Product Highlights

Forecasts

Total Spheres by Package Family, Size , and Material

Revenue by Material

Chapter 8: Underfill

Underfill Types

Product Highlights

Forecasts

Underfilled Packages by Package Family

Underfill by Method

Chapter 9: Molding and Encapsulation

Overview

Product Highlights

Forecasts

Mold Compound by Package Family

Mold Compound Revenue

Partial List of Figures and Tables

IC Packaging Material Revenue Summary, 2008–2013

Nominal GDP of Major Countries and Regions

Real GDP Growth for Selected Countries

IC Units and Revenue, 2008–2013

Summary IC Unit Forecast by Product, 2008–2013

Wire Bonded ICs by Package Family, 2008–2013

Bonding Wire Usage by Package Family, 2008–2013

Bonding Wire Usage by Thickness, 2008 vs. 2013

Bonding Wire Usage by Material, 2008–2013

Bonding Wire Prices and Revenue, 2008–2013

Leadframe Packages by I/O Range, 2008–2013

Leadframes Divided by Size, 2008–2013

Leadframe Pitch, 2008–2013

Leadframe Plating Finish, 2008–2013

Cost per Leadframe, 2008–2013

Total Leadframe Revenue, 2008–2013 

PGA Units by I/O Pitch, 2008–2013

BGA Units by I/O Pitch, 2008–2013

FBGA Units by I/O Pitch, 2008–2013

WLP Units by I/O Pitch, 2008–2013

PGA Substrates, 2008–2013

BGA Substrates, 2008–2013

FBGA Substrates, 2008–2013

Substrate Unit Summary, 2008–2013

Average Substrate Area by Package Type, 2008–2013

Substrate Area by Package Type, 2008–2013

Substrate Area Summary, 2008–2013

Average Substrate Price, 2008–2013

Substrate Revenue by Package Type, 2008–2013

Substrate Revenue Summary, 2008–2013

 

Solder Spheres by Package Type and

Sphere Size, 2008–2013

Solder Spheres by Material, 2008–2013

Solder Sphere Pricing by Material, 2008–2013

Solder Sphere Revenue by Material, 2008–2013

 

Underfilled Packages by Package Family, 2008–2013

Underfilled Packages by Underfill Type, 2008–2013

Underfill Quantity, 2008–2013

Price per Gram for Underfill, 2008–2013

Underfill Revenue, 2008–2013

 

Encapsulated ICs, 2008–2013

Mold Compound Usage by Package Family, 2008–2013

Mold Compound Halogen-Free Transition, 2008–2013

Mold Compound Price, 2008–2013

Mold Compound Revenue, 2008–2013

The IC packaging material products, services, and research of the following companies and organizations are interspersed throughout the report:

Advanced Component Labs
AMITEC
Amkor
ASE
Auburn University
Cicorel
CMK
Dynacraft
Eastern Company
Endicott Interconnect
Fraunhofer Institute
Henkel
Heraeus
Hitachi Chemical
Imbera Electronics
Indium
Innovex
Jet Propulsion Laboratory
Kinsus Interconnect
Kyocera
LORD
Microbonds
Mitsui High-tec
MK Electron
NAMICS
Nan Ya PCB
NEC
NEC Toppan
Nippon Micrometal
NTK
PolySciences
QPL
Rogers
Semiconductor Packaging Materials
Senju Metal
Shin-Etsu MicroSi
Shinko Electric
Simmtech
Spheretek
Sumitomo Bakelite
Tanaka Kikinzoka
Technical University Berlin
Toppan Printing
Unimicron
Zymet