The 2010 IC Packaging report describes the packaging market with key player profiles, the packaging materials market, package types and selection criteria, the packaging process, packaging technology trends, packaging costs and how to select and manage a packaging foundry. The report is 106 pages long with 52 figures and 46 tables including financial results for major packaging foundries, available JEDEC package configurations and a list of products and the packages they are available in. This report is written at an easy to understand level and includes a glossary of terminology.

Who should buy this report

Do you:

• Select and or mange packaging foundries?
• Make decisions on what type of package to use for a product?
• Need to understand differences in cost between different packages?
• Follow the packaging industry or packaging materials industry as an analyst?
• Need to have a working knowledge of the packaging industry or process as a manager?

Chapter list

• Chapter 1 - Welcome
• Chapter 2 - The Packaging Market and History - Sample Page (section from the 2004 Amkor profile)
• Chapter 3 - Package Types
• Chapter 4 - Packaging Process Overview - Sample Page (epoxy die attach)
• Chapter 5 - Packaging Materials
• Chapter 6 - Packaging Technology Trends
• Chapter 7 - Packaging Costs
• Chapter 8 - Test
• Chapter 9 - Qualification
• Chapter 10 - Selecting and Managing Packaging Foundries
• Appendix A - Package Types
• Appendix B - Package Types for Selected Products
• Appendix C - Sample Qualification Report
• Glossary

 
Table of Contents

1 Welcome
1.1 About IC Knowledge
1.2 IC Knowledge products
1.3 License
1.4 Disclaimer
1.5 Copyright
1.6 Report outline
1.7 What this report is not
1.8 About the author

2 The Packaging Market and History
2.1 Introduction
2.2 A short history of assembly services
2.3 The market size
2.4 The major packaging foundries profiles
2.5 References

3 Package Types
3.1 Introduction
3.2 In this chapter the major package families will be reviewed
3.3 JEDEC
3.4 The packaging market by package type
3.5 Package types
3.6 Shipping
3.7 Conclusion
3.8 References

4 Packaging Process Overview
4.1 Introduction
4.2 Leadframes and substrates
4.3 Packaging process

5 Packaging Materials
5.1 Introduction
5.2 Plastic Laminate Substrates
5.3 Bonding wire
5.4 Leadframes
5.5 Molding compound
5.6 Die attach
5.7 Singulation
5.8 Common Materials
5.9 Materials market by region
5.10 Conclusion
5.11 References

6 Packaging Technology Trends
6.1 Introduction
6.2 Current status
6.3 Thermal resistance and electrical inductance
6.4 Stacked die
6.5 Multichip modules (MCM)
6.6 System in package (SIP)
6.7 Tape Automated Bonding (TAB)
6.8 Green packaging
6.9 Wafer level packaging
6.10 Summary

7 Packaging Cost
7.1 Introduction
7.2 Package Costing
7.3 Cost calculations

8 Test
8.1 Introduction
8.2 Test equipment
8.3 Test Costs
8.4 Burn-in
8.5 References

9 Qualification
9.1 Introduction
9.2 Accelerated testing
9.3 Qualification facilities
9.4 Conclusion

10 Selecting and Managing Packaging Foundries
10.1 Introduction
10.2 Choosing a subcontractor
10.3 Monitoring performance

Appendix A - Package Types

Appendix B - Package Types for Selected Products

Appendix C - Sample Qualification Report

Glossary