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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
Put IPC's design library at your fingertips! The series is built around the IPC-2221, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology.
All five sectional standards are included with the series: IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards.
This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements. Buy the entire series and save up to $20 over what you would pay if you purchased each document individually.
This Kit Includes:
2221A: Generic Standard on Printed Board Design
2222A: Sectional Design Standard for Rigid Organic Printed Boards
2223B: Sectional Design Standard for Flexible Printed Boards
2224: Sectional Standard of Design of PWBs for PC Cards
2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
2226: Sectional Design Standard for High Density Interconnect (HDI) Boards
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