Loading... Please wait...Intelligent Path to Competitiveness!
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz. This guide also applies to operations in the region where distributed circuits are used instead of conventional lumped circuit elements. Released June 2002. 30 pages.
Choose a currency below to display product prices in the selected currency.
