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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
Revision A of IPC-2511 identifies the generic requirements for implementation of product manufacturing description data and transfer. IPC-2511A helps users transfer design requirements and manufacturing expectations from computer-aided design systems to computer-aided manufacturing systems for printed board fabrication, assembly and test. IPC-2511A establishes the rules and protocol of describing data for electronic transfer in a neutral format. The format is frozen until January, 2002. The code reference is BNF. GenCAM™ is documented in a series of seven major sectional standards identified as IPC-2510. 199 pages. Released January 2000.
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