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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
This standard describes the event message content specific to assembly equipment. The types of processes covered by IPC-2546 include material movement systems like conveyors and buffers, manual placement, automated screen printing, automated adhesive dispensing, automated surface mount placement, automated plated-through hole placement, forced convection and infrared reflow ovens, and wave soldering. The present version of this document includes Amendment 1 which provides the requirements for screen printing equipment. 108 pages. Released January 2003. NEW!Amendment 2 covers the Dispensing Equipment, Reflow Equipment and Final Assembly and Packaging sections of IPC-2546 and is a supplement to the standard. 131 pages. Released January 2005.
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