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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC-4104 covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC-JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC-JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.
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