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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC-4203 covers the requirements for adhesive coated dielectric film materials to be used for the cover sheets and flexible adhesive bonding films used in the fabrication of flexible printed circuitry and flexible flat cable. IPC-4203 includes the specification sheets for the adhesive coated flexible dielectric film materials, separated by material type. Closely aligned with IPC-4202 and IPC-4204. Supersedes IPC-FC-232C with Amendment 1 included and, in turn, IPC-FC-232C, IPC-FC-232B, IPC-FC-232A, IPC-FC-232 and IPC-FC-233. 45 pages. Released May 2002.
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