Loading... Please wait...
Intelligent Path to Competitiveness!
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
- Category
- Industry Standards
- IPC Specification Tree
- Printed Boards/Acceptance
- Foil
- IPC 4563 Resin Coated Copper Foil for Printed Boards Guideline
Summary
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007. Included in the IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
Find Similar Products by Category
Currency Converter
Choose a currency below to display product prices in the selected currency.
Add to Wish List
You Recently Viewed...
All prices are in USD. Copyright 1997-2012 Electronics.ca Publications.
|
Electronics.ca™ is a global research network serving the industry, corporations and investment banks. |
