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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
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| Laminate |
| Interface Design |
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Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC-6013B covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, plated-through holes (PTH) and blind/buried vias. Revision B incorporates updated requirements for surface plating, measles, foreign inclusions, adhesive squeeze-out, solderable annular ring, PTH copper wrap, plating folds, microsection evaluations, acceptance testing frequency and more. Supersedes IPC-6013A with Amendment 2. For use with IPC-6011. 45 pages. Released January 2009.
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