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IPC 6801 IPC JPCA Terms and Definitions, Test Methods, and Design Examples for Buld Up High Density Interconnect (HDI) Printed Wiring Boards

Price:
USD $72.00
ISBN/SKU #:
IPC-6801
Research Group:
IPC
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Summary

Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC-JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC-JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs. 32 pages. Released January 2000.

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