Major update for lead free support and enhanced inspection guidelines for repairs and modifications!

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B-7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures. This section includes procedures common to rework, repair and modification. Part 2 is IPC-7711B and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components. Part 3 is IPC-7721B and includes procedures for modifying assemblies and accomplishing laminate can conductor repairs. Supersedes IPC-7711, IPC-7721 and IPC-R-700. Over 300 pages. Released November 2007. Major update for lead free support and enhanced inspection guidelines for repairs and modifications! Revision B.