IPC-9502 document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC-JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders. 12 pages. Released April 1999. Preview the table of contents .pdf file.Included in manual M-109 and the E-500 Collection.