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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC-AJ-820 contains descriptions of proven techniques for assembly and soldering. Individual articles were developed by noted industry experts and reviewed by a standing committee. Sections include: terms and definitions; specification references and synopsis; design; printed wiring boards; component-lead types; joining materials; component mounting; solderability; joining techniques and packaging; cleaning and coating; and quality assurance and testing. Not available in electronic format. 336 pages. Released April 1997.
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