Here are the latest standards addressing the dimensioning, tolerancing, qualifying and performance aspects of rigid printed boards. An in-depth focus on solderability testing, plating requirements, conductor thickness and lot acceptance makes this document set an invaluable tool for anyone requiring the design and performance characteristics of rigid printed boards. Includes 41 documents. Save 55% on individual document prices.

This Kit Includes:

1601: Printed Board Handling and Storage Guidelines
2152: Standard for Determining Current Carrying Capacity in Printed Board Design
2221A: Generic Standard on Printed Board Design
2222A: Sectional Design Standard for Rigid Organic Printed Boards
2226: Sectional Design Standard for High Density Interconnect (HDI) Boards
2251: Design Guide for the Packaging of High Speed Electronic Circuits
2252: Design Guide for RF/Microwave Circuit Boards
2316: Design Guide for Embedded Passive Device Printed Boards
2611: Generic Requirements for Electronic Product Documentation
2614: Sectional Requirements for Board Fabrication Documentation
2615: Printed Board Dimensions and Tolerances
4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards (English)
4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
4552: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
4553A: Specification for Immersion Silver Plating for Printed Boards
4554: Specification for Immersion Tin Plating for Printed Circuit Boards
4562A: Metal Foil for Printed Board Applications
4563: Resin Coated Copper Foil for Printed Boards Guideline
4761: Design Guide for Protection of Printed Board Via Structures
4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend
4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed
4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe
6011: Generic Performance Specification for Printed Boards
6012C: Qualification and Performance Specification for Rigid Printed Boards
6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De
6018A: Microwave End Product Board Inspection and Test
7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard
9252A: Requirements for Electrical Testing of Unpopulated Printed Boards
9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Tes
A-600H: Acceptability of Printed Boards
D-325A: Documentation Requirements for Printed Boards
DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
DR-572A: Drilling Guidelines for Printed Boards
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
J-STD-003B: Solderability Tests for Printed Boards
ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print
MS-810: Guidelines for High Volume Microsection
SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat
T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress
TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Print