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IPC C 106 Printed Board Design Standards Collection

Price:
USD $642.00
ISBN/SKU #:
IPC-C-106
Research Group:
IPC
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Summary

As a designer considering physical design principles, customer reliability requirements and surface mount and high-speed logic design, this new manual set provides an excellent compilation of standards essential to your library. Sharp focus is brought to bear on such aspects of printed board technology as high density interconnects, flexible printed board design, controlled impedance and Design for Reliability (DFR) procedures.

This Kit Includes:

2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

2152: Standard for Determining Current Carrying Capacity in Printed Board Design

2221A: Generic Standard on Printed Board Design

2222A: Sectional Design Standard for Rigid Organic Printed Boards

2223B: Sectional Design Standard for Flexible Printed Boards

2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

2226: Sectional Design Standard for High Density Interconnect (HDI) Boards

2251: Design Guide for the Packaging of High Speed Electronic Circuits

2252: Design Guide for RF/Microwave Circuit Boards

2316: Design Guide for Embedded Passive Device Printed Boards

2611: Generic Requirements for Electronic Product Documentation

2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript

2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

2614: Sectional Requirements for Board Fabrication Documentation

4761: Design Guide for Protection of Printed Board Via Structures

7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard

D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

D-325A: Documentation Requirements for Printed Boards

D-326A: Information Requirements for Manufacturing Printed Circuit Board

s and Other Electronic Asse

D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

J-STD-026: Semiconductor Design Standard for Flip Chip Applications

J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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