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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC CF 152B covers the requirements for copper-invar-copper (CIC), copper-molybdenum- copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data for each type of composite metallic materials. 39 pages. Revised March 1998.
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