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- IPC CI 408 Design and Application Guidelines for the Use of Solderless Surface Mount Connectors
Summary
IPC-CI-408 provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994. Preview the table of contents .pdf file.Included in manual M-106 and the E-500 Collection.
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