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- IPC DD 135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
Summary
IPC-DD-135 standard includes qualification and requirements for deposited organic interlayer dielectric materials for MCM-D applications. This standard enables a vendor to evaluate dielectric materials and express properties in a uniform format. In addition, guidelines are given for reporting history of specimen processing. 42 pages. Released August 1995.
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