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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
Both of the industry's standards for computing DPMO are now bundled together at a reduced cost. IPC-7912, Calculation of DPMO and Manufacturing Indices for Printed Board Assemblies, is the standard for benchmarking end-item DPMO and IPC-9261, In-Process DPMO and Estimated Yield for PWAs, defines the process for evaluating any stage in the assembly process. IPC-7912 is 13 pages. Released July 2000. IPC-9261 is 14 pages. Released March 2002.
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