Now updated to Revision D of the latest IPC-A-610 and J-STD-001 - our Training and Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. With only 38 pages, and at a compact 5.5 x 8.5 inch size, these convenient spiral-bound manuals make it easy for your inspectors and operators to make the right solder joint acceptance decisions - for all three classes of product. Useful as a training aid in the classroom or on the shop floor, DRM-SMT-D contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints. Each drawing clearly shows the minimum acceptable condition for each type of component misalignment; and details all of the specifications for minimum - maximum solder joint size, including fillet heights and lengths.

DRM-SMT-D also contains high quality color microphotographs of the major solder defects and conditions, such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead free solder connections. The appropriate specification - paragraph references from both the IPC-A-610D and J-STD-001D are included for each of the acceptance criteria for further verification. In addition, every change from the C to D revision has been notated to make it easy for your inspectors and operators to learn the new requirements.