This textbook provides the most up-to-date information and statistics available on the reliability of lead-free solder interconnects. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a momentous amount of research and development has been conducted in recent years on the manufacturing issues to facilitate the conversion to lead-free solders, data from related studies to the reliability of lead-free solder interconnects are still up-and-coming. Practitioners in the electronics industry who need to understand the reliability of solder interconnects for design, testing, quality assurance, and failure analysis will benefit. It also will be of great value to industry and academic researchers, educators, and students. This textbook is published by ASM International and edited by Dr. Dongkai Shangguan. 292 pages. Released May 2006.