This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999.Preview the table of contents .pdf file. Equivalent to IEC Publicly Available Specification (PAS) 62191Included in the E-500 Collection.